AXJ53312G [PANASONIC]
Telecom and Datacom Connector, 5 Contact(s), Female, Right Angle, Surface Mount Terminal, Receptacle, ROHS COMPLIANT;
| 型号： | AXJ53312G |
| 厂家： | 
PANASONIC |
| 描述： | Telecom and Datacom Connector, 5 Contact(s), Female, Right Angle, Surface Mount Terminal, Receptacle, ROHS COMPLIANT 连接器 |
| 文件： | 总5页 (文件大小：340K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Discontinued as of September 30, 2010
ROBUST RECEPTACLE
STRUCTUREWITHSTANDS
ROUGH HANDLING
BY USERS
Micro USB (AXJ5)
CONNECTORS
FEATURES
w
Ne
1. Compatible with the Micro USB
standards
4. Structure to prevent reverse
insertion of a plug
Compatible with the new-generation USB
connector standard, which was officially
announced at the USB Implementers
Forum in January 2007
The Micro USB standard requires that
the AB type receptacle prevents plugs
from being inserted in reverse orientation
with a resin part in its mating section.
The reinforced joint between our
receptacle shell and body is also
resistant to a plug’s reverse insertion
force.
2. Resistant to twisting
These connectors have two metal pegs
added to the foot pattern recommended
by the Micro USB connector standards to
ensure secure fixing to PC boards. Also,
the shell is made of stainless steel, and
its seam has two dovetail joints, which
provides higher resistance to the force
applied for opening the seam.
3. Resistant to forcible insertion of a
plug
APPLICATIONS
Interface portion of mobile phones
and digital consumer products (e.g.
DSC, DVC and Music players, etc.)
The large crimped parts at the rear of the
receptacle shell securely hold the
receptacle body, providing high
resistance to the forcible insertion of a
plug.
Compliance with RoHS Directive
ORDERING INFORMATION
AXJ
5
3
1
G
5: Micro USB connectors
<Receptacle>
3: Receptacle
<Composition>
3: Micro B right angle type
6: Micro AB right angle type
<Installation type, With/without the shell mating guide>
1: Standard type, with the shell mating guide
<Terminal shape, Pegs (retention fitting) shape and Positioning bosses>
2: Terminal portion: SMD, Pegs (retention fitting):
SMD and Positioning bosses: without positioning bosses
4: Terminal portion: SMD, Pegs (retention fitting):
DIP and Positioning bosses: without positioning bosses
<Package>
G: Embossed tape packaging
PRODUCT TYPES
Packing quantity
Pegs
(retention fitting)
Type
Terminal shape
SMD terminal
Positioning bosses
Part number
Inner carton (1 reel) Outer carton (2 reels)
SMD
DIP
AXJ53312G
AXJ53314G
AXJ53612G
AXJ53614G
3,000 pcs.
2,500 pcs.
3,000 pcs.
2,500 pcs.
6,000 pcs.
5,000 pcs.
6,000 pcs.
5,000 pcs.
Micro B
Right angle type
Without positioning
bosses
Receptacle
SMD
DIP
Micro AB
Right angle type
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
AXJ5
SPECIFICATIONS
1. Characteristics
Item
Specifications
Conditions
When applying current only to signal terminals:
1.0 A (for terminal No. 2, 3 and 4)
When applying current to the power terminal:
1.8 A (for terminal No. 1 and 5),
Rated current
0.5 A (for terminal No. 2, 3 and 4)
Rated voltage
30V DC/AC
Max. 30mΩ
Min. 100MΩ
Contact resistance
Insulation resistance
EIA-364-23 (Inductive resistance to wire is not included)
EIA-364-21 Using 100V DC megger
Electrical
characteristics
100V AC
EIA-364-20
Detection current: 1mA
Breakdown voltage
(Dielectric breakdown must not occur during a 1 min.
application)
EIA-364-30
Electrostatic capacity
Max. 2pF
Max. 35N
(Measure it between the adjacent terminals of the unmated
connector at a frequency of 1 kHz.)
Mechanical
characteristics
Composite insertion
force (initial)
EIA-364-13 Insert and remove a plug at a speed of 12.5 mm/min.
10,000 times
Contact resistance: Max. 40 mΩ
Composite insertion force: Max. 35N
Composite removal force: Min. 8 N
Appearance: No abnormality
EIA-364-09
Lifetime
characteristics
Insertion and removal
life
Repeated insertion and removal speed of max. 500 times/hours
(Mechanical insertion and removal)
Ambient temperature
Storage temperature
–55°C to 85°C
–55°C to 85°C (–40°C to 50°C for packaging materials)
No freezing or condensation in low temperatures
No freezing or condensation in low temperatures
EIA-364-28
Discontinuity: Max. 1µs
Contact resistance: Max. 40mΩ
Appearance: No abnormality
Apply vibration in three directions including the mating axis that
are perpendicular to one another for 15 minutes respectively with
a 100 mA DC current applied.
Vibration resistance
Cord length: 100mm Fix the cord end.
EIA-364-27
Acceleration: 294m/s2 (30G)
Duration: 11 ms,
Application directions: 6 surfaces (X, Y, and Z directions)
Number of applications: 3 times respectively (Total: 18 times)
Cord length: 100mm Fix the cord end.
Discontinuity: Max. 1µs
Contact resistance: Max. 40mΩ
Appearance: No abnormality
Impact resistance
Environmental
characteristics
250 hours
Contact resistance: Max. 40mΩ
Heat resistance
(mated)
Breakdown voltage: 100V AC dielectric breakdown must EIA-364-17
not occur during a one-minute application.
Insulation resistance: Min. 100MΩ
Appearance: No abnormality
Temperature: 85 2°C
7 cycles
Contact resistance: Max. 40mΩ
Breakdown voltage: 100V AC dielectric breakdown must
not occur during a one-minute application.
Insulation resistance: Min. 100MΩ
Appearance: No abnormality
Humidity resistance
(mated)
EIA-364-31 Method III
Reflow soldering
Manual soldering
Peak temperature: Max. 260°C
300 10°C: Max. 5 s
350 10°C: Max. 3 s
Soldering
temperature
resistance
2. Material and surface treatment
Part name
Material
Surface treatment
Resin-molding portion
Heat-resistant resin (UL94V-0)
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except the cut ends)
Contact
Copper alloy
Metal parts
Shell
Stainless steel
Ni plating on base, Sn plating on surface (Except the cut ends)
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
AXJ5
The CAD data of the products with a CAD Data mark can be downloaded from: http://panasonic-electric-works.net/ac
DIMENSIONS (unit: mm)
1. Micro B Receptacle
1) Pegs (retention fitting): SMD type
Part number
AXJ53312G
Recommended PC board pattern
(TOP VIEW)
CAD Data
7.80
7.50
8.40 0.05
5.90 0.05
3.90 0.05
Note)
2.60 0.05
1.30 0.05
0.40 0.05
0.95 0.05
(Resist area)
0.50 0.05
(Resist area)
0.95 0.05
(Resist area)
6.20 0.05
9.80 0.05
PC board
edge
8.00
6.90
6.20
Note)
: PC board pattern
: Apply resist onto the PC board pattern.
1.30
2.60
5.20
5.40
When mounted on a PC board
Terminal No.1
Terminal No.5
0.50
0.75
Shell pegs (retention fitting) (Front)
0.25 0.1
1.30 0.1
Shell pegs (retention fitting) (Back)
2.60 0.1
General tolerance: 0.3
2) Pegs (retention fitting): DIP type
Part number
AXJ53314G
Recommended PC board pattern
(TOP VIEW)
CAD Data
8.40 0.05
5.90 0.05
3.90 0.05
2.60 0.05
1.30 0.05
0.40 0.05
7.50
Through hole
0.50 0.05
3.55 0.05
4.15 0.05
4.75 0.05
4.15 0.05
6.75 0.05
PC board
edge
6.15 0.05
6.75 0.05
8.00
6.90
6.20
5.40
Top view
Bottom view
1.30
2.60
5.55
0.80
Terminal No.1
When mounted on a PC board
Terminal No.5
0.30
2.20
0.50
0.75
0.25 0.1
1.30 0.1
Shell pegs (retention fitting) (Back)
2.60 0.1
General tolerance: 0.3
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
2. Micro AB Receptacle
AXJ5
1) Pegs (retention fitting): SMD type
Part number
AXJ53612G
Recommended PC board pattern
(TOP VIEW)
CAD Data
8.80
7.50
8.40 0.05
6.30 0.05
3.90 0.05
2.60 0.05
1.30 0.05
0.40 0.05
Note)
0.50 0.05
(Resist area)
1.45 0.05
(Resist area)
1.45 0.05
(Resist area)
7.20 0.05
9.30 0.05
8.00
6.90
6.20
PC board edge
Note)
: PC board pattern
: Apply resist onto the PC board pattern.
1.30
2.60
5.30
Terminal No.5
Terminal No.1
When mounted on a PC board
0.50
0.75
Shell pegs (retention fitting) (Front)
0.25 0.1
1.30 0.1
Shell pegs (retention fitting) (Back)
2.60 0.1
General tolerance: 0.3
2) Pegs (retention fitting): DIP type
Part number
AXJ53614G
Recommended PC board pattern
(TOP VIEW)
CAD Data
7.50
8.40 0.05
6.30 0.05
3.90 0.05
Through hole
2.60 0.05
1.30 0.05
0.40 0.05
0.50
0.05
5.80 0.05
8.40 0.05
4.30 0.05
5.80 0.05
6.40 0.05
7.80 0.05
8.40 0.05
PC board edge
8.00
6.90
6.20
Bottom view
Top view
1.30
2.60
5.30
7.20
0.80
Terminal No.1
Terminal No.5
0.30
2.20
When mounted on a PC board
0.50
0.75
0.25 0.1
1.30 0.1
Shell pegs (retention fitting) (Back)
2.60 0.1
General tolerance: 0.3
panasonic-electric-works.net/ac
Discontinued as of September 30, 2010
AXJ5
EMBOSSED TAPE DIMENSIONS (unit: mm)
• Tape dimensions (Conforming to JIS C 0806-3 1990)
• Reel dimensions (Conforming to EIAJ ET-7200B)
(24.0 0.3)
(11.5)
1.75
(25.4 1)
Top cover tape
Emboss carrier tape
1.55 0.05 dia.
NOTES
1. Use of a cover is recommended
when using this device in order to
• The following diagram shows the
recommended reflow soldering
temperature profile.
Recommended reflow soldering
temperature profile
5. PC board warpage should be
controlled less than 0.03mm to entire
length of the connector.
6. Repeated bending of terminals and
clips (retention fitting) can result in
terminals breaking.
prevent scraps, dust, dirt, etc., from
getting inside of the receptacle.
2. PC board design
Please refer to the recommended PC
board pattern to ensure the strength of
soldered portion of terminals.
3. Soldering
Temperature
Maximum temperature
7. Regarding after soldering
connectors on PC boards
Max. 260°C
200°C
Pre-heating
150 to 175°C
• After mounting connectors on PC
boards, do not apply excessive loads to
the connector by piling up the boards.
• Please do not add the force to the
connector during assembled connector
on PC board.
8.This connector has metal shell for
preventing EMI, when designing an
enclosure the followings should be
considered. Guide for plug entrance
should be arranged in order to prevent
distorted insertions. Provide a cover
to reinforce the metal shell portions of
the receptacle.
60 to 120 second
1) Manual soldering
Max. 70 sec
• Please set up temperature and applied
time of soldering iron as indicated in
specification sheet.
• Avoid an excessive amount of solder
from being applied, or it may flow into the
shell.
• Please use soldering iron after
confirming removal of dispersed solder
flux on the contact surface by use of
magnifying glass after each soldering.
• Do not apply a load to the terminals
during soldering, or the contacts may be
displaced.
Time
• The temperature measured on the PC
board surface near connector terminals.
• After reflow soldering, in case of PC
board surface the reverse side using
reflow soldering, for example an adhesive
and so on connector of fixed disposition.
3) Rework of soldering portion
• Rework is one time.
• Avoid an excessive amount of solder
from being applied, or it may flow into the
shell.
9. Others
• In case of soldering rework of bridges.
Please use a flat-head soldering iron and
don’t use supplementary solder flux.
• Please use the soldering iron under
specification’s temperature
4. Since excessive force on the
terminals will cause deformation and
the integrity of the soldering will be
lost during reflow soldering, avoid
dropping or rough handling of the
product.
• Please properly clean soldeing iron.
2) Reflow soldering
• Screen printing is recommended for
cream solder printing.
• Screen thickness of 0.12mm is
recommended for cream solder printing.
• When applying different thickness of
screen, please consult us.
• Depending upon size of connector, self
alignments may not be expected.
Please pay attention to align terminals
and soldered pads.
To prevent insulation deterioration of PC
board after soldering, please avoid
adhesion coating agent to terminals in
case of coating.
For other details, please verify with
the product specification sheets.
panasonic-electric-works.net/ac
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