AXA263361P [PANASONIC]
PCB Connector, Socket, ROHS COMPLIANT;
| 型号： | AXA263361P |
| 厂家： | 
PANASONIC |
| 描述： | PCB Connector, Socket, ROHS COMPLIANT PC 连接器 |
| 文件： | 总10页 (文件大小：730K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Discontinued products (
)
UPPER/LOWER METAL SHELL
CONSTRUCTION FOR SUPERIOR
SOCKETS FOR SD MEMORY
CARD (SUPPORTS SDIO)
DURABILITY AND EVEN BETTER ABILITY
TO WITHSTAND STATIC ELECTRICITY
7. Compliance with RoHS’ Directive
Environmentally friendly, the connectors’
comply with Europe’s RoHS’ Directive.
Cadmium, lead, mercury, hexavalent,
chromium, PBB and PBDE are not used.
FEATURES
1.Triple contact construction for
improved prevention of minute circuit
cutoff from dropping.
The terminals in the power supply section
have been made with triple contacts.This
construction means that there will be no
circuit cutoff over 0.1 µs even if the device
is dropped.
2. Robustness and resistance to ESD
and EMI have been fortified using
upper and lower metal shells.
The socket is effective against EDS and
EMI, since both the front and back of the
card are covered with metal when
mounted. Also, since a more robust
design is possible compared to single-
sided plastic molding, the influence of
reflow heat is reduced.
Porosity treatment
PCB cut-off type
This treatment consists in coating the sur-
face with a very thin film to seal pinholes in
the gold plating. We have developed this
porosity treatment technology, which en-
sures contact reliability for thin gold plating
comparable to that of thick gold plating.
Porosity treatment membrane
Pin hole
Ambient gas
Gold plating
Standard mounting type Reverse mounting type
SDIO grand tab contact
supported (supports SDIO)
Double spring
Nickel plating
Base material
Metal shell
3. Constructed with double spring and
horseshoe shaped slider
• Since the entire bottom of the card
pushes the slider, the right-to-left balance
is good, which allows smooth insertion
and removal.
4. Porosity treatment achieves a high
contact reliability.
5.Thinnest socket in its class at 2.7
mm
• Improved insertion and removal reliability
• Improved resistance to corrosion
• Improved contact reliability for digital signals
APPLICATIONS
Starting with products in the IT field that
use SD memory cards such as digital
cameras, PDAs and IC recorders, you
can also use this socket in the automotive
and household appliances fields in such
products as car navigation systems and
microwave ovens.
Metal shell
Horseshoe shaped slider
Triple contact
structure
Thickness of standoff type is 4.2 mm
(including 1.5 mm standoff).
6. Simple card lock (prevents card
from falling out)
Compliance with RoHS Directive
http://www.mew.co.jp/ac/e/
ORDERING INFORMATION
AXA
2
3
1
2: Sockets for SD memory card (supports SDIO)
<Board mounting direction>
6: Reverse type (outside terminal)
7: Standard type (outside terminal)
<Eject type>
3: Push-push type
<Stand off height>
0: 0 mm
7: –0.7 mm
3: 1.5 mm
4: 1.6 mm
5: 1.8 mm
<Function>
2: Without card jump-out prevention function 6: With card jump-out prevention function
With card presence detection SW
With write protect detection SW
With card presence detection SW
With write protect detection SW
<Terminal/Positioning boss>
1: SMD terminal/with positioning boss
<Packing>
T: 35 pcs. tray package × 20 trays
P: 350 pcs. embossed tape and paper reel package × 2 reels
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
Discontinued products (
)
(AXA2)
PRODUCT TYPES
Card
Packing quantity
Standoff
height
(mm)
Card
jump-out
prevention
function
Product name
Eject type
Mounting type
Part No.
detection
Inner carton
Outer carton
0
AXA273021∗
AXA273321∗
AXA263021∗
AXA263321∗
AXA263421∗
AXA263521∗
On board mounting
standard type
1.5
0
Not
available
1.5
1.6
1.8
On board mounting
reverse type
Asterisk “∗” mark on end of
Part No.;
P: 350 pieces (1 reel)
(Embossed tape package)
T: 35 pieces (1 tray)
(Tray package)
Asterisk “∗” mark on end of
Part No.;
P: 700 pieces (2 reels)
(Embossed tape package)
T: 700 pieces (20 trays)
(Tray package)
PCB cut-off
standard type
–0.7
AXA273721∗
Sockets for
SD memory card
(Supports SDIO)
Push-push
type
Available
0
AXA273061∗
AXA273361∗
AXA263061∗
AXA263361∗
AXA263461∗
AXA263561∗
On board mounting
standard type
1.5
0
1.5
1.6
1.8
On board mounting
reverse type
Available
PCB cut-off
standard type
–0.7
AXA273761∗
SPECIFICATIONS
Characteristics
Item
Specifications
Condition
Rated Current
0.5 A/1 terminal
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 120mΩ
Measured with the HP4338B, except for the resistance of the
cable.
Contact resistance
Electrical
characteristics
Insulation resistance Min. 1,000MΩ (Initial)
Using 500V DC megger (applied for 1 min.)
Rated voltage is applied for one minute and check for short
circuit or damage with a detection current of 1 mA.
Breakdown voltage
500V AC for 1 min.
Frequency: 10 to 55 Hz
Acceleration: 20.0 m/s2
No current interruption for more than 0.1 µs
Vibration resistance
Card insertion force
Insertion and
Mechanical
characteristics
Max. 40N
Insertion and removal life: 10,000 times
Contact resistance after testing:
Lifetime
Insertion and removal speed are at a rate of 200 times/hour
or less.
characteristics removal life of card
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 120mΩ
Ambient temperature –25°C to +90°C
No freezing or condensation in low temperatures
No freezing or condensation in low temperatures
Sockets (shell) surface temperature for using infrared reflow
–40°C to +90°C (The allowable storage temperature is –40°C to
+50°C if unopened from original packaging)
Storage temperature
Resistance to
Environmental
Reflow soldering: peak temperature 250°C or less
Hand soldering: Soldering iron temperature 300°C, 5 sec. or less soldering machine
soldering heat
characteristics
Contact resistance:
MIL-STD-1344A, METHOD 1002
Temperature: 40 2°C, Humidity: 90 to 95%RH,
Test time: 500 hours
Humidity tolerance
(mated condition)
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 120mΩ
Insulation resistance: Min. 100 MΩ
Applicable memory card
Unit weight
SDIO card, SD memory card/Multi-media card
2.95g
Note: Please consult us for card falling out prevention mechanism.
2. Material and surface treatment
Portion
Material
Surface
—
Earth shell
Lock pin
Coil spring
Body
Stainless steel
Heat resistant resin (UL94V-0)
Copper alloy
—
Slider
Contact portion: Ni plating on base, Au plating on surface
Soldering portion: Ni plating on base, Au plating on surface
Signal contact
Detection contact
Contact/Soldering portion: Ni plating on base, Au plating on surface
Soldering portion: Cu plating on base, Sn plating on surface
AXA273721 soldering part: Au and partial Pd plating over Ni
Retention solder tab (with earth shell)
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
Discontinued products (
)
(AXA2)
DIMENSIONS (Unit: mm)
1. On board mounting standard type (outside terminals)
Part No.
AXA273021∗
Circuit schematic
AXA273061∗ (with card jump-out prevention function)
No.
No.
1
2
No.
No.
3
4
1.00
20.15
19.15
17.50
2.675
1.00
2.70
2.50
9.375
0.625
0.15
Terminal
coplanarity
Contact construction
0.60
Lot No.
Part No.
Card center
SD memory card
12.90
13.55
13.80
13.30
13.95
(14.40)
(2.10)
0.80
28.20
17.50
1.65 0.1
2.50 0.1 (Contact pitch)
0.625 0.1
General tolerance: 0.2
Detailed internal view
View of set card
Recommended PC board pattern (TOP VIEW)
2
1.00 0.05
20.15 0.05
19.15 0.05
17.50 0.05
2.675 0.05
4
1
3
2.50 0.05 (Pitch)
1.00 0.05
0.625 0.05
0.70 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
1.00 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
: Recommended pattern
7.475
8.575
10.65
10.375
11.05
forbidden area
(entire inside)
: Pattern forbidden
area
1.60
1.725
(24.00)
2.30
SD memory card
(15.40)
(30.20)
Through hole
PC board both side
Socket edge
Substrate edge
12.00 0.0 12.40 0.05
12.70 0.0 13.10 0.05
2.45 0.05
1.05 0.05
2.45 0.05
1.05 0.05
: Pattern forbidden area.
(Because part of the contact is close to the substrate,
avoid the pattern arrangement.)
: Recommended pattern forbidden area.
(Because part of the earth shell are close to the substrate,
we recommend that you avoid the pattern arrangement.)
Relation of detection switches to
SD memory card attachment condition
Write protect switch
Card attachment
Card
detection
switch
Write
Write
condition
unable
enable
Card not
attached
Open
Open
Open
Open
Card attached
Terminal number
Closed
Closed
1–2
3–4
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
Discontinued products (
)
(AXA2)
2. On board mounting standard type with standoff (1.5 mm) (outside terminals)
Part No.
AXA273321∗
Circuit schematic
AXA273361∗ (with card jump-out prevention function)
No.
No.
1
2
No.
No.
3
4
1.00
20.15
19.15
17.50
(4.20)
2.675
1.00
2.50
9.375
2.70
0.625
0.15
Terminal
coplanarity
Contact construction
0.60
(Stand-off
dimensions)
1.50
Part No.
Lot No.
Card center
SD memory card
13.30
13.95
(14.40)
12.90
13.55
13.80
(2.10)
2.30
28.20
17.50
1.65 0.1
2.50 0.1 (Contact pitch)
0.625 0.1
10.00
11.40
1.40
0.80
1.40
0.80
8.95
10.80
General tolerance: 0.2
Detailed internal view
View of set card
Recommended PC board pattern (TOP VIEW)
1.00 0.05
2
20.15 0.05
19.15 0.05
17.50 0.05
4
1
2.675 0.05
1.00 0.05
2.50 0.05 (Pitch)
3
0.625 0.05
0.70 0.05
: Pattern forbidden
area
1.00 0.05
2.20
2.20
8.95
10.00
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
11.00
1.60
1.60
10.40
Rib to prevent
card ejection
: Pattern forbidden
area
(24.00)
SD memory card
Through hole
Socket edge
Substrate edge
PC board both side
2.45 0.05
1.05 0.05
12.00 0.05
12.70 0.05
12.40 0.05
13.10 0.05
2.45 0.05
1.05 0.05
: Pattern forbidden area.
(Because part of the contact is close to the substrate,
avoid the pattern arrangement.)
Relation of detection switches to
SD memory card attachment condition
Write protect switch
Card attachment
Card
detection
switch
Write
Write
condition
unable
enable
Card not
attached
Open
Open
Open
Open
Card attached
Terminal number
Closed
Closed
1–2
3–4
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
Discontinued products (
)
(AXA2)
3. On board mounting reverse type (outside terminals)
Part No.
AXA263021∗
Circuit schematic
AXA263061∗ (with card jump-out prevention function)
No.
No.
1
2
No.
No.
3
4
2.675
1.00
20.15
19.15
1.00
17.50
2.50
9.375
2.70
0.625
0.15
Terminal
coplanarity
Contact construction
0.60
A direction
Card center
SD memory card
13.30
13.95
(14.40)
12.90
13.55
13.80
0.70
(2.10)
28.20
17.50
(Contact pitch) 2.50 0.1
1.65 0.1
0.625 0.1
General tolerance: 0.2
Internal view on arrow from A direction
View of set card
Recommended PC board pattern (TOP VIEW)
4
20.15 0.05
19.15 0.05
17.50 0.05
1.00 0.05
2
1
2.675 0.05
1.00 0.05
2.50 0.05 (Pitch)
0.625 0.05
3
0.70 0.05
1.00 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
(15.40)
(30.20)
: Recommended
attern forbidden area
(whole surface)
(24.00)
SD memory card
Socket edge
Substrate edge
Through hole
PC board both side
2.45 0.05
1.05 0.05
12.40 0.05
13.10 0.05
12.00 0.05
12.70 0.05
2.45 0.05
1.05 0.05
: Recommended pattern forbidden area.
(Because part of the earth shell are close to the substrate,
we recommend that you avoid the pattern arrangement.)
Relation of detection switches to
SD memory card attachment condition
Write protect switch
Card attachment
Card
detection
switch
Write
Write
condition
unable
enable
Card not
attached
Open
Open
Open
Open
Card attached
Terminal number
Closed
Closed
1–2
3–4
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
Discontinued products (
)
(AXA2)
4. On board mounting reverse type with standoff (1.5 mm) (outside terminals)
Part No.
AXA263321∗
Circuit schematic
AXA263361∗ (with card jump-out prevention function)
No.
No.
1
2
No.
No.
3
4
2.675
1.00
20.15
19.15
1.00
(4.20)
17.50
2.50
9.375
2.70
0.625
0.15
Terminal
coplanarity
Contact construction
0.60
A direction
Card center
SD memory card
13.30
12.90
13.55
13.80
(2.10)
13.95
2.30
(14.40)
28.20
17.50
1.65 0.1
(Contact pitch) 2.50 0.1
0.625 0.1
0.60
General tolerance: 0.2
Internal view on arrow from A direction
View of set card
Recommended PC board pattern (TOP VIEW)
2
20.15 0.05
19.15 0.05
17.50 0.05
1.00 0.05
4
1
2.675 0.05
1.00 0.05
3
2.50 0.05 (pitch)
0.625 0.05
0.70 0.05
1.00 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
(24.00)
SD memory card
Through hole
PC board both side
Socket edge
Substrate edge
3.45 0.05
1.05 0.05
11.60 0.05
13.10 0.05
11.20 0.05
12.70 0.05
3.45 0.05
1.05 0.05
Relation of detection switches to
SD memory card attachment condition
Write protect switch
Card attachment
Card
detection
switch
Write
Write
condition
unable
enable
Card not
attached
Open
Open
Open
Open
Card attached
Terminal number
Closed
Closed
1–2
3–4
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
Discontinued products (
)
(AXA2)
5. On board mounting reverse type with standoff (1.6 mm) (outside terminals)
Part No.
AXA263421∗
Circuit schematic
AXA263461∗ (with card jump-out prevention function)
No.
No.
1
2
No.
No.
3
4
2.675
1.00
20.15
19.15
1.00
(4.20)
17.50
2.50
9.375
2.70
0.625
0.15
Terminal
coplanarity
Contact construction
0.60
A direction
Card center
SD memory card
13.30
13.95
(14.40)
12.90
13.55
13.80
(2.10)
2.30
1.65 0.1
28.20
17.50
(Contact pitch) 2.50 0.1
0.625 0.1
0.60
General tolerance: 0.2
Internal view on arrow from A direction
View of set card
Recommended PC board pattern (TOP VIEW)
2
20.15 0.05
19.15 0.05
17.50 0.05
1.00 0.05
4
1
2.675 0.05
1.00 0.05
3
0.625 0.05
2.50 0.05 (pitch)
0.70 0.05
1.00 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
(24.00)
SD memory card
Through hole
PC board both side
Socket edge
Substrate edge
3.45 0.05
1.05 0.05
11.60 0.05
13.10 0.05
11.20 0.05
12.70 0.05
3.45 0.05
1.05 0.05
Relation of detection switches to
SD memory card attachment condition
Write protect switch
Card attachment
Card
detection
switch
Write
Write
condition
unable
enable
Card not
attached
Open
Open
Open
Open
Card attached
Terminal number
Closed
Closed
1–2
3–4
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
Discontinued products (
)
(AXA2)
6. On board mounting reverse type with standoff (1.8 mm) (outside terminals)
Part No.
AXA263521∗
Circuit schematic
AXA263561∗ (with card jump-out prevention function)
No.
No.
1
2
No.
No.
3
4
2.675
1.00
20.15
19.15
1.00
17.50
(4.50)
2.50
9.375
2.70
0.625
0.15
Terminal
coplanarity
Contact construction
0.60
A direction
Card center
SD memory card
13.30
13.95
(14.40)
12.90
13.55
13.80
(2.10)
2.60
1.65 0.1
28.20
17.50
(Contact pitch) 2.50 0.1
0.60
0.625 0.1
General tolerance: 0.2
Internal view on arrow from A direction
View of set card
Recommended PC board pattern (TOP VIEW)
2
20.15 0.05
19.15 0.05
17.50 0.05
1.00 0.05
4
1
2.675 0.05
1.00 0.05
3
0.625 0.05
2.50 0.05 (pitch)
0.70 0.05
1.00 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
0.85 0.05
(24.00)
SD memory card
Through hole
PC board both side
Socket edge
Substrate edge
3.45 0.05
1.05 0.05
11.60 0.05
13.10 0.05
11.20 0.05
12.70 0.05
3.45 0.05
1.05 0.05
Relation of detection switches to
SD memory card attachment condition
Write protect switch
Card attachment
Card
detection
switch
Write
Write
condition
unable
enable
Card not
attached
Open
Open
Open
Open
Card attached
Terminal number
Closed
Closed
1–2
3–4
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
Discontinued products (
)
(AXA2)
7. PCB cut-off standard type (outside terminals)
Part No.
AXA273721∗
Circuit schematic
AXA273761∗ (with card jump-out prevention function)
No.
No.
1
2
No.
No.
3
4
2.70
2.00
1.00
19.15
17.50
2.675
1.00
0.15
Terminal coplanarity
0.7
9.375
2.50
Contact construction
Part No.
Lot No.
Card center
14.40
13.80
(15.10)
28.20
(30.80)
24.10
17.50
1.65 0.1
2.50 0.1
(Contact pitch)
30.80 0.15
General tolerance: 0.2
Detailed internal view
View of set card
Recommended PC board pattern (TOP VIEW)
2
2.00 0.05
4
2.675 0.05
19.15 0.05
17.50 0.05
1
3
1.00 0.05
0.85 0.05
0.50 0.05
0.70 0.05
0.85 0.05
0.50 0.05
9.375 0.0
1.00 0.05
2.50 0.05
1.00 0.05
0.85 0.05
0.50 0.05
0.85 0.05
0.50 0.05
Rib to prevent
card ejection
(24.00)
SD memory card
Through hole
0.40 0.05
1.20 0.05
Socket edge
Substrate
edge
Relation of detection switches to
SD memory card attachment condition
(14.30)
15.20 0.05
15.60 0.05
Write protect switch
Card attachment
Card
detection
switch
Write
unable
Write
enable
condition
(29.20)
31.00 0.05
Card not
attached
31.80 0.05
Open
Open
Open
Open
Card attached
Terminal number
Closed
Closed
1–2
3–4
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
Discontinued products (
)
(AXA2)
mm
EMBOSSED TAPE AND REEL
• Tape dimensions
• Reel dimensions
Socket for SD memory card
Emboss
carrier tape
(44.4+2
)
0
Taping reel
Top cover tape
Top cover
tape
Tape
1.50+00.1 dia.
Emboss carrier tape
Cavity
Label
(20.20)
(40.40)
(44.00 0.3)
(1.75)
NOTES
1. Regarding the design of PC board
patterns
4. Cleaning after soldering
2) The sockets are constructed to prevent
reverse card insertion. Caution is
required because repeated, mistaken
reverse insertion may damage the socket
and card.
3) When not soldered, be careful not to
insert and remove the socket's card.
Doing so will cause a decrease in
anchoring ability of the mated part and
loss of coplanarity.
4) Forcibly removing a fitted card may
degrade the card removal prevention
lock. To remove a card, be sure to push
the card in the insertion direction to
release the slider lock before pulling out
the card.
Inside the socket there is a slider section
and card detection contact/write
protection mechanism. If anything such
as flux remains inside after washing,
insertion and removal will be hampered
and contact will be faulty. Therefore, do
not use methods that involve submersion
when cleaning. (Partial cleaning of the
PCB and soldered terminals is possible.)
5. After PC board mounting
1) Warping of the PC board should be no
more than 0.03 mm for the entire
connector length.
2) When assembling PCBs or storing
them in block assemblies, make sure that
undue weight is not exerted on a stacked
connector.
3) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
6. Handling single components
1) Make sure not to drop or allow parts to
fall from work bench
2) Be cautious when handling because
excessive force applied to the terminals
will cause deformation and loss of
terminal coplanarity.
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Regarding the socket mounting
1) When reflow soldering when the slider
is locked, heat will cause the slider to
deform and not work. Therefore, please
confirm that the slider lock is released
before mounting if you have inserted and
removed a card before soldering.
2) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
3. Soldering
1) Reflow soldering
• Screen-printing method is
recommended for cream solder printing.
• Use the recommended foot pattern for
cream solder printing (screen thickness:
0.15 mm).
• Use the recommended reflow
temperature profile conditions shown on
the right for infrared reflow soldering.
8. Device design
1) Contact failure may result if dust or dirt
enters the contact section. Please take
appropriate measures when designing
the device to prevent this from
happening, for example by adding a
cover.
2) To ensure smooth insertion and
removal of cards, please design the
chassis so that no force is applied to the
metal shell on top of the socket. If a force
is present that pushes down on the metal
shell, the card will be pressed, which
might prevent ejection.
3) Please provide a guide or similar to
keep the socket from having force applied
to it when inserting and removing.
9. Others
If you coat the PCB after soldering for
insulation and to prevent wear, make sure
that the coating does not adhere to the
socket.
Temperature
Peak temperature
3) Repeated bending of the terminals
may break them.
7. Card fitting
1) These products are made for the
design of compact and lightweight
devices and therefore the molded part is
very thin. For this reason, design the
device to prevent undue wrenching forces
from being applied to the product during
use.
250°C max.
180 to 200°C
Preheating
155 to 165°C
60 to 120 sec.
Within 30 sec.
Time
• Measure the temperature at the
connector surface.
2) Hand soldering
• Set the soldering tip to 300°C, and
solder for no more than 5 seconds.
Regarding general notes, please refer
to page 12.
For other details, please verify with the
product specification sheets.
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