CNB1011P [PANASONIC]

Reflective photosensor; 反射型光电传感器
CNB1011P
型号: CNB1011P
厂家: PANASONIC    PANASONIC
描述:

Reflective photosensor
反射型光电传感器

光电 传感器
文件: 总3页 (文件大小:100K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Reflective Photosensors (Photo Reflectors)  
CNB1011  
Reflective photosensor  
Unit: mm  
1
4
C0.3  
Non-contact point SW, object sensing  
Features  
Ultraminiature, thin type: 2.29 mm × 2.9 mm (height: 0.88 mm)  
2
3
0.577  
0.748  
1.325  
Absolute Maximum Ratings Ta = 25°C  
0.75 max.  
1.7  
0.75 max.  
1.7  
1.285  
2.29 0.1  
5.69 0.3  
2.9 0.1  
Parameter  
Input (Light Reverse voltage  
emitting diode) Forward current  
Power dissipation *  
Symbol Rating  
Unit  
V
VR  
IF  
6
4-0.5  
1.45  
30  
75  
35  
mA  
mW  
V
1
PD  
1: Anode  
Output (Photo Collector-emitter voltage VCEO  
2: Cathode  
3: Emitter  
4: Collector  
transistor)  
(Base open)  
0.7  
1.4  
Emitter-collector voltage VECO  
(Base open)  
6
V
PRSMW104-002 Package  
(Note) Tolerance unless otherwise specified is 0.2  
Collector current  
IC  
20  
75  
mA  
mW  
°C  
2
Collector power dissipation *  
PC  
Temperature Operating ambient temperature Topr  
Storage temperature  
Note) 1: Input power derating ratio is 1.0 mW/°C at T 25°C.  
25 to +85  
Tstg 40 to +100  
°C  
*
a
2: Output power derating ratio is 1.0 mW/°C at T 25°C.  
*
a
Electrical-Optical Characteristics Ta = 25°C 3°C  
Parameter  
Symbol  
VF  
Conditions  
Min  
Typ  
Max  
1.30  
10  
Unit  
V
Input  
Forward voltage  
IF = 4 mA  
VR = 3 V  
1.15  
characteristics Reverse current  
IR  
µA  
nA  
Output  
Collector-emitter cutoff current ICEO  
VCE = 20 V  
100  
characteristics  
(Base open)  
1
Transfer  
Collector current *  
IC  
ID  
VCE = 2 V, IF = 4 mA, d = 1 mm  
VCE = 2 V, IF = 4 mA  
40  
243  
100  
0.4  
µA  
nA  
V
characteristics Dark current  
Collector-emitter saturation voltage VCE(sat) IF = 20 mA, IC = 0.1 mA  
2
Rise time *  
tr  
tf  
VCC = 2 V, IC = 0.1 mA  
RL = 1000 Ω  
40  
50  
µs  
µs  
2
Fall time *  
Note) 1. Input and output are handled electrically.  
2. This product is not designed to withstand radiation  
3. 1: Output current measurement method  
*
2: Switching time measurement circuit  
*
tr: Rise time  
tf: Fall time  
Glass plate  
evaporated Al  
Glass plate  
evaporated Al  
d = 1 mm  
d = 1 mm  
Sig. in  
Sig. out  
90%  
10%  
RL  
IF  
IC  
VCC  
Sig.  
out  
Sig. in  
50 Ω  
VCC  
RL  
tr  
tf  
Publication date: April 2004  
SHG00056BED  
1
CNB1011  
IF , IC Ta  
IF VF  
IC IF  
104  
103  
102  
10  
60  
50  
40  
30  
20  
10  
0
40  
Ta = 25°C  
VCE = 2 V  
Ta = 25°C  
RL = 100 Ω  
d = 1 mm  
IF  
30  
IC  
20  
10  
0
101  
1
10  
102  
25  
0
0.4  
0.8  
1.2  
1.6  
2.0  
2.4  
0
20  
40  
60  
80  
100  
Forward voltage VF (V)  
Forward current IF (mA)  
Ambient temperature Ta (°C)  
VF Ta  
IC VCE  
IC Ta  
104  
103  
102  
10  
1.6  
160  
120  
80  
Ta = 25°C  
VCC = 2 V  
IF = 4 mA  
RL = 100 Ω  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
IF = 20 mA  
IF = 10 mA  
15 mA  
10 mA  
8 mA  
6 mA  
4 mA  
4 mA  
1 mA  
2 mA  
40  
1
0
40  
0
2
4
6
8
40  
0
40  
80  
0
40  
80  
Collector-emitter voltage VCE (V)  
Ambient temperature Ta (°C)  
Ambient temperature Ta (°C)  
ICEO Ta  
tr , tf IC  
IC d  
103  
102  
10  
1
10  
1
VCC = 2 V  
Ta = 25°C  
IF = 4 mA  
VCC = 20 V  
VCC = 2 V  
Ta = 25°C  
: tr  
100  
80  
60  
40  
20  
0
: tf  
101  
102  
103  
104  
105  
RL = 2 kΩ  
1 kΩ  
100 Ω  
102  
101  
1
10  
20  
0
20  
40  
60  
80  
100  
0
2
4
6
8
10  
12  
Collector current IC (mA)  
Distance d (mm)  
Ambient temperature Ta (°C)  
SHG00056BED  
2
Caution for Safety  
This product contains Gallium Arsenide (GaAs).  
GaAs powder and vapor are hazardous to human health if inhaled or  
ingested. Do not burn, destroy, cut, cleave off, or chemically dis-  
solve the product. Follow related laws and ordinances for disposal.  
The product should be excluded form general industrial waste or  
household garbage.  
DANGER  
Request for your special attention and precautions in using the technical information  
and semiconductors described in this material  
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of  
the products or technical information described in this material and controlled under the "Foreign Exchange  
and Foreign Trade Law" is to be exported or taken out of Japan.  
(2) The technical information described in this material is limited to showing representative characteristics and  
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right  
or any other rights owned by our company or a third party, nor grants any license.  
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical  
information as described in this material.  
(4) The products described in this material are intended to be used for standard applications or general elec-  
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-  
hold appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-  
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are  
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human  
body.  
Any applications other than the standard applications intended.  
(5) The products and product specifications described in this material are subject to change without notice for  
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,  
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-  
tions satisfy your requirements.  
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-  
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not  
be liable for any defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of  
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such  
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent  
physical injury, fire, social damages, for example, by using the products.  
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life  
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually  
exchanged.  
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written  
permission of Matsushita Electric Industrial Co., Ltd.  
2003 SEP  

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