AXK5L30347G [PANASONIC]

Board Stacking Connector, 30 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT;


型号：	AXK5L30347G
厂家：	PANASONIC
描述：	Board Stacking Connector, 30 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket, ROHS COMPLIANT 连接器
文件：	总9页 (文件大小：283K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AXK(5/6)L

For board-to-board

Narrow pitch connectors

(0.5mm pitch)

P5KL Series

FEATURES

APPLICATIONS

1. Low proﬁle mated height of 1.2 mm

and 0.5 mm pitch contributes to

device miniaturization.

Digital devices, such as digital still

cameras and digital video cameras.

2. Strong resistance to adverse

environments! Utilizes

“

” construction

for high contact reliability.

Socket

Header

3. Simple lock structure provides

tactile feedback to ensure excellent

mating/unmating operation feel.

RoHS compliant

Simple lock

mechanism

4. Effective mating length 0.3 mm.

0.3mm

ORDERING INFORMATION

AXK

5L: Narrow Pitch Connector P5KL (0.5 mm pitch) Socket

6L: Narrow Pitch Connector P5KL (0.5 mm pitch) Header

Number of pins (2 digits)

Mated height

3: For mated height 1.2 mm

3: For mated height 1.2 mm

Functions

3: With positioning bosses

4: Without positioning bosses

Surface treatment (Contact portion / Terminal portion)

7: Ni plating on base, Au plating on surface (for Ni barrier available)

Packing

G: 3,000 pieces embossed tape and plastic reel × 2 (for Ni barrier available)

ACCTB24E 201209-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK(5/6)L

PRODUCT TYPES

Part No.

Packing quantity

Inner carton

(1-reel)

Mated height

No. of pins

Socket

Header

Outer carton

AXK5L10347G

AXK5L12347G

AXK5L20347G

AXK5L24347G

AXK5L30347G

AXK5L34347G

AXK5L40347G

AXK5L46347G

AXK5L50347G

AXK5L60347G

AXK6L10347G

AXK6L12347G

AXK6L20347G

AXK6L24347G

AXK6L30347G

AXK6L34347G

AXK6L40347G

AXK6L46347G

AXK6L50347G

AXK6L60347G

1.2 mm

3,000 pieces

6,000 pieces

Notes: 1. Regarding ordering units: During production, Please make orders in 1-reel units. Samples for mounting conﬁrmation: Please consult us. Samples: Small lot orders

are possible. Please consult us.

2. The standard type comes without positioning bosses. Connectors with positioning bosses are available for on-demand production.

For this type of connector, 9th digit of the part no. changes from 4 to 3. e.g. 10 pin contacts for sockets: AXK5L10337G

SPECIFICATIONS

1. Characteristics

Item

Speciﬁcations

0.5A/pin contact (Max. 10 A at total pin contacts)

60V AC/DC

Conditions

Rated current

Rated voltage

Breakdown voltage

Insulation resistance

Electrical

characteristics

150V AC for 1 minute

Detection current: 1mA

Using 500V DC megger

Min. 1,000MΩ (initial)

Based on the contact resistance measurement method

speciﬁed by JIS C 5402.

Contact resistance

Max. 90mΩ

Composite insertion force

Composite removal force

Max. 0.981N {100gf}/pin contacts × pin contacts (initial)

Min. 0.0588N {6gf}/pin contacts × pin contacts

Mechanical

characteristics

Holding force of terminal

securing section

Measuring the maximum force.

As the contact is axially pull out.

Min. 0.981N {100gf}/pin contact

Ambient temperature

–55°C to +85°C

No freezing at low temperatures

Max. peak temperature of 260°C (on the surface of the

Infrared reﬂow soldering

PC board around the connector terminals)

Soldering heat resistance

300°C within 5 seconds

350°C within 3 seconds

Soldering iron

–55°C to +85°C (product only)

–40°C to +50°C (emboss packing)

Storage temperature

No freezing at low temperatures. No dew condensation.

Conformed to MIL-STD-202F, method 107G

Order Temperature (°C) Time (minutes)

Environmental

characteristics

–55₋₃

Max. 5

Thermal shock resistance

(header and socket mated)

5 cycles, insulation resistance min. 100MΩ,

contact resistance max. 90mΩ

85⁺³

Max. 5

–55₋₃

Humidity resistance

(header and socket mated)

120 hours, insulation resistance min. 100MΩ,

contact resistance max. 90mΩ

Bath temperature 40 2°C,

humidity 90 to 95% R.H.

Saltwater spray resistance

(header and socket mated)

24 hours, insulation resistance min. 100MΩ,

contact resistance max. 90mΩ

Bath temperature 35 2°C,

saltwarter concentration 5 1%

H2S resistance

(header and socket mated)

Bath temperature 40 2°C, gas concentration 3 1 ppm,

humidity 75 to 80% R.H.

48 hours, contact resistance max. 90mΩ

Lifetime

characteristics

Repeated insertion and removal speed of

max. 200 times/hours

Insertion and removal life

50 times

Unit weight

20 pin contacts; Socket: 0.05g; Header: 0.02g

2. Material and surface treatment

Part name

Material

Surface treatment

—

Molded portion

Heat-resistant resin (UL94V-0)

Contact portion: Ni plating on base, Au plating on surface

Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)

The section close to the soldering portion has a nickel barrier.

(The nickel base is exposed.)

Contact/Post

Copper alloy

ACCTB24E 201209-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK(5/6)L

The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/

DIMENSIONS (Unit: mm)

• Socket (Mated height: 1.2mm)

CAD Data

Terminal

coplanarity

0.1

1.20

0.10

0.50 0.05

0.20 0.03

Dimension table (mm)

No. of pins

5.50

2.00

2.50

4.50

5.50

7.00

8.00

9.50

11.00

12.00

14.50

6.00

8.00

9.00

10.50

11.50

13.00

14.50

15.50

18.00

0.10 0.03

General tolerance: 0.2

• Header (Mated height: 1.2mm)

CAD Data

Terminal coplanarity

0.95

0.10

B 0.1

0.50 0.05

0.20 0.03

Dimension table (mm)

No. of pins

3.90

4.40

6.40

7.40

8.90

9.90

11.40

12.90

13.90

16.40

2.00

2.50

4.50

5.50

7.00

8.00

9.50

11.00

12.00

14.50

0.10 0.03

General tolerance: 0.2

• Socket and header are mated

Header

Socket

ACCTB24E 201209-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK(5/6)L

EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)

• Tape dimensions (Conforming to JIS C 0806-1990.

However, some tapes have mounting hole pitches that do

not comply with the standard.)

• Plastic reel dimensions (Conforming to EIAJ ET-7200B)

Tape I

Tape II

A 0.3

Taping reel

A 0.3

D 1

1.75

Top cover tape

Embossed carrier tape

Embossed mounting-hole

8.0

1.5^+0.1dia.

Dimension table (mm)

Sufﬁx: G (1 reel, 3,000 pieces embossed tape: Plastic reel package)

Mated height

No. of pins

10 to 18

20 to 50

Type of taping

Quantity per reel

3,000 pcs.

Tape I

16.0

24.0

32.0

—

7.5

17.4

25.4

33.4

Socket and header are common:

1.2mm

Tape I

11.5

14.2

3,000 pcs.

Tape II

28.4

3,000 pcs.

Connector orientation with respect to direction of progress of embossed tape

Type

Common for P5KL

Direction of

tape progress

Socket

Header

Note: There is no indication on this product regarding top-bottom or left-right orientation.

ACCTB24E 201209-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK(5/6)L

NOTES

1. As shown below, excess force

during insertion may result in damage

to the connector or removal of the

solder. Also, to prevent connector

damage please conﬁrm the correct

position before mating connectors.

• Socket

• Header

Recommended PC board pattern (TOP VIEW)

0.50 0.05

0.25 0.03

0.50 0.05

0.25 0.03

0.40 0.05

0.125 0.03

B 0.05

0.40 0.05

0.125 0.03

B 0.05

2. Keep the PC board warp no more

than 0.03 mm in relation to the overall

length of the connector.

: Insulation area

Recommended metal mask pattern

Metal mask thickness: 150 µm

(Terminal portion opening area ratio: 57%)

Metal mask thickness: 150 µm

(Terminal portion opening area ratio: 56%)

0.50 0.01

0.23 0.01

0.50 0.01

0.23 0.01

Max. 0.03mm

3. Recommended PC board and metal

mask patterns

Connectors are mounted with high pitch

density, intervals of 0.35 mm, 0.4 mm or

0.5 mm.

In order to reduce solder bridges and

other issues make sure the proper levels

of solder is used.

The ﬁgures to the right are recommended

metal mask patterns. Please use them as

a reference.

0.35 0.01

0.115 0.01

0.35 0.01

0.115 0.01

Recommended metal mask pattern

Metal mask thickness: 120 µm

(Terminal portion opening area ratio: 70%)

Recommended metal mask pattern

Metal mask thickness: 120 µm

(Terminal portion opening area ratio: 70%)

0.50 0.01

0.23 0.01

0.50 0.01

0.23 0.01

0.35 0.01

0.115 0.01

0.35 0.01

0.115 0.01

Notes: 1. See the dimension table on page 87 for

more information on the B dimension of the

socket and header.

Please refer to the latest product

speciﬁcations when designing your

product.

2. The socket C dimension is the B dimension

in the dimensions table with 0.8 added.

ACCTB24E 201209-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

Notes on Using Narrow-pitch Connectors (Common)

Regarding the design of devices and PC board patterns

1) When connecting several connectors

together by stacking, make sure to

maintain proper accuracy in the design of

structure and mounting equipment so

that the connectors are not subjected to

twisting and torsional forces.

2) With mounting equipment, there may

be up to a 0.2 to 0.3-mm error in

positioning. Be sure to design PC boards

and patterns while taking into

5) For all connectors of the narrow-pitch

series, to prevent the PC board from

coming off during vibrations or impacts,

and to prevent loads from falling directly

on the soldered portions, be sure to

design some means to ﬁx the PC board

in place.

backside of the FPC board to which the

connector is being connected. Please

make the reinforcement board

dimensions bigger than the outer limits of

the recommended PC board pattern

(should be approximately 1 mm greater

than the outer limit).

Material should be glass epoxy or

polyimide, and the thickness should be

between 0.2 and 0.3 mm.

Example) Secure in place with screws

Screw

consideration the performance and

abilities of the required equipment.

3) Some connectors have tabs embossed

on the body to aid in positioning. When

using these connectors, make sure that

the PC board is designed with positioning

holes to match these tabs.

4) To ensure the required mechanical

strength when soldering the connector

terminals, make sure the PC board

meets recommended PC board pattern

design dimensions given.

(2) Collisions, impacts, or turning of FPC

boards, may apply forces on the

connector and cause it to come loose.

Therefore, make to design retaining

plates or screws that will ﬁx the connector

in place.

7) The narrow-pitch connector series is

designed to be compact and thin.

Although ease of handling has been

taken into account, take care when

mating the connectors, as displacement

or angled mating could damage or

deform the connector.

Connector

Spacer

PC board

When connecting PC boards, take

appropriate measures to prevent the

connector from coming off.

6) Notes when using a FPC.

(1) When the connector is soldered to an

FPC board, during its insertion and

removal procedures, forces may be

applied to the terminals and cause the

soldering to come off. It is recommended

to use a reinforcement board on the

Regarding the selection of the connector placement machine and the mounting

procedures

1) Select the placement machine taking

into consideration the connector height,

required positioning accuracy, and

packaging conditions.

2) Be aware that if the catching force of

the placement machine is too great, it

may deform the shape of the connector

body or connector terminals.

3) Be aware that during mounting,

external forces may be applied to the

connector contact surfaces and terminals

and cause deformations.

4) Depending on the size of the

6) Excessive mounter chucking force may

deform the molded or metal part of the

connector. Consult us in advance if

chucking is to be applied.

connector being used, self alignment

may not be possible. In such cases, be

sure to carefully position the terminal with

the PC board pattern.

5) The positioning bosses give an

approximate alignment for positioning on

the PC board. For accurate positioning of

the connector when mounting it to the PC

board, we recommend using an

automatic positioning machine.

ACCTB48E 201204-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

Notes on Using Narrow-pitch Connectors (Common)

Regarding soldering

1. Reﬂow soldering

Soldering conditions

2. Hand soldering

1) Measure the recommended proﬁle

temperature for reﬂow soldering by

placing a sensor on the PC board near

the connector surface or terminals. (The

setting for the sensor will differ depending

on the sensor used, so be sure to

carefully read the instructions that comes

with it.)

Please use the reﬂow temperature proﬁle

conditions recommended below for

reﬂow soldering. Please contact us

before using a temperature proﬁle other

than that described below (e.g. lead-free

solder).

1) Set the soldering iron so that the tip

temperature is less than that given in the

table below.

Product name

Soldering iron temperature

300°C within 5 sec.

350°C within 3 sec.

SMD type connectors

• Narrow-pitch connectors

(except P8 type)

2) Do not allow ﬂux to spread onto the

connector leads or PC board. This may

lead to ﬂux rising up to the connector

inside.

3) Touch the soldering iron to the foot

pattern. After the foot pattern and

connector terminal are heated, apply the

solder wire so it melts at the end of the

connector terminals.

2) As for cream solder printing, screen

printing is recommended.

Upper limited (Solder heat resistance)

Lower limited (Solder wettability)

Temperature

3) To determine the relationship between

the screen opening area and the PC-

board foot pattern area, refer to the

diagrams in the recommended patterns

for PC boards and metal masks. Make

sure to use the terminal tip as a reference

position when setting. Avoid an excessive

amount of solder from being applied,

otherwise, interference by the solder will

cause an imperfect contact.

Peak temperature

Peak temperature 260°C

230°C

220°C

200°C

Preheating

60 to 120 sec.

180°C

150°C

25 sec.

70 sec.

Time

• Narrow-pitch connector (P8)

Apply the solder

wire here

Temperature

Peak temperature

245°C max.

200°C

Terminal

Small angle as

Preheating

155 to 165°C

possible up to

45 degrees

Terminal

Paste

60 to 120 sec.

Within 30 sec.

Time

solder

PC board

foot pattern

Pattern

For products other than the ones above,

please refer to the latest product

speciﬁcations.

7) The temperatures are measured at the

surface of the PC board near the

connector terminals. (The setting for the

sensor will differ depending on the sensor

used, so be sure to carefully read the

instructions that comes with it.)

8) The temperature proﬁles given in this

catalog are values measured when using

the connector on a resin-based PC

board. When performed reﬂow soldering

on a metal board (iron, aluminum, etc.) or

a metal table to mount on a FPC, make

sure there is no deformation or

discoloration of the connector beforehand

and then begin mounting.

9) Consult us when using a screen-

printing thickness other than that

recommended.

10) Some solder and ﬂux types may

cause serious solder creeping. Solder

and ﬂux characteristics should be taken

into consideration when setting the reﬂow

soldering conditions.

4) Consult us when using a screen-

printing thickness other than that

recommended.

5) When mounting on both sides of the

PC board and the connector is mounting

on the underside, use adhesives or other

means to ensure the connector is

properly ﬁxed to the PC board. (Double

reﬂow soldering on the same side is

possible.)

6) N²reﬂow, conducting reﬂow soldering

in a nitrogen atmosphere, increases the

solder ﬂow too greatly, enabling wicking

to occur. Make sure that the solder feed

rate and temperature proﬁle are

appropriate.

4) Be aware that soldering while applying

a load on the connector terminals may

cause improper operation of the

connector.

5) Thoroughly clean the soldering iron.

6) Flux from the solder wire may get on

the contact surfaces during soldering

operations. After soldering, carefully

check the contact surfaces and clean off

any solder before use.

7) For soldering of prototype devices

during product development, you can

perform soldering at the necessary

locations by heating with a hot-air gun by

applying cream solder to the foot pattern

beforehand. However, at this time, make

sure that the air pressure does not move

connectors by carefully holding them

down with tweezers or other similar tool.

Also, be careful not to go too close to the

connectors and melt any of the molded

components.

8) If an excessive amount of solder is

applied during manual soldering, the

solder may creep up near the contact

points, or solder interference may cause

imperfect contact.

3. Solder reworking

1) Finish reworking in one operation.

2) For reworking of the solder bridge, use

a soldering iron with a ﬂat tip. To prevent

ﬂux from climbing up to the contact

surfaces, do not add more ﬂux.

3) Keep the soldering iron tip temperature

below the temperature given in Table A.

ACCTB48E 201204-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

Notes on Using Narrow-pitch Connectors (Common)

Handling Single Components

1) Make sure not to drop or allow parts to

fall from work bench

4) Do not insert or remove the connector

when it is not soldered. Forcibly applied

external pressure on the terminals can

weaken the adherence of the terminals to

the molded part or cause the terminals to

lose their evenness.

Excessive force applied for insertion in a

pivot action as shown may also cause

product breakage.

Align the header and socket positions

before connecting them.

2) Excessive force applied to the

terminals could cause warping, come

out, or weaken the adhesive strength of

the solder. Handle with care.

3) Repeated bending of the terminals

may cause terminals to break.

5) Excessive prying-force applied to one

end may cause product breakage and

separation of the solder joints at the

terminal.

3) Since some powerful cleaning

solutions may dissolve molded

components of the connector and wipe

off or discolor printed letters, we

recommend aqua pura electronic parts

cleaners. Please consult us if you wish to

use other types of cleaning ﬂuids.

4) Please note that the surfaces of

molded parts may whiten when cleaned

with alcohol.

Cleaning ﬂux from PC board

Handling the PC board

1) To increase the cleanliness of the

cleaning ﬂuid and cleaning operations,

prepare equipment for cleaning process

beginning with boil cleaning, ultrasonic

cleaning, and then vapor cleaning.

2) Carefully oversee the cleanliness of

the cleaning ﬂuids to make sure that the

contact surfaces do not become dirty

from the cleaning ﬂuid itself.

• Handling the PC board after

mounting the connector

When cutting or bending the PC board

after mounting the connector, be careful

that the soldered sections are subjected

to excessive force.

The soldered areas should not be subjected to force.

Storage of connectors

1) To prevent problems from voids or air

pockets due to heat of reﬂow soldering,

avoid storing the connectors in areas of

high humidity. When storing the

Some connectors may change color

slightly if subjected to ultraviolet rays

during storage.This is normal and will not

affect the operation of the connector.

3) When storing the connectors with the

PC boards assembled and components

alreeady set, be careful not to stack them

up so the connectors are subjected to

excessive forces.

4) Avoid storing the connectors in

locations with excessive dust. The dust

may accumulate and cause improper

connections at the contact surfaces.

connectors for more than six months, be

sure to consider storage area where the

humidity is properly controlled.

2) Depending on the connector type, the

color of the connector may vary from

connector to connector depending on

when it is produced.

Other Notes

1) These products are made for the

design of compact and lightweight

devices and therefore the thickness of the

molded components has been made very

thin. Therefore, be careful during

insertion and removal operations for

excessive forces applied may damage

the products.

3) Before soldering, try not to insert or

remove the connector more than

absolutely necessary.

4) When coating the PC board after

soldering the connector to prevent the

deterioration of insulation, perform the

coating in such a way so that the coating

does not get on the connector.

6) The connectors are not meant to be

used for switching.

7) Be sure not to allow external pressure

to act on connectors when assembling

PCBs or moving in block assemblies.

2) Dropping of the products or rough

mishandling may bend or damage the

terminals and possibly hinder proper

reﬂow soldering.

5) There may be variations in the colors

of products from different production lots.

This is normal.

ACCTB48E 201204-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

Notes on Using Narrow-pitch Connectors (Common)

Regarding sample orders to conﬁrm proper mounting

When ordering samples to conﬁrm

proper mounting with the placement

machine, connectors are delivered in 50-

piece units in the condition given right.

Consult a sale representative for ordering

sample units.

Please refer to the latest product

speciﬁcations when designing your

product.

Condition when delivered from manufacturing

Reel

(Delivery can also be made on a reel by

customer request.)

Required number

Embossed tape

of products for

amount required for

sample production

the mounting

(Unit 50 pcs.)

ACCTB48E 201204-T

Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/

AXK5L30347G [PANASONIC]

相关型号：

AXK5L34337G

AXK5L34345J

AXK5L34345V

AXK5L34347G

AXK5L40337G

AXK5L40345J

AXK5L40345V

AXK5L40347G

AXK5L46337G

AXK5L46347G

AXK5L50337G

AXK5L50345V