AXE416124 [PANASONIC]

Card Edge Connector, 16 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT;
AXE416124
型号: AXE416124
厂家: PANASONIC    PANASONIC
描述:

Card Edge Connector, 16 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COMPLIANT

PC 连接器
文件: 总6页 (文件大小:404K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Ultra-low profile,  
Mated height: 0.6 mm,  
Width: 3.0 mm,  
NARROW PITCH (0.4 mm)  
For Board-to-FPC  
CONNECTORS  
Space-saving  
ADVANCED SERIES A4F  
FEATURES  
1. 0.6 mm mating height ultra-low  
profile two-piece connectors  
2. Space-saving (3.0 mm widthwise)  
The required space is smaller than our  
F4 series (40-contact type):  
3. Ultra-low profile and high resistance  
to various environments achieved by  
the “  
with high contact reliability  
Ni barrier  
construction  
Bellows contact  
construction  
Socket — 40% smaller,  
Header — 43% smaller  
(Tough against solder rise!)  
(Tough against dropping!)  
Socket  
Header  
The small size contributes to the  
miniaturization of target equipment.  
Porosity  
treatment  
(Tough against  
corrosive gases!)  
Clips  
(soldering terminal)  
at the four corners  
Compliance with RoHS Directive  
Suction face: 0.8mm  
Socket  
V notch and Double contact constructions  
(Tough against foreign particles and flux!)  
Clips  
(soldering terminal)  
at the four corners  
4.The simple lock structure for good  
mating/unmating operation feel.  
5.The gull-wing-shaped terminals  
facilitate imaging inspections.  
6. Connectors for inspection available  
(See page 36 for details.)  
Suction face: 1.1mm  
Header  
APPLICATIONS  
Compact and thin portable devices  
“Cellular phones, Digital cameras and  
DVC, etc”  
ORDERING INFORMATION  
AXE  
1
2
4
3: Narrow Pitch Connector A4F (0.4 mm pitch) Socket  
4: Narrow Pitch Connector A4F (0.4 mm pitch) Header  
Number of contacts (2 digits)  
Mated height  
<Socket> / <Header>  
1: For mated height 0.6 mm  
Functions  
2: Without positioning bosses  
Surface treatment (Contact portion / Terminal portion)  
<Socket>  
4: Ni plating on base, Au plating on surface (for Ni barrier available)  
<Header>  
4: Ni plating on base, Au plating on surface  
panasonic-electric-works.net/ac  
AXE3, 4  
PRODUCT TYPES  
Part number  
Packing  
Mated height  
Number of contacts  
Socket  
Header  
Inner carton (1-reel)  
Outer carton  
10  
12  
14  
16  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
50  
54  
60  
64  
70  
80  
AXE310124  
AXE312124  
AXE314124  
AXE316124  
AXE320124  
AXE322124  
AXE324124  
AXE326124  
AXE328124  
AXE330124  
AXE332124  
AXE334124  
AXE336124  
AXE338124  
AXE340124  
AXE342124  
AXE344124  
AXE350124  
AXE354124  
AXE360124  
AXE364124  
AXE370124  
AXE380124  
AXE410124  
AXE412124  
AXE414124  
AXE416124  
AXE420124  
AXE422124  
AXE424124  
AXE426124  
AXE428124  
AXE430124  
AXE432124  
AXE434124  
AXE436124  
AXE438124  
AXE440124  
AXE442124  
AXE444124  
AXE450124  
AXE454124  
AXE460124  
AXE464124  
AXE470124  
AXE480124  
0.6mm  
5,000 pieces  
10,000 pieces  
Notes: 1. Order unit:  
For mass production: in 1-inner carton (1-reel) units  
Samples for mounting check: in 50-connector units. Please contact our sales office.  
Samples: Small lot orders are possible. Please contact our sales office.  
2. The above part numbers are for connectors without positioning bosses, which are standard.When ordering connectors with positioning bosses, please contact our  
sales office.  
3. Please contact us for connectors having a number of contacts other than those listed above.  
SPECIFICATIONS  
Characteristics  
Item  
Specifications  
0.3A/contact (Max. 5 A at total contacts)  
60V AC/DC  
Conditions  
Rated current  
Rated voltage  
No short-circuiting or damage at a detection current of 1 mA  
when the specified voltage is applied for one minute.  
Electrical  
characteristics  
Breakdown voltage  
Insulation resistance  
Contact resistance  
150V AC for 1 min.  
Min. 1,000M(initial)  
Max. 90mΩ  
Using 250V DC megger (applied for 1 min.)  
Based on the contact resistance measurement method  
specified by JIS C 5402.  
Composite insertion force  
Composite removal force  
Max. 1.200N/contacts × contacts (initial)  
Min. 0.165N/contacts × contacts  
Mechanical  
characteristics  
Contact holding force  
(Socket contact)  
Measuring the maximum force.  
As the contact is axially pull out.  
Min. 0.20N/contacts  
Ambient temperature  
–55°C to +85°C  
No freezing at low temperatures. No dew condensation.  
Peak temperature: 260°C or less (on the surface of  
the PC board around the connector terminals)  
Infrared reflow soldering  
Soldering heat resistance  
300°C within 5 sec. 350°C within 3 sec.  
Soldering iron  
–55°C to +85°C (product only)  
Storage temperature  
No freezing at low temperatures. No dew condensation.  
Sequence  
1. –553 °C, 30 minutes  
2. ~ , Max. 5 minutes  
3. 85+30 °C, 30 minutes  
4. ~ , Max. 5 minutes  
–40°C to +50°C (emboss packing)  
0
5 cycles,  
insulation resistance min. 100M,  
contact resistance max. 90mΩ  
Thermal shock resistance  
(header and socket mated)  
Environmental  
characteristics  
120 hours,  
insulation resistance min. 100M,  
contact resistance max. 90mΩ  
Humidity resistance  
(header and socket mated)  
Bath temperature 40 2°C,  
humidity 90 to 95% R.H.  
24 hours,  
insulation resistance min. 100M,  
contact resistance max. 90mΩ  
Saltwater spray resistance  
(header and socket mated)  
Bath temperature 35 2°C,  
saltwater concentration 5 1%  
H2S resistance  
(header and socket mated)  
48 hours,  
contact resistance max. 90mΩ  
Bath temperature 40 2°C, gas concentration 3 1 ppm,  
humidity 75 to 80% R.H.  
Lifetime  
characteristics  
Repeated insertion and removal speed of max. 200 times/  
hours  
Insertion and removal life  
30 times  
Unit weight  
20-contact type: Socket: 0.01 g Header: 0.01 g  
panasonic-electric-works.net/ac  
AXE3, 4  
Material and surface treatment  
Part name  
Material  
Surface treatment  
Molded  
portion  
LCP resin  
(UL94V-0)  
Contact portion: Base: Ni plating Surface: Au plating  
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)  
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).  
Metal clips: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips)  
Headers: Base: Ni plating Surface: Au plating (except the terminal tips)  
Contact and  
Post  
Copper alloy  
The CAD data of the products with a CAD Data mark can be downloaded from: http://panasonic-electric-works.net/ac  
DIMENSIONS (Unit: mm)  
Socket (Mated height: 0.6 mm)  
CAD Data  
Dimension table (mm)  
Number of contacts/  
dimension  
A
B
C
A
Terminal coplanarity  
0.08  
B 0.1  
0.57  
10  
12  
14  
16  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
50  
54  
60  
64  
70  
80  
4.5  
4.9  
1.6  
2.0  
2.4  
2.8  
3.6  
4.0  
4.4  
4.8  
5.2  
5.6  
6.0  
6.4  
6.8  
7.2  
7.6  
8.0  
8.4  
9.6  
10.4  
11.6  
12.4  
13.6  
15.6  
3.4  
3.8  
0.40 0.05  
0.15 0.03  
(Contact and clips  
(soldering terminal))  
5.3  
4.2  
5.7  
4.6  
6.5  
5.4  
6.9  
5.8  
7.3  
6.2  
7.7  
6.6  
8.1  
7.0  
(0.86)  
Y note  
Z note  
8.5  
7.4  
8.9  
7.8  
9.3  
8.2  
9.7  
8.6  
0.30 0.03  
C 0.1  
10.1  
10.5  
10.9  
11.3  
12.5  
13.3  
14.5  
15.3  
16.5  
18.5  
9.0  
9.4  
9.8  
General tolerance: 0.2  
10.2  
11.4  
12.2  
13.4  
14.2  
15.4  
17.4  
Note: Since the clip (soldering terminal) has a single-piece construction,  
sections Y and Z are electrically connected.  
Dimension table (mm)  
Header (Mated height: 0.6 mm)  
Number of contacts/  
dimension  
CAD Data  
A
B
C
Terminal coplanarity  
A
0.46  
B 0.1  
0.40 0.05  
0.15 0.03  
0.08  
10  
12  
14  
16  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
50  
54  
60  
64  
70  
80  
3.8  
4.2  
1.6  
2.0  
2.4  
2.8  
3.6  
4.0  
4.4  
4.8  
5.2  
5.6  
6.0  
6.4  
6.8  
7.2  
7.6  
8.0  
8.4  
9.6  
10.4  
11.6  
12.4  
13.6  
15.6  
3.2  
3.6  
(Post and clips  
(soldering terminal))  
4.6  
4.0  
5.0  
4.4  
5.8  
5.2  
6.2  
5.6  
6.6  
6.0  
7.0  
6.4  
7.4  
6.8  
7.8  
7.2  
8.2  
7.6  
Clip (soldering terminal)  
8.6  
8.0  
9.0  
8.4  
9.4  
8.8  
9.8  
9.2  
0.15 0.03  
C 0.1  
10.2  
10.6  
11.8  
12.6  
13.8  
14.6  
15.8  
17.8  
9.6  
10.0  
11.2  
12.0  
13.2  
14.0  
15.2  
17.2  
General tolerance: 0.2  
Socket and Header are mated  
Header  
Socket  
panasonic-electric-works.net/ac  
AXE3, 4  
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact types, sockets and headers)  
Specifications for taping  
Specifications for the plastic reel  
(In accordance with JIS C 0806-1990. However, not applied to  
(In accordance with EIAJ ET-7200B.)  
the mounting-hole pitch of some connectors.)  
Tape I  
Tape II  
(A 0.30)  
(A 0.30)  
(B)  
Taping reel  
D 1  
(C)  
(C)  
(1.75)  
(1.75)  
Top cover tape  
Embossed carrier tape  
Embossed mounting-hole  
Dimension table (Unit: mm)  
Type/Mated height  
Number of contacts  
Type of taping  
Tape I  
A
B
C
D
Quantity per reel  
5,000  
24 or less  
26 to 70  
80  
16.0  
24.0  
32.0  
7.5  
17.4  
25.4  
33.4  
Common for sockets  
and headers  
0.6 mm  
Tape II  
11.5  
14.2  
5,000  
Tape II  
28.4  
5,000  
Connector orientation with respect to embossed tape feeding direction  
Type  
Direction  
of tape progress  
Common for A4F  
Header  
Socket  
Note: There is no indication on this product regarding top-bottom or left-right orientation.  
panasonic-electric-works.net/ac  
CONNECTOR FOR INSPECTION  
USAGE APPLICATIONS WITH  
3,000 INSERTION AND  
NARROW PITCH CONNECTORS  
ADVANCED SERIES A4F  
(0.4 mm PITCHES) FOR INSPECTION USAGE  
REMOVAL TIMES  
FEATURES  
APPLICATIONS  
1. 3,000 insertion and removals (when  
as recommended)  
Ideal for module unit inspection and  
equipment assembly inspection  
2. Same external dimensions and foot  
pattern as standard type.  
3. Improved mating  
Socket  
Header  
Insertion and removal have become  
easier due to a reduction in the mating  
retention force required by the simple  
locking structure and also in the amount  
of force needed for insertion and  
removal. (We cannot warrant anything  
regarding mating retention.)  
Compliance with RoHS Directive  
TABLE OF PRODUT TYPES  
: Available for sale  
Product name  
Number of contacts  
10  
12  
14  
16  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
50  
54  
60  
64  
70  
80  
A4F  
for inspection  
Notes: 1. Please inquire about numbers of contacts other than those given above.  
2. Please inquire with us regarding delivery times.  
3. Please keep the minimum unit for ordering no less than 50 pieces per lot.  
4. Please inquire for further information.  
PRODUCT TYPES  
Specifications  
Part No.  
Specifications  
Without positioning bosses  
Part No.  
Socket  
Without positioning bosses  
AXE3E∗∗26  
Header  
AXE4E∗∗26  
Note: When placing an order, substitute the “” (asterisk) in the above part number with the number of contacts for the required connector.  
NOTES  
If extra resistance to drop impact is  
required, we recommend using our F4  
series.  
• Socket (Mated height: 0.6 mm)  
Recommended PC board pattern (TOP VIEW)  
• Header (Mated height: 0.6 mm)  
Recommended PC board pattern (TOP VIEW)  
0.40 0.03  
0.23 0.03  
0.40 0.03  
0.23 0.03  
Recommended PC board and metal  
mask patterns  
Appropriate control of solder amount is  
required to minimize solder bridges and  
other defects for connectors with 0.4-mm  
or 0.5-mm pitch terminals, which require  
high-density mounting. Refer to the right-  
hand drawing for recommended patterns.  
0.90 0.03  
0.45 0.03  
0.80 0.03  
1.45 0.03  
: Insulation area  
Recommended metal mask opening pattern  
Recommended metal mask opening pattern  
Metal mask thickness: When 120µm  
Metal mask thickness: When 120µm  
(Terminal opening ratio: 70%)  
(Terminal opening ratio: 70%)  
(Metal-part opening ratio: 100%)  
(Metal-part opening ratio: 100%)  
0.40 0.01  
0.20 0.01  
0.40 0.01  
0.20 0.01  
0.90 0.01  
1.45 0.01  
0.45 0.01  
0.80 0.01  
For other details, please verify with  
the product specification sheets.  
panasonic-electric-works.net/ac  
NOTES FOR USING ADVANCED SERIES  
NARROW-PITCH CONNECTORS (Common)  
Connector mounting  
• Consult us when using a screen-printing  
thickness other than that recommended.  
• Depending on the size of the connector  
being used, self alignment may not be  
possible. Accordingly, carefully position  
the terminal with the PC board pattern.  
• The recommended reflow temperature  
profile is given in the figure below  
Do not insert or remove the  
connector when it is not soldered.  
Also, forcibly applied external  
In case the connector is picked up by  
chucking during mounting, an excessive  
mounter chucking force may deform the  
molded or metal part of the connector.  
Consult us in advance if chucking is to be  
applied.  
pressure on the terminals can weaken  
the adherence of the terminals to the  
molded part or cause the terminals to  
lose their evenness.  
When cutting or bending the PC  
board after mounting the connector,  
be careful that the soldered sections  
are subjected to excessive forces.  
Soldering  
1) Manual soldering.  
Recommended reflow temperature profile  
• Due to the low profile, if an excessive  
amount of solder is applied to this  
product during manual soldering, the  
solder may creep up to near the contact  
points, or interference by solder may  
cause imperfect contact.  
Upper limit (Soldering heat resistance)  
Lower limit (Solder wettability)  
Temperature  
Peak temperature  
260°C  
Do not the soldered areas to be subjected to forces  
230°C  
220°C  
200°C  
Preheating  
180°C  
150°C  
25 sec.  
70 sec.  
60 to 120 sec.  
• Make sure that the soldering iron tip is  
heated within the temperature and time  
limits indicated in the specifications.  
• Flux from the solder wire may adhere to  
the contact surfaces during soldering  
operations. After soldering, carefully  
check the contact surfaces and clean off  
any flux before use.  
• Be aware that a load applied to the  
connector terminals while soldering may  
displace the contact.  
• Thoroughly clean the iron tip.  
2) Reflow soldering  
Notes when using a FPC.  
Time  
• When the connector is soldered to an  
FPC board, during its insertion and  
removal procedures, forces may be  
applied to the terminals and cause the  
soldering to come off. It is recommended  
to use a reinforcement board on the  
backside of the FPC board to which the  
connector is being connected. Make sure  
that the reinforcing plate is larger than the  
outline of the recommended PC board  
pattern (Outline + approx. 1 mm). The  
reinforcing plate is made of SUS, glass  
epoxy or polyimide that is 0.2 to 0.3 mm  
thick.  
This connector employs a simple locking  
structure. However, the connector may  
come off depending on the size and  
weight of the FPC, layout and reaction  
force of FPC, or by drop impact. Make  
sure to fully check the equipment’s  
condition. To prevent any problem with  
loose connectors, adopt measures to  
prevent the connector from coming off  
inside the equipment.  
• The temperature is measured on the  
surface of the PC board near the  
connector terminal.  
• Some solder and flux types may cause  
serious solder creeping. Take the solder  
and flux characteristics into consideration  
when setting the reflow soldering  
conditions.  
• When performing reflow soldering on  
the back of the PC board after reflow  
soldering the connector, secure the  
connector using, for example, an  
adhesive (Double reflow soldering on the  
same side is possible)  
3) Reworking on a soldered portion  
• Finish reworking in one operation.  
• For reworking of the solder bridge, use  
a soldering iron with a flat tip. Do not add  
flux, otherwise, the flux may creep to the  
contact parts.  
• Use a soldering iron whose tip  
temperature is within the temperature  
range specified in the specifications.  
Do not drop the product or handle it  
carelessly. Otherwise, the terminals  
may become deformed due to  
excessive force or the solderability  
during reflow soldering may degrade.  
• Screen-printing is recommended for  
printing paste solder.  
To determine the relationship between  
the screen opening area and the PC-  
board foot pattern area, refer to the  
diagrams in the recommended patterns  
for PC boards and metal masks. Make  
sure to use the terminal tip as a reference  
position when setting.  
Avoid an excessive amount of solder  
from being applied, otherwise,  
interference by the solder will cause an  
imperfect contact.  
Other Notes  
When coating the PC board after  
soldering the connector to prevent the  
deterioration of insulation, perform the  
coating in such a way so that the coating  
does not get on the connector.  
Terminal  
Paste  
solder  
PC board  
foot pattern  
The connectors are not meant to be used  
for switching.  
For other details, please verify with  
the product specification sheets.  
panasonic-electric-works.net/ac  

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