AXK1113775J [PANASONIC]
Board Stacking Connector, 13 Contact(s), 1 Row(s), Female, Straight, Surface Mount Terminal;
| 型号： | AXK1113775J |
| 厂家： | 
PANASONIC |
| 描述： | Board Stacking Connector, 13 Contact(s), 1 Row(s), Female, Straight, Surface Mount Terminal 连接器 |
| 文件： | 总10页 (文件大小：691K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AXK(1)
NARROW-PITCH
CONNECTORS
FOR BOARD-ON BOARD
CONNECTIONS
NARROW-PITCH
CONNECTORS
— DIRECT TYPE —
• Example of connection between PC
board and LCD display of cellular
phone
APPLICATIONS
Cellular phones, PHS, PDAs and other
small portable devices.
• What is meant by “direct type”
connector?
Using this connector, the terminal
part is mounted on the PC board
(B in the figure below) by soldering,
the contact part, is pressed to the
pattern on the PC board (A in the
figure below) and connection
performed.
FEATURES
1. An ultra thin, lightweight PC board
to PC board space of max. 0.1 mm is
realized. Contributes to
miniaturization of equipment.
An effective stacking height of 0.4 mm
and weight of 0.05 g is realized (with a
pitch between terminals of 1.4 mm and 8
contacts).
2. With bellows type contact
construction, a large spring stroke is
maintained, and the corresponding
stacking capacity is increased.
3. Automatic assembly and reduction
in part runs is possible, providing a
total cost reduction.
LCD display
FPC
Hold
Contact part
Pattern
down
PC board
B
Terminal part
A
Stacking height
Min. 0.4 mm
Compared to rubber connectors, the
number of parts and mounting costs can
be reduced.
4.Twin contact construction for high
contact reliability.
Also, the 1.0 mm terminal pitch type
supports single-contact types for light
loads with leeway in positioning when
assembling the device.
PRODUCT TYPES
Terminal pitch
Packing quantity
Recommended
stacking height
Effective
stacking height
No. of
contacts
Contact tip
Part No.
Inner carton (1 reel)
3,500 pcs.
3,500 pcs.
3,000 pcs.
3,000 pcs.
3,000 pcs.
3,000 pcs.
3,000 pcs.
3,000 pcs.
3,000 pcs.
3,000 pcs.
4,000 pcs.
4,000 pcs.
4,000 pcs.
4,000 pcs.
3,000 pcs.
Outer carton
7,000 pcs.
7,000 pcs.
6,000 pcs.
6,000 pcs.
6,000 pcs.
6,000 pcs.
6,000 pcs.
6,000 pcs.
6,000 pcs.
6,000 pcs.
8,000 pcs.
8,000 pcs.
8,000 pcs.
8,000 pcs.
6,000 pcs.
14
15
Twin
Twin
Twin
Single
Twin
Twin
Single
Twin
Twin
Twin
Twin
Twin
Twin
Twin
Twin
AXK1114355J
AXK1115355J
AXK1110535J
AXK1110575J
AXK1112535J
AXK1112735J
AXK1113775J
AXK1418635J
AXK1412835J
AXK1418835J
AXK1208435J
AXK1214435J
AXK1215435J
AXK1220435J
AXK1302235J
0.8mm
0.6mm to 1.0mm
10
1.0mm
1.25mm
1.05mm to 1.4mm
12
12
13
18
12
18
8
1.45mm
1.15mm
1.35mm
1.25mm to 1.6mm
0.95mm to 1.3mm
1.15mm to 1.5mm
0.4mm to 0.8mm
0.45mm to 0.8mm
1.1mm
0.6mm
14
15
20
2
1.4mm
3.5mm
0.65mm
0.95mm
0.5mm to 0.8mm
0.7mm to 1.1mm
53
AXK(1)
SPECIFICATIONS
1. Characteristics
1) Terminal pith 1.0mm, 1.1mm
Specifications
Item
Conditions
Terminal pitch 1.0mm
Terminal pitch 1.1mm
Rated current
Rated voltage
Breakdown
0.5A
60V AC/DC
250V AC for 1 minute
Min. 1,000MΩ (initial)
Max. 50mΩ
Detection current: 1mA
Electrical
characteristics
voltage
Insulation
resistance
Using 500V DC megger (applied for 1min.)
Contact
resistance
Measured based on the HP4338B measurement
method of JIS C 5402.
14, 15, 17 contacts twin connection:
+0.147
+15
0.637
N{65 gf}/2 points
–0.098
–10
Mechanical
characteristics (Note)
Contact force
10, 12 contacts twin connection:
+0.147
+15
0.441
N{45 gf}/2 points
–0.098
–10
+0.147 +15
0.441
N{45 gf}/2 points
–0.098
–10
10, 13, 17, 18 contacts single connection:
+0.147
+15
0.441
N{45 gf}/1 point
–0.098
–10
Ambient
temperature
–55°C to +85°C
No freezing at low temperature
Infrared reflow soldering. However,
the temperature of the of PC board surface
adjacent to connector terminals.
Max. peak temperature of 245°C
Soldering heat
resistance
Environmental
characteristics
300°C within 5 seconds/350°C within 3 seconds
Soldering iron
Sequence Temperature (°C) Time (minutes)
Thermal shock
resistance
(header and
socket mated)
+0
1
2
3
4
–55
25
85
25
30
Max. 5
30
5 cycles,
insulation resistance Min. 100MΩ,
contact resistance Max. 50mΩ
−3
+10
−5
+3
−0
+10
Max. 5
−5
Lifetime
characteristics removal life
Insertion and
50 times,
contact resistance Max. 50mΩ
Do not press the contact in further than the
surface of the molded portion of the connector.
Unit weight
0.1g (14 contacts)
0.1g (18 contacts)
Note) After pushing the connector contacting part from the recommended stacking height up to the connector part, return it to the same position and then measure.
2) Terminal pith 1.4mm, 3.5mm
Specifications
Item
Conditions
Terminal pitch 1.4mm
Terminal pitch 3.5mm
Rated current
0.5A
Rated voltage
60V AC/DC
Breakdown
voltage
250V AC for 1 minute
Min. 1,000MΩ (initial)
Max. 80mΩ
Detection current: 1mA
Electrical
characteristics
Insulation
resistance
Using 500V DC megger (applied for 1min.)
Contact
resistance
Measured based on the HP4338B measurement
method of JIS C 5402.
Mechanical
characteristics (Note)
Contact force
+0.196
+20
+0.147
+15
0.490
N{50 gf}/2 points
0.588
N{60 gf}/2 points
–0.098
–10
–0.098
–10
Ambient
temperature
–55°C to +85°C
Max. peak temperature of 245°C
No freezing at low temperature
Infrared reflow soldering. However, the
temperature of the of PC board surface adjacent
to connector terminals.
Soldering heat
resistance
Environmental
characteristics
300°C within 5 seconds/350°C within 3 seconds
Soldering iron
Sequence Temperature (°C) Time (minutes)
Thermal shock
resistance
(header and
socket mated)
+0
1
2
3
4
–55
25
85
25
30
Max. 5
30
5 cycles,
insulation resistance Min. 100MΩ,
contact resistance Max. 80mΩ
−3
+10
−5
+3
−0
+10
Max. 5
−5
Lifetime
characteristics removal life
Insertion and
50 times,
contact resistance Max. 80mΩ
Do not press the contact in further than the
surface of the molded portion of the connector.
Unit weight
0.05g (8 contacts)
0.03g (2 contacts)
Note) After pushing the connector contacting part from the recommended stacking height up to the connector part, return it to the same position and then measure.
54
AXK(1)
2. Material and surface treatment
Part name
Material
Surface treatment
Molded portion
Heat resistant resin (UL94V-0)
—
Contact portion: Au plating over Ni (Min. 0.1µm)
Soldering terminal portion: Au plating over Ni (Except for thick of terminal)
Contact/Post
Copper alloy
3. Contact Side PC Board Specifications
Contact portion surface treatment
Au plating over Ni (Min. 0.2µm)
mm General tolerance 0.2
DIMENSIONS
1. Terminal pitch 1.0mm, stacking height 0.8mm, 14 contacts twin type
Recommended PC board pattern
(TOP VIEW)
1. Mounting pad layout
18.40 0.05
16.40 0.05
13.00 0.05
17.00 0.15
13.00 0.15
1.00 0.05
0.1
0.60+00.08
0.40 0.05
0.70 0.05
X
1.00 0.1
0.40 0.05
0.12
0.20
0.80
0.65 0.1
7.00
Y
1.55+00.2
(Operating position)
15.00 0.05
17.00 0.05
14.70
16.70
17.25
17.65
X-Y cross section
13.00 0.1
0.80
2. Surface contact pattern
0.55 0.08
0.15 0.08
13.00 0.05
1.00 0.05
0.72-00.05 dia.
0.72-00.05 dia.
15.00 0.08
0.65 0.05
2. Terminal pitch 1.0mm, stacking height 0.8mm, 15 contacts twin type
Recommended PC board pattern
(TOP VIEW)
1. Mounting pad layout
18.00 0.15
14.00 0.15
0.40 0.05
0.1
0.60+00.08
0.40 0.05
19.40 0.05
17.40 0.05
14.00 0.05
X
1.00 0.1
0.12
1.00 0.05
0.70 0.05
0.20
0.65 0.1
0.35 0.1
(Operating
0.80
1.55+00.2
position)
Y
15.70
17.70
18.25
18.65
16.00 0.05
18.00 0.05
X-Y cross section
0.1 (Contact portion)
0.55 0.08
0.80
14.00
Boss
2. Surface contact pattern
0.15 0.08
14.00 0.05
0.05
1.00 0.05
(
0.65
)
16.00 0.08
0.72-00.05 dia.
0.72-00.05 dia.
55
AXK(1)
mm General tolerance 0.2
3. Terminal pitch 1.0mm, stacking height 1.25mm, 10 contacts twin type
Recommended PC board pattern
(TOP VIEW)
0.1
1. Mounting pad layout
1.05+0.08
9.0 0.15
0
9.0 0.05
1.0 0.05
0.7 0.05
0.4 0.05
0.12
1.0 0.1
0.35 0.1
11.8 0.05
0.65 0.1
1.25 (Operating position)
1.9+0.2
11.1
12.5
13.0
0
2. Surface contact pattern
9.0 0.1
0.55 0.08
9.0 0.05
1.0 0.05
0.65
0.05
(
)
0.7–00.05 dia.
0.7–00.05 dia.
11.8 0.08
4. Terminal pitch 1.0mm, stacking height 1.25mm, 10 contacts single type
Recommended PC board pattern
(TOP VIEW)
0.1
1. mounting pad layout
1.05+0.08
9.0 0.15
0
9.0 0.05
1.0 0.05
0.7 0.05
0.4 0.05
0.12
1.0 0.1
0.35 0.1
11.8 0.05
0.65 0.1
1.25 (Operating position)
11.1
1.9+0.2
12.5
13.0
0
2. Surface contact pattern
9.0 0.1
0.4 0.06
9.0 0.05
1.0 0.05
0.80
0.05
(
)
0.7–00.05 dia.
0.7–00.05 dia.
11.8 0.08
56
AXK(1)
mm General tolerance 0.2
5. Terminal pitch 1.0mm, stacking height 1.25mm, 12 contacts twin type
0.1
Recommended PC board pattern
(TOP VIEW)
1.9+0.2
0
11.0 0.15
0.4 0.05
1.0 0.1
1.25 (Operating position)
1.05+0.08
1. Mounting pad layout
0
0.12
11.0 0.05
1.0 0.05
0.7 0.05
0.35 0.1
0.65 0.1
13.8 0.05
13.1
14.5
15.0
11.0 0.1 (Contact portion)
0.55 0.08
2. Surface contact pattern
11.0 0.05
1.0 0.05
(0.65 0.05
)
0.7–00.05 dia.
C 0.2
0.7–00.05 dia.
13.8 0.08
6. Terminal pitch 1.0mm, stacking height 1.45mm, 12 contacts twin type
Recommended PC board pattern
(TOP VIEW)
0.1
1. Mounting pad layout
2.1+0.2
0
1.45 (Operating position)
11.0 0.05
1.25+0.08
11.0 0.15
0.4 0.05
1.0 0.1
1.0 0.05
0
0.12
0.7 0.05
13.8 0.05
0.35 0.1
0.65 0.1
13.1
14.5
2. Surface contact pattern
15.0
11.0 0.05
1.0 0.05
(0.65 0.05
11.0 0.1 (Contact portion)
0.55 0.08
)
0.7–00.05 dia.
C 0.2
0.7–00.05 dia.
13.8 0.08
57
AXK(1)
mm General tolerance 0.2
7. Terminal pitch 1.0mm, stacking height 1.45mm, 13 contacts single type
Recommended PC board pattern
(TOP VIEW)
1. Mounting pad layout
0.1
2.1+0.2
0
12.0 0.05
1.45 (Operating position)
1.25+0.08
1.0 0.05
0
12.0 0.15
0.4 0.05
1.0 0.1
0.7 0.05
0.12
14.8 0.05
0.35 0.1
0.65 0.1
14.1
15.5
16.0
2. Surface contact pattern
12.0 0.05
1.0 0.05
12.0 0.1 (Contact portion)
0.4 0.06
(0.80 0.05
)
0.7–00.05 dia.
C 0.2
0.7–00.05 dia.
14.8 0.08
8. Terminal pitch 1.1mm, stacking height 1.15mm, 18 contacts twin type
Recommended PC board pattern
(TOP VIEW)
1. mounting pad layout
18.7 0.05
1.1 0.05
0.1
0.95+00.08
18.70 0.15
0.4 0.05
0.7 0.05
1.1 0.1
0.12
21.4 0.05
0.45 0.1
(
)
0.65 0.1
20.7
1.15 Operating position
1.95+00.2
2. Surface contact pattern
22.1
22.6
18.7 0.05
0.05
1.1 0.05
(
)
0.8
18.7 0.1 Contact portion
Connection
(
)
portion
0.55 0.08
0.72–00.05 dia.
0.72–00.05 dia.
21.4 0.08
58
AXK(1)
mm General tolerance 0.2
9. Terminal pitch 1.1mm, stacking height 1.35mm, 12 contacts twin type
Recommended PC board pattern
(TOP VIEW)
0.1
1. Mounting pad layout
(Terminal coplanarity)
2.15+0.2
0
12.1 0.15
12.1 0.05
1.35 (Operating position)
1.1 0.1
0.4 0.05
1.15 +0.08
1.1 0.05
0.7 0.05
0
0.12
14.8 0.05
0.45 0.1
0.65 0.1
14.1
2. Surface contact pattern
15.5
16.0
12.1 0.05
1.1 0.05
(0.8 0.05
12.1 0.1 (Contact portion)
0.55 0.08
)
0.72–00.05 dia.
0.72–00.05 dia.
14.8 0.08
10. Terminal pitch 1.1mm, stacking height 1.35mm, 18 contacts twin type
0.1
(Terminal coplanarity)
2.15 +0.2
0
18.7 0.15
1.35 (Operating position)
1.15 +0.08
1.1 0.1
0.4 0.05
0
0.12
0.45 0.1
0.65 0.1
20.7
22.1
22.6
Recommended PC board pattern
(TOP VIEW)
1. Mounting pad layout
18.7 0.1 (Contact portion)
0.55 0.08
18.7 0.05
1.1 0.05
0.1 0.05
0.72–00.05 dia.
0.72–00.05 dia.
21.4 0.06
21.4 0.05
2. Surface contact pattern
18.7 0.05
1.1 0.05
(0.8 0.05
)
59
AXK(1)
mm General tolerance 0.2
11. Terminal pitch 1.4mm, stacking height 0.6mm, 8 contacts twin type
Recommended PC board pattern
(TOP VIEW)
14.0-00.2
9.8 0.15
1.4 0.1
1. Mounting pad layout
0.6 0.05
9.8 0.05
1.4 0.05
X
0.1
0.8 0.05
0.7 0.08
Y
12.5 0.05
0.85
11.48
13.5
X-Y cross section
0.1 (Contact portion)
0.6 0.08
2. Surface contact pattern
9.8
0.1
9.8 0.05
0.15 0.08
1.4+00.2
1.4 0.05
(Operating position)
0.6
(0.95 0.05
)
0.4+00.08
12.5 0.08
0.72-00.05 dia.
0.72-00.05 dia.
12. Terminal pitch 1.4mm, stacking height 0.6mm, 14 contacts twin type
Recommended PC board pattern
(TOP VIEW)
1. Mounting pad layout
18.2 0.15
0.1
0.45+00.08
0.1
18.2 0.05
1.4 0.05
1.4 0.1
0.8 0.05
0.6 0.05
20.9 0.05
(
)
0.6 Operating position
1.4+00.2
0.85
20.15
21.9
2. Surface contact pattern
22.4–00.2
18.2 0.05
1.4 0.05
18.2 0.1 Contact portion
(
)
0.6 0.08
Connection
portion
0.05
0.15 0.08
(
)
0.95
0.72–00.05 dia.
0.72–00.05 dia.
20.9 0.08
13. Terminal pitch 1.4mm, stacking height 0.6mm, 15 contacts twin type
Recommended PC board pattern
(TOP VIEW)
1. Mounting pad layout
23.8-00.2
19.6 0.15
1.4 0.1
19.6 0.05
1.4 0.05
0.6 0.05
X
0.8 0.05
0.1
22.3 0.05
0.7 0.08
Y
0.85
21.55
23.3
2. Surface contact pattern
0.1 (Contact portion)
0.6 0.08
X-Y cross section
19.6
19.6 0.05
1.4 0.05
0.15 0.08
0.1
1.4+00.2
(0.95 0.05
)
(Operating position)
0.6
0.45+00.08
22.3 0.08
0.72-00.05 dia.
0.72-00.05 dia.
60
AXK(1)
mm General tolerance 0.3
14. Terminal pitch 1.4mm, stacking height 0.65mm, 20 contacts twin type
Recommended PC board pattern
(TOP VIEW)
1. Mounting pad layout
30.8–00.2
26.6 0.15
1.4 0.1
26.6 0.05
0.6 0.05
1.4 0.05
0.8 0.05
X
0.1
0.55 0.08
Y
29.3 0.05
0.85
28.55
30.3
X-Y cross section
2. Surface contact pattern
26.6 0.1
0.1
(
)
Contact portion
26.6 0.05
1.4 0.05
0.6 0.08
1.4+00.2
0.15 0.08
(
)
0.65 Operating position
(0.95 0.05
)
0.5+00.08
0.72–00.05 dia.
0.72–00.05 dia.
29.3 0.08
15. Terminal pitch 3.5mm, stacking height 0.95mm, 2 contacts twin type
Recommended PC board pattern
(TOP VIEW)
1. Mounting pad layout
3.5 0.05
7.4-00.2
0.6 0.05
7.0
0.1
0.7 0.08
4.5+00.1
3.5 0.08
0.4
0.4 0.08
0.2
5.9 0.05
1.8
5.6
(Operating position)
0.95
0.65 0.08
1.95+00.2
2. Surface contact pattern
4.7 0.1
1.2 0.1
3.5
0.6 0.08
0.15 0.08
1.0
5.9 0.08
(6.0)
61
AXK(1)
CUSTOM PRODUCTS
Please consult us if you wish for specifications other than those given above.
DIL terminal 8 contacts
DIL terminal 30 contacts
DIL terminal 38 contacts
EMBOSSED TAPE DIMENSIONS
Please refer to page 67.
NOTES
1. As this connector is connected directly
to the PC board, the surface of the PC
board should be free from dust, dirt, and
corrosion.
2. The attachment to the PC board
should be designed so as not to cause
warping due to connector reaction forces.
Also, please refer to the tolerances for the
alignment between the connector and the
PC board that are indicated in the figure
showing the dimensions.
Regarding general notes, please
refer to pages 8 and 9.
62
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