AYF333735 [PANASONIC]
FPC connectors (0.3mm pitch) Back lock Y3B/Y3BW Series; FPC连接器( 0.3mm间距)返回锁Y3B / Y3BW系列型号: | AYF333735 |
厂家: | PANASONIC |
描述: | FPC connectors (0.3mm pitch) Back lock Y3B/Y3BW Series |
文件: | 总10页 (文件大小:572K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AYF33
For FPC
FPC connectors
(0.3mm pitch)
Back lock
Y3B/Y3BW
Series
FEATURES
w
Y3BW is added.
Ne
1. Slim and low profile design (Pitch:
0.3 mm)
7.Y3BW features advanced
functionality, including a structure to
temporarily hold the FPC and a higher
holding force.
Back lock type and the slim body with a
3.15 mm depth (with the lever).
The FPC holding contacts located on
both ends of the connector facilitate
positioning of FPC and further enhance
the FPC holding force.
Y3B
Structure to lock
notches on both
ends of the
FPC with
Unit: mm
holding
contacts
Y3BW
2. Mechanical design freedom is
achieved with double top and bottom
contacts
Applicable
FPC shapes
Top and bottom double contacts
eliminate the need of using different
connectors (with either top or bottom
contacts) depending on the FPC wiring
conditions.
3. Easy-to-handle back lock structure
4. Man-hours of assembly time can be
reduced by delivering the connectors
with their levers opened.
RoHS compliant
(1) The inserted FPC can be temporarily
held until the lever is closed.
(2) When the lever is closed, the holding
contacts lock the FPC by its notches,
enhancing the FPC holding force.
5. Wiring patterns can be placed
underneath the connector.
6. Ni barrier with high resistance to
solder creepage
APPLICATIONS
Mobile devices, such as cellular
phones, smartphones, digital still
cameras and digital video cameras.
ORDERING INFORMATION
AYF 3
3
5
33: FPC Connector 0.3 mm pitch
(Back lock)
Number of pins (2 digits)
Contact direction
3: Top and bottom double contacts (Y3B)
6: Top and bottom double contacts, lock holding type (Y3BW)
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au plating (Ni barrier)
ACCTB47E 201303-T
Panasonic Corporation Automation Controls Business Division
industrial.panasonic.com/ac/e/
AYF33
PRODUCT TYPES
Y3B
Packing
Height
Number of pins
Part number
Inner carton
Outer carton
7
AYF330735
AYF330835
AYF330935
AYF331135
AYF331335
AYF331535
AYF331735
AYF332135
AYF332335
AYF332535
AYF332735
AYF333135
AYF333335
AYF333535
AYF333735
AYF333935
AYF334535
AYF335135
AYF336135
8
9
11
13
15
17
21
23
25
27
31
33
35
37
39
45
51
61
0.9 mm
5,000 pieces
10,000 pieces
Y3BW
Packing
Height
Number of pins
Part number
Inner carton (1-reel)
5,000 pieces
Outer carton
11
25
51
AYF331165
AYF332565
AYF335165
0.9 mm
10,000 pieces
Notes: 1. Order unit; For volume production: 1-inner carton (1-reel) units.
Samples for mounting check: 50-connector units. Please contact our sales office.
Samples: Small lot orders are possible. Please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Item
Specifications
Conditions
Rated current
Rated voltage
Insulation resistance
0.2A/pin contact
50V AC/DC
Min. 1,000MΩ (initial)
Using 250V DC megger (applied for 1 min.)
Electrical
characteristics
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Breakdown voltage
Contact resistance
150V AC for 1 min.
Based on the contact resistance measurement method
specified by JIS C 5402.
Max. 100mΩ
Y3B: Min. 0.13N/pin contacts × pin contacts (initial)
Y3BW: Min. 0.13N/pin contacts × pin contacts +
1.00N (initial)
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
Mechanical
characteristics
FPC holding force
Ambient temperature
Storage temperature
–55°C to +85°C
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (°C) Time (minutes)
0
1
2
3
4
–55−3
30
Max. 5
30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 80mΩ
Thermal shock resistance
(with FPC mated)
85+3
0
Max. 5
0
–55−3
Environmental
characteristics
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Humidity resistance
(with FPC mated)
Bath temperature 40 2°C,
humidity 90 to 95% R.H.
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Saltwater spray resistance
(with FPC mated)
Bath temperature 35 2°C,
saltwater concentration 5 1%
H2S resistance
(with FPC mated)
48 hours,
contact resistance max. 100mΩ
Bath temperature 40 2°C, gas concentration 3 1 ppm,
humidity 75 to 80% R.H.
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
Reflow soldering
Soldering iron
Soldering heat resistance
Insertion and removal life
Lifetime
characteristics
20 times
Repeated insertion and removal: min. 10 sec./time
Y3B: 61 pin contact type: 0.10 g
Y3BW: 51 pin contact type: 0.09 g
Unit weight
ACCTB47E 201303-T
Panasonic Corporation Automation Controls Business Division
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AYF33
2. Material and surface treatment
Part name
Material
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Surface treatment
—
Molded portion
Contact
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Copper alloy
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
DIMENSIONS (Unit: mm)
Y3B
No. of pins: Odd number
No. of pins: Even number (8 pins)
CAD Data
CAD Data
A
3.90
0.60 0.10 (Terminal pitch)
0.60 0.10 (Terminal pitch)
Number of
pins/
A
B
C
dimension
7
3.60
4.20
4.80
5.40
6.00
6.60
7.80
8.40
9.00
9.60
10.80
11.40
1.80
2.40
3.00
3.60
4.20
4.80
6.00
6.60
7.20
7.80
9.00
9.60
1.20
1.80
2.40
3.00
3.60
4.20
5.40
6.00
6.60
7.20
8.40
9.00
9.60
9
11
13
15
17
21
23
25
27
31
33
35
37
39
45
51
61
0.30 0.10 (Contact pitch)
0.30 0.10 (Terminal pitch)
0.60 0.10 (Terminal pitch)
0.60 0.10
(Terminal pitch)
(3.15)
(3.15)
The degree of
terminal flat
Terminal
coplanarity
0.1
0.1
(1.35)
(FPC
(Contact)
(1.35)
(FPC
insertion
depth)
(Contact)
2.95
2.95
insertion
depth)
B 0.20
(0.10)
1.80 0.20
(0.10)
12.00 10.20
12.60 10.80 10.20
13.20 11.40 10.80
15.00 13.20 12.60
16.80 15.00 14.40
19.80 18.00 17.40
(0.10)
(0.10)
1.80 0.20
C 0.20
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AYF33
RECOMMENDED FPC DIMENSIONS
Y3B
(Finished thickness: t = 0.2 0.03)
The conductive parts should be based by Ni plating and then Au plating.
Number of
pins/
dimension
A
B
C
No. of pins: Odd number
7
2.40
3.00
3.60
4.20
4.80
5.40
6.60
7.20
7.80
8.40
9.60
10.20
1.80
2.40
3.00
3.60
4.20
4.80
6.00
6.60
7.20
7.80
9.00
9.60
1.20
1.80
2.40
3.00
3.60
4.20
5.40
6.00
6.60
7.20
8.40
9.00
9.60
A 0.05
B 0.03
9
0.30 0.07
0.30 0.07
C 0.03
0.60 0.02 (Pitch)
0.30 0.02 (Pitch)
+0.04
11
13
15
17
21
23
25
27
31
33
35
37
39
45
51
61
0.10 max.
0.30
(Contact width)
–0.03
0.20 0.03
10.80 10.20
11.40 10.80 10.20
12.00 11.40 10.80
13.80 13.20 12.60
15.60 15.00 14.40
18.60 18.00 17.40
0.60 0.07
0.10 max.
0.20 0.02
0.30+–00..0034 (Contact width)
0.60 0.07
0.60 0.02 (Pitch)
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing plate side.
No. of pins: Even number (8 pins)
For Top Contacts
For Bottom Contacts
2.70 0.05
1.80 0.03
1.80 0.03
2.70 0.05
1.80 0.03
1.80 0.03
0.30 0.07
0.30 0.07
0.60 0.02 (pitch)
0.30 0.02 (pitch)
0.10 max.
0.60 0.02 (pitch)
0.30 0.07
0.30 0.07
0.30 0.02 (pitch)
+0.04
+0.04
0.30
−0.03
0.30
−0.03
(Width of contact area)
(Width of contact area)
0.10 max.
0.20 0.03
0.20 0.03
+0.04
0.10 max.
0.20 0.02
0.60 0.07
0.30
−0.03
+0.04
(Width of contact area)
0.10 max.
0.20 0.02
0.60 0.07
0.30
−0.03
(Width of contact area)
0.60 0.07
0.60 0.07
0.60 0.02 (pitch)
0.60 0.02 (pitch)
Cutting direction*
Cutting direction*
*Cut FPC from the copper foil side
to the reinforcing board side.
*Cut FPC from the copper foil side
to the reinforcing board side.
ACCTB47E 201303-T
Panasonic Corporation Automation Controls Business Division
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AYF33
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
DIMENSIONS (Unit: mm)
Y3BW
CAD Data
A
0.60 0.10 (Contact pitch)
0.30 0.10 (Contact pitch)
0.60 0.10 (Contact pitch)
(3.15)
Holding contacts
(The holding contacts cannot be used as conductors.)
Terminal coplanarity
(1.35) (FPC insertion depth)
(2.95)
0.1
(Contact and holding contact)
B 0.20
(0.10)
General tolerance: 0.3
Number of pins/
dimension
A
B
C
D
(0.10)
(0.10)
11
25
51
5.40
9.60
3.00
7.20
2.40
6.60
3.60
7.80
C 0.20
D 0.20
17.40 15.00 14.40 15.60
RECOMMENDED FPC DIMENSIONS
Y3BW
(Finished thickness: t = 0.2 0.03)
The conductive parts should be based by Ni plating and then Au plating.
A 0.05
B 0.03
C 0.03
0.60 0.07
0.60 0.07
0.60 0.02 (Pitch)
0.30 0.02 (Pitch)
+0.04
0.30
(Contact width)
−0.03
0.20 0.03
0.10 max.
Number of pins/
dimension
0.90 0.07
A
B
C
11
25
51
4.20
8.40
3.00
7.20
2.40
6.60
+0.03
0.10 max.
0.20 0.02
0.45
−0.05
Cutting direction
0.90 0.07
0.60 0.02 (Pitch)
Cut FPC from the copper foil side
to the reinforcing plate side.
+0.04
−0.03
0.30
(Contact width)
16.20 15.00 14.40
ACCTB47E 201303-T
Panasonic Corporation Automation Controls Business Division
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AYF33
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact type)
• Specifications for taping
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I
Tape II
(A 0.3)
(A 0.3)
28.40
(B)
(1.75)
(B)
(1.75)
(C 1)
Taping reel
Top cover tape
Embossed carrier tape
Embossed mounting-hole
Label
• Y3B Dimension table (Unit: mm)
Number of pins
Type of taping
A
B
C
Quantity per reel
5,000
7 to 17
Tape I
Tape I
16.00
24.00
32.00
7.50
11.50
14.20
17.40
25.40
33.40
21 to 45
5,000
51, 61
Tape II
5,000
• Y3BW Dimension table (Unit: mm)
Number of pins
Type of taping
A
B
C
Quantity per reel
5,000
11
25
51
Tape I
Tape I
Tape II
16.00
24.00
32.00
7.50
11.50
14.20
17.40
25.40
33.40
5,000
5,000
• Connector orientation with respect to embossed tape feeding direction
Type
Direction
Y3B
Y3BW
of tape progress
NOTES
1. Recommended PC board and metal
mask patterns
•Y3B
No. of pins: Odd number
No. of pins: Even number (8 pins)
Recommended PC board pattern
(mounting layout)
Recommended PC board pattern
Connectors are mounted with high pitch
density, intervals of 0.3 mm or 0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
(mounting layout)
(TOP VIEW)
(TOP VIEW)
0.60 0.03
0.23 0.03
0.60 0.03
0.23 0.03
0.23 0.03
0.60 0.03
0.23 0.03
0.60 0.03
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 120µm
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
Metal mask thickness: When 120µm
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
0.60 0.01
0.22 0.01
0.60 0.01
0.22 0.01
0.22 0.01
0.60 0.01
0.22 0.01
0.60 0.01
ACCTB47E 201303-T
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AYF33
•Y3BW
Recommended PC board pattern
Please refer to the latest product
specifications when designing your
product.
(mounting layout)
(TOP VIEW)
: Insulation
0.60 0.03
0.23 0.03
0.30 0.03
0.23 0.03
0.60 0.03
Recommended metal mask pattern
Metal mask thickness: When 120µm
(Front terminal portion opening area ratio: 96%)
(Back terminal portion opening area ratio: 96%)
0.60 0.01
0.22 0.01
0.22 0.01
0.60 0.01
ACCTB47E 201303-T
Panasonic Corporation Automation Controls Business Division
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Notes on Using FPC Connectors
■ PC board design
• The recommended reflow temperature profile is given in the
figure below.
Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
■ FPC and equipment design
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Temperature
Peak temperature
260°C
230°C
• Design the FPC based with recommended dimensions to
ensure the required connector performance.
• When using back lock type, secure enough space for closing
the lever and for open-close operation of the lever.
• Make sure that connector positioning and FPC length are
appropriate to prevent diagonal insertion of the FPC.
Due to the FPC size, weight, or the reaction force of the routed
FPC, FPC may be removed. Carefully check the equipment
design.
220°C
200°C
Preheating
180°C
150°C
25 sec.
70 sec.
60 to 120 sec.
Time
• The temperature is measured on the surface of the PC board
near the connector terminals.
Take required measures to prevent the FPC from being removed
due to a fall, vibration, or other impact.
• Depending on reflow condition, poor contact may occur by
solder and flux wicking.
Please set the reflow conditions that considering the
characteristics of solder and flux. Also please make
consideration in setting the reflow times and O2 concentration to
prevent poor contact by solder and flux wicking.
• When performing reflow soldering on the back of the PC board
after reflow soldering the connector, secure the connector using,
for example, an adhesive.
(Y3BW/Y5BW)
■ The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the contacts,
and the shape of the soldered portions is the same as that of the
other contacts.
Use caution to ensure connect identification.
(Double reflow soldering on the same side is possible.)
Do not touch the lever or apply any load to the lever until the
second reflow soldering. Otherwise, contact deflection occurs
and the terminals may be deformed by reflow heating.
3) Reworking on a soldered portion
(Y3BL)
■ Soldering terminal structure
Since soldering terminals touch FPC, note that the short circuit
may occur when the metal parts exposed on side of FPC.
• Finish reworking in one operation.
■ Connector mounting
• For reworking of the solder bridge, use a soldering iron with a
flat tip.
Do not add flux, otherwise the flux may creep to the contact
parts.
Excessive mounter chucking force may deform the molded or
metal part of the connector. Consult us in advance if chucking is
to be applied.
■ Soldering
1) Manual soldering
• Due to the connector’s compact size, if an excessive amount of
solder is applied during manual soldering, the solder may creep
up and flux wicking near the contact points, or solder
interference may cause contact failure.
When adding the solder for reworking, do not add an excessive
solder. Otherwise, solder and flux may creep up and solder
bridges may occur.
• Use a soldering iron whose tip temperature is within the
temperature range specified in the specifications.
• Make sure that the soldering iron tip is heated within the
temperature and time limits indicated in the specifications.
• Flux from the solder wire may adhere to the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and cleans off any flux solder use.
• Be aware that a load applied to the connector terminals while
soldering may displace the contact.
■ Do not drop or handle the connector carelessly.
Otherwise, the terminals may become deformed due to
excessive force or applied solderability may be during
reflow degrade.
■ Do not open/close the lever or insert/remove an FPC until
the connector is soldered. Forcibly applied external
pressure on the terminals can weaken the adherence of the
terminals to the molded part or cause the terminals to lose
their evenness. In addition, do not insert an FPC into the
connector before soldering the connector.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for printing paste solder.
• To achieve the appropriate soldering state, make sure that the
reflow temperature, PC board foot pattern, window size and
thickness of metal mask are recommended condition.
• Note that excess solder on the terminals prevents complete
insertion of the FPC, and causes flux climbing up.
• A screen thickness of 120µm is recommended during cream
solder printing.
■ When cutting or bending the PC board after mounting the
connector, be careful that the soldered sections are
subjected to excessive force.
The soldered areas should not be subjected to force.
• Consult us when using a screen-printing thickness other than
that recommended.
• Depending on the size of the connector being used, self
alignment may not be possible. Accordingly, carefully position
the terminal with the PC board pattern.
ACCTB13E 201303-T
Panasonic Corporation Automation Controls Business Division
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Notes on Using FPC Connectors
■ Precautions for insertion/removal of FPC
<Front-Lock>
<Back-Lock>
• Avoid touching the lever (applying any external force) until an
• To open the lever, hold its center and pull it up. An uneven load
applied to the lever on one side may deform and break the lever.
Do not apply an excessive load to the lever in the opening
direction, otherwise, the terminals may be deformed.
• Don’t further apply an excessive load to the fully opened lever;
otherwise, the lever may be deformed.
FPC is inserted.
Do not open/close the lever without an FPC inserted. Failure to
follow this instruction will cause the contacts to warp, leading to
the contact tips to interfere with the insertion of an FPC,
deforming the terminals. Failure to follow this instruction may
cause the lever to be removed, terminals to be deformed, and/or
the FPC insertion force to increase.
• Fully open the lever to insert an FPC.
• Since this product connects at the bottom, please insert the
FPC so that its electrode plane is facing the board to which it will
be mounted. Do not insert the FPC in the reverse direction of the
contact section; otherwise, operation failures or malfunctions
may be caused.
Without an FPC inserted
(140°)
• The FPC insertion section is on the opposite side of the lever.
Be careful not to make a mistake in the FPC insertion position or
the lever opening/closing position. Otherwise, a contact failure or
connector breakage may occur.
• Do not insert an FPC upside down. Inserting an FPC in a
direction opposite to that you intended may cause an operation
failure or malfunction.
(Y3FT)
• This product has a structure to position an inserted FPC using
the FPC tabs.
• Insert an FPC with the lever opened at right angle, that is, in
the factory default position.
Therefore, insert an FPC at an angle to the board. If the FPC is
inserted in the direction parallel to the board, the molded
positioning parts block the FPC, leading to incomplete insertion.
Do not insert the FPC at an excessive angle to the board.
Otherwise, it may cause the deformation of metal parts, FPC
insertion failures, and FPC circuit breakages.
• Completely insert the FPC horizontally. An FPC inserted at an
excessive angle to the board may cause the deformation of
metal parts, FPC insertion failures, and FPC circuit breakages.
• Insert the FPC to the full depth of the connector without
altering the angle.
• Insert the FPC into the connector after checking the position of
FPC insertion slot and FPC. Do not insert the FPC without
positioning the FPC and connector. Otherwise, it may cause
connector breakages. When it is hard to insert the FPC, do not
insert the FPC on that condition. Confirm the FPC and
connector positioning.
FPC
• Do not apply an excessive load to the lever in the opening
direction beyond its open position; otherwise, the lever may be
deformed or removed.
FPC positioning part
(Y3F)
• Do not apply an excessive load to the lever in a direction
perpendicular to the lever rotation axis or in the lever opening
direction; otherwise, the terminals may be deformed, and the
lever may be removed.
• Completely insert the FPC horizontally. Do not insert the FPC
at an excessive angle to the board. Otherwise, it may cause the
deformation of metal parts, FPC insertion failures, and FPC
circuit breakages.
FPC
• Insert the FPC to the full depth of the connector without
altering the angle.
• To close the lever, turn down the lever by pressing the entire
lever or both sides of the lever with fingers tips. And close the
lever completely. Be careful not to apply partial load to the lever
that may cause its deformation or destruction.
Close the lever completely to prevent contact failure.
• If pressure to the lever is applied unevenly, it may deform or
break the FPC. Make sure that the lever is closed completely.
Not doing so will cause a faulty connection.
• Avoid applying an excessive load to the top of the lever during
or after closing the lever. Otherwise, the terminals may be
deformed.
• When opening the lever to remove the FPC, ensure that the
lever will not go over the initial position; otherwise, the lever may
be removed.
• When closing the lever, carefully use the tip of your finger to
push the entire lever or both sides of it. If pressure to the lever is
applied unevenly, IE: only the edge, it may deform or break the
FPC. Make sure that the lever is closed completely. Not doing so
will cause a faulty connection.
• Avoid applying an excessive load to the top of the lever during
or after closing the lever. Otherwise, the terminals may be
deformed.
• Remove the FPC at an angle with the lever fully opened. If the
lever is closed, or if the FPC is forcedly pulled into a direction
parallel to the board, the molded part may break.
ACCTB13E 201303-T
Panasonic Corporation Automation Controls Business Division
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Notes on Using FPC Connectors
• Remove the FPC at parallel with the lever fully opened. If the
lever is closed, or if the FPC is forcedly pulled, the product or
FPC may break.
• If a lever is accidentally detached during the handling of a
connector, do not use the connector any longer.
■ After an FPC is inserted, carefully handle it so as not to
apply excessive stress to the base of the FPC. When using
FPC with a bent condition, please pay attention to
precautions below; otherwise, in some conditions it may
cause conduction failure, connector breakage, unlocking
lever or FPC disconnection.
• Design so that a load is not applied to connector directly by
FPC bending.
• Avoid sharp FPC bending at the root of FPC insertion part.
• Design so that a load is not applied to the part of FPC bending.
• Fix the FPC if there might be a load on FPC when using the
FPC with cutout, do not apply a bending load to the cutout part
of FPC. Otherwise, it may cause FPC disconnection and
deformation since the cutout part of FPC is subjected to bending
stress.
FPC cutout part
■ Other cautions
• When coating the PC board after soldering the connector (to
prevent the deterioration of insulation), perform the coating in
such a way so that the coating does not get on the connector.
• The connectors are not meant to be used for switching.
• There is no problem on the product quality though the swelling
and the black spot, etc. might be generated in the molding parts.
Please refer to the latest product specifications when
designing your product.
ACCTB13E 201303-T
Panasonic Corporation Automation Controls Business Division
industrial.panasonic.com/ac/e/
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