AXA473061P [PANASONIC]
PCB Connector, Socket, ROHS COMPLIANT;
| 型号： | AXA473061P |
| 厂家： | 
PANASONIC |
| 描述： | PCB Connector, Socket, ROHS COMPLIANT PC |
| 文件： | 总6页 (文件大小：430K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1.78-mm thick sockets with superior
robustness and EMI resistance achieved
by the double-sided metal shell
SOCKET FOR
microSD™ CARD
Low-profile high-reliability socket
FEATURES
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1.The double-sided metal shell and
laser welding provides superior
robustness and EMI resistance.
When a card is inserted, both sides of the
card are covered with the metal shield,
which offers superior EMI resistance.
The shell also allows for more robust
design than that with the single-sided
resin-molded shell, reducing effects of
the reflow heat.
2.The twin contact power terminals
offer superior contact reliability.
Compared to single contact terminals,
the twin contact structure used in the
power terminals reduces the possibility of
sudden power cut-down.
What’s a microSD™ card?
The microSD™ card is an ultra-miniature
memory card that is completely compatible
with the TransFlash card, which is increas-
ingly adopted mainly by mobile phones.
The microSD™ card is a new-generation
memory card certified by the SD Card
Association, which is an organization for
standardizing SD cards, in July 2005 as a
successor to the TransFlash card.
On board mounting
standard type
Dimensions of the microSD™ card:
11.0 (W) × 15.0 (H) × 1.0 (D) mm
Approx. 7% by volume
SD memory card
of the SD memory card
Approx. 20% of the miniSD™ card
miniSD™ card
PCB cut-off
reverse type
3.The PCB cut-off reverse type has
achieved the ultra-low height from the
board surface of 0.83 mm.
Contributes to the reduction of the
target equipment’s thickness.
* Possible only with the PCB cut-off reverse type.
APPLICATIONS
Mobile phones, etc. that uses
microSD™ card.
Mobile phones and compact portable
On board mounting
reverse type
The PCB cut-off reverse type is the type
in which the socket fits into an area cut
out from the PC board. Including the PC
board, the reduced overall thickness
allows for the lowest possible profile.
devices, etc.
Metal clip
Metal clip
Compliance with RoHS Directive
Board
Socket body
Board
4.The detection accuracy shall not be
affected by the card thickness.
The detection switch detects a card in the
card insertion direction.
Highly reliable detection is possible
regardless of variations in card
dimension, material, and manufacturing
method. (NC contact)
5. Jump-out protection mechanisms
6. Fully compatible with T-Flash card
Matsushita Electric Works, Ltd.
http://www.mew.co.jp/ac/e/
(AXA4)
ORDERING INFORMATION
AXA
4
3
P
4: Sockets for microSD™ card
<Board mounting direction>
6: Reverse type (outside terminal)
7: Standard type (outside terminal)
<Eject type>
3: Push-push type
<Stand off height>
0: Not available (0.05 mm)
7: –0.95 mm (for PCB cut-off type)
<Function>
(Card jump-out prevention function/Card presence detection switch/RF terminal)
Card jump-out
prevention function
Card presence
detection switch
RF terminal
5
6
Available
Available
Available
Available
Available
Not available
<Terminal/Retention fitting/Positioning boss>
Signal terminal
SMD
Retention fitting
Positioning bosses
1
2
4
SMD
SMD
DIP
With positioning bosses
Without positioning bosses
Without positioning bosses
SMD
SMD
<Packing>
P: Embossed tape
PRODUCT TYPES
Card
Packing quantity
Card
jump-out
Product name
Eject type
Positioning bosses
RF terminal
Mounting type
Part No.
detection prevention
function
Inner carton Outer carton
With positioning bosses
AXA473061P
AXA473062P
AXA463754P
AXA463764P
AXA463051P
AXA463052P
AXA463061P
AXA463062P
Onboardmounting
standard type
Not available
Without positioning bosses
Available
PCB cut-off
reverse type
—
Not available
Sockets for
microSD™ card
Push-push
type
1,000 pieces 2,000 pieces
Available
Available
(1 reel)
(2 reels)
With positioning bosses
Without positioning bosses
With positioning bosses
Without positioning bosses
Available
Onboardmounting
reverse type
Not available
SPECIFICATIONS
1. Characteristics (Performance when microSD™ card is mated. Based on microSD™ card specification Ver. 1.0.)
Item
Specifications
Condition
Rated voltage
Rated current
3.6V DC
0.5A DC/1 terminal
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 500mΩ
Min. 1,000MΩ
Measured based on the HP4338B measurement method
of JIS C 5402
Electrical
characteristics
Contact resistance
Insulation resistance
Breakdown voltage
Using 500V DC megger (applied for 1 min.)
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1 mA.
500V AC for 1 min.
Frequency: 10 to 55 Hz
Vibration resistance
Card locking force
Acceleration: 20.0 m/s2{2.0G}
No current interruption for more than 0.1 µs
Mechanical
characteristics
Max. 40N {4.08kgf}
Mechanical life: 10,000 times
After testing:
Contact resistance: Max. 40mΩ (Change from the initial value)
Insulation resistance: Max. 100MΩ
Lifetime
characteristics
Insertion and removal
life of card
Insertion and removal speed are at a rate of 500 times/
hour or less.
Ambient temperature
Storage temperature
–25°C to +85°C
No freezing or condensation in low temperatures
No freezing or condensation in low temperatures
–40°C to +85°C (The allowable storage temperature is –40°C to
+50°C if unopened from original packaging)
Reflow soldering: peak temperature 260°C or less
Manual soldering: soldering iron tip temperature 300°C,
5 sec. or less
Environment
characteristics
Resistance to soldering
heat
Sockets (shell) surface temperature for using infrared
reflow soldering machine
Applicable memory card
Unit weight
microSD™ card (based on specification Ver. 1.10) and Trans Flash card
0.65g
Matsushita Electric Works, Ltd.
http://www.mew.co.jp/ac/e/
(AXA4)
2. Material and surface treatment
Portion
Material
Surface
Contact portion: Ni plating on base, PdNi plating + Au flash plating on surface
Soldering portion: Ni plating on base, Au plating on surface
Signal contact
Copper alloy
Contact portion: Ni plating on base, PdNi plating on surface
Soldering portion: Ni plating on base, Au plating on surface
Detection contact
Retention fittings
Copper alloy
Stainless steel
Soldering portion: Au + Pd plating on surface
The CAD data of the products with a CAD Data mark can be downloaded from: http://www.mew.co.jp/ac/e
DIMENSIONS (Unit: mm)
1. On board mounting standard type (outside terminal) Without RF terminal
14.00
0.90×11=9.90 0.1
5.40 0.1
Part No.
1.78
1.30 0.1
0.05
AXA473061P (With positioning bosses)
AXA473062P (Without positioning bosses)
Terminal coplanarity
0.10
0.90 0.1
13-0.40 0.05
CAD Data
Z
0.60
Card detection switch contact condition chart
Card attachment condition
Card not attached
Card attached
Card detection switch
Part No. and lot No.
Closed
Open
With positioning bosses: AXA473061
Without positioning bosses: AXA473062
Terminal number
(A)-(B)
(0.15)
13.85 0.1
Tolerance: 0.2
unless otherwise specified
Pin arrangement
View of set card
Recommended PC board pattern (TOP VIEW)
5.40
1.30
0.90×10=9.00
4.50
0.90
: Pattern insulation
is recommended
(whole area)
0.50
0.30
0.90
11×0.60
Signal contacts
: Pattern
forbidden area
(R)
Center of the socket
Center of the card
microSD™ card
0.40
2-Hole
Not necessary for
AXA473062
(0.65)
5.73
3.13
12.40
13.85
PCB
1.25
1.25
: Pattern insulation is recommended
(The sockets have a double-sided metal shell.
When locating a wiring pattern beneath a socket,
ensure adequate insulation of the pattern.)
* Pins No. 9 and 10 are dummy contacts.
Dimensional tolerance of PC boards: 0.05
Matsushita Electric Works, Ltd.
http://www.mew.co.jp/ac/e/
(AXA4)
2. PCB cut-off reverse type (outside terminal) With RF terminal
Part No.
AXA463754P
(1.60)
1.30
0.40
0.90×11=9.90 0.1
1.78
5.40
(From the PCB top surface: 0.83)
(From the PCB bottom surface: 0.95)
Pitch: 0.90 0.1
12-0.40 0.05
0.10
Terminal
coplanarity
CAD Data
0.63
0.80
Z
Card detection switch contact condition chart
Card attachment condition
Card not attached
Card attached
Card detection switch
Closed
0.60
14.00
16.30 0.1
0.83
Part No. and lot No.
Open
Tolerance: 0.2
unless otherwise specified
Terminal number
(A)-(B)
Pin arrangement
View of set card
Recommended PC board pattern (TOP VIEW)
(1.85)
0.90×11=9.90
5.40
Pitch: 0.90
12-0.60
(1.60)
Signal contacts
R0.50
(R)
(0.65)
Center of the socket
Center of the card
(R)
microSD™ card
(R)
14.50
1.25
0.45
14.90
15.70
1.25
0.45
Dimensional tolerance of PC boards: 0.05
3. PCB cut-off reverse type (outside terminal) Without RF terminal
Part No.
AXA463764P
(1.60)
1.30
0.40
0.90×11=9.90 0.1
1.78
5.40
(From the PCB top surface: 0.83)
Pitch: 0.90 0.1
(From the PCB bottom surface: 0.95)
12-0.40 0.05
0.10
CAD Data
Terminal coplanarity
0.63
0.80
Z
Card detection switch contact condition chart
Card attachment condition
Card not attached
Card attached
Card detection switch
Closed
0.60
14.00
16.30 0.1
0.83
Part No. and lot No.
Open
Tolerance: 0.2
Terminal number
(A)-(B)
unless otherwise specified
Pin arrangement
View of set card
Recommended PC board pattern (TOP VIEW)
(1.85)
0.90×11=9.90
12-0.60
5.40
Pitch: 0.90
(1.60)
Signal contacts
R0.50
(R)
(0.65)
Center of the socket
Center of the card
(R)
(R)
microSD™ card
0.80
Between the board
and the card surface
14.50
1.25
0.45
14.90
15.70
1.25
0.45
(0.42)
microSD™ card
* Pins No. 9 and 10 are dummy contacts.
Dimensional tolerance of PC boards: 0.05
http://www.mew.co.jp/ac/e/
Matsushita Electric Works, Ltd.
(AXA4)
4. On board mounting reverse type (outside terminal) With RF terminal
1.30 0.1
0.90 pitch×11=9.90 0.1 (1.60)
Part No.
1.78
5.40
(0.05: Stand off)
Terminal coplanarity
AXA463051P (With positioning bosses)
AXA463052P (Without positioning bosses)
Pitch: 0.90 0.1
13-0.40 0.05
0.10
CAD Data
Z
Card detection switch contact condition chart
Card attachment condition
Card not attached
Card attached
Card detection switch
Tolerance: 0.2
unless otherwise specified
0.60 0.1
14.00
Closed
Part No. and lot No.
Open
With positioning bosses: AXA463051
Without positioning bosses: AXA463052
Terminal number
(A)-(B)
(1.00)
12.00 0.1
Pin arrangement
View of set card
Recommended PC board pattern (TOP VIEW)
(14.00)
1.30
9.90
5.40
0.30
11-0.60
Pitch: 0.90
0.50
0.90
Signal contacts
2-Hole
(R)
0.40
R1.00
4.95
12.00
: Pattern insulation is recommended
microSD™ card
1.25
6.25
(The sockets have a double-sided metal shell.
When locating a wiring pattern beneath a socket,
ensure adequate insulation of the pattern.)
PCB
1.25
12.65
Dimensional tolerance of PC boards: 0.05
5. On board mounting reverse type (outside terminal) Without RF terminal
1.30 0.1
0.90 pitch×11=9.90 0.1 (1.60)
5.40
Part No.
1.78
(0.05: Stand off)
Terminal coplanarity
Pitch: 0.90 0.1
13-0.40 0.05
AXA463061P (With positioning bosses)
AXA463062P (Without positioning bosses)
0.10
CAD Data
Z
Card detection switch contact condition chart
Card attachment condition
Card not attached
Card attached
Card detection switch
0.60 0.1
14.00
Tolerance: 0.2
unless otherwise specified
Part No. and lot No.
Closed
Open
With positioning bosses: AXA463061
Without positioning bosses: AXA463062
Terminal number
(A)-(B)
(1.00)
12.00 0.1
Pin arrangement
View of set card
Recommended PC board pattern (TOP VIEW)
(14.00)
9.90
1.30
5.40
0.30
11-0.60
0.90
Pitch:0.90
0.50
Signal contacts
2-Hole
(R)
Center of the socket
0.40
Center of the card
microSD™ card
(0.65)
R1.00
12.00
: Pattern insulation is recommended
4.95
6.25
microSD™ card
1.25
PCB
(The sockets have a double-sided metal shell.
When locating a wiring pattern beneath a socket,
ensure adequate insulation of the pattern.)
1.25
12.65
* Pins No. 9 and 10 are dummy contacts.
Dimensional tolerance of PC boards: 0.05
http://www.mew.co.jp/ac/e/
Matsushita Electric Works, Ltd.
(AXA4)
EMBOSSED TAPE AND REEL (Unit: mm)
• Tape dimensions
• Reel dimensions (Conforming to EIAJ ET-7200B)
24.0 0.3
Emboss
carrier tape
11.5
(1.75)
Top cover
tape
Taping reel
(24.0 1)
Top cover tape
Tape
Emboss carrier tape
Cavity
Label
NOTES
1. Regarding the design of PC board
patterns
4. Cleaning after soldering
3) When not soldered, be careful not to
insert and remove the socket's card.
Doing so will cause a decrease in
anchoring ability of the mated part and
loss of coplanarity.
4) Forcibly removing a fitted card may
degrade the card removal prevention
lock. To remove a card, be sure to push
the card in the insertion direction to
release the lock before pulling out the
card.
Inside the socket there is a slider section
and card detection contact/write
protection mechanism. If anything such
as flux remains inside after washing,
insertion and removal will be hampered
and contact will be faulty. Therefore, do
not use methods that involve submersion
when cleaning. (Partial cleaning of the
PCB and soldered terminals is possible.)
5. After PC board mounting
1) Warping of the PC board should be no
more than 0.03 mm for the entire
connector length.
2) When assembling PCBs or storing
them in block assemblies, make sure that
undue weight is not exerted on a stacked
socket.
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Regarding the socket mounting
1) When reflow soldering when the slider
is locked, heat will cause the slider to
deform and not work. Therefore, please
confirm that the slider lock is released
before mounting if you have inserted and
removed a card before soldering.
2) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
8. Device design
1) Contact failure may result if dust or dirt
enters the contact section. Please take
appropriate measures when designing
the device to prevent this from
happening, for example by adding a
cover.
3. Soldering
1) Reflow soldering
• Screen-printing method is
3) Be sure not to allow external pressure
to act on sockets when assembling PCBs
or moving in block assemblies.
6. Handling single components
1) Make sure not to drop or allow parts to
fall from work bench
2) Be cautious when handling because
excessive force applied to the terminals
will cause deformation and loss of
terminal coplanarity.
2) To ensure smooth insertion and
removal of cards, please design the
chassis so that no force is applied to the
metal shell on top of the socket. If a force
is present that pushes down on the metal
shell, the card will be pressed, which
might prevent ejection.
3) Please provide a guide or similar to
keep the socket from having force applied
to it when inserting and removing.
9. Others
recommended for cream solder printing.
• Use the recommended foot pattern for
cream solder printing (screen thickness:
0.12 mm).
• When applying the different thickness of
a screen, please consult us.
• Use the recommended reflow
temperature profile conditions shown on
the below.
3) Repeated bending of the terminals
may break them.
7. Card fitting
Recommended reflow temperature
If you coat the PCB after soldering for
insulation and to prevent wear, make sure
that the coating does not adhere to the
socket.
profile conditions
1) The socket’s molded part is partly
thinned to achieve the smaller and lighter
design. Therefore, carefully design the
target device’s housing to prevent the
excessively twisted card insertion/
removal and insertion in a slanted
direction.
2) The sockets are constructed to prevent
reverse card insertion. Caution is
required because repeated, mistaken
reverse insertion may damage the socket
and card.
Temperature
Peak temperature
260°C max.
200°C
Preheating
150 to 175°C
For other details, please verify with
the product specification sheets.
60 to 120 sec.
70 sec.
Time
• The temperature must be measured on
the surface of the PC board around the
connector terminals.
2) Hand soldering
Set the soldering tip to 300°C, and solder
for no more than 5 seconds.
Matsushita Electric Works, Ltd.
http://www.mew.co.jp/ac/e/
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