CNZ2179S [PANASONIC]
Diffuse Photoelectric Sensor, 5mm Min, 5mm Max, 0.18-1.50mA, Rectangular, Through Hole Mount, PRSTR104-004, 4 PIN;
| 型号： | CNZ2179S |
| 厂家： | 
PANASONIC |
| 描述： | Diffuse Photoelectric Sensor, 5mm Min, 5mm Max, 0.18-1.50mA, Rectangular, Through Hole Mount, PRSTR104-004, 4 PIN |
| 文件： | 总3页 (文件大小：86K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reflective Photosensors (Photo Reflectors)
CNZ2179 (ON2179)
Reflective photosensor
Unit: mm
Non-contact point SW, object sensing
■ Overview
13.0
CNZ2179 is a reflective photosensor with a long focal distance,
in which a high efficiency GaAs infrared light emitting diode is
used as a light emitting element and a high sensitivity Si
phototransistor is used as the light detecting element.
0.85 max.
(2-0.5)
(2-0.5)
(2.54)
■ Features
(7.6)
• Long focal distance: 6 mm (typ.)
• Visible light cutoff resin is used
1
2
4
1: Anode
2: Cathode
3: Collector
4: Emitter
■ Absolute Maximum Ratings Ta = 25°C
3
Parameter
Input (Light Reverse voltage
emitting diode) Forward current
Power dissipation *
Symbol Rating
Unit
V
PRSTR104-004 Package
VR
IF
3
(Note) 1. Tolerance unless otherwise specified is 0.3
2. ( ) Dimension is reference
50
75
20
mA
mW
V
1
PD
Output (Photo Collector-emitter voltage VCEO
transistor)
(Base open)
Emitter-collector voltage VECO
(Base open)
5
V
Note) 1: Input power derating ratio is
*
Collector current
IC
20
mA
mW
°C
1.25 mW/°C at Ta ≥ 25°C.
2
Collector power dissipation *
PC
100
2: Output power derating ratio is
*
Temperature Operating ambient temperature Topr
Storage temperature Tstg
−25 to +80
−30 to +85
1.67 mW/°C at Ta ≥ 25°C.
°C
■ Electrical-Optical Characteristics Ta = 25°C 3°C
Parameter
Symbol
VF
Conditions
Min
Typ
Max
Unit
Input
Forward voltage
IF = 50 mA
1.3
1.5
V
characteristics Reverse current
IR
VR = 3 V
10
µA
Output
VCE = 10 V
200
nA
Collector-emitter cutoff current ICEO
(Base open)
characteristics
1, 2
Transfer
Collector current *
IC
VCE = 5 V, IF = 20 mA, d = 5 mm
180
1 500
0.5
µA
V
characteristics Collector-emitter saturation voltage VCE(sat) IF = 50 mA, IC = 0.1 mA
Rise time
Fall time
tr
tf
VCC = 10 V, IC = 0.1 mA, RL = 100 Ω
20
20
µs
µs
Note) 1. Input and output are handled electrically.
2. This product is not designed to withstand radiation
3. 1: Output current measurement circuit
*
VCC
IF
IC
(Ambient light is shut off completely)
2: Rank classification
*
d = 5 mm
Rank
Q
R
S
RL
White paper
(Reflective ratio 90%)
IC (µA)
180 to 550 300 to 900 500 to 1500
Note) The part number in the parenthesis shows conventional part number.
Publication date: April 2004
SHG00054BED
1
CNZ2179
IF , IC Ta
IF VF
VF Ta
60
60
50
40
30
20
10
0
1.6
1.2
0.8
0.4
0
Ta = 25°C
IF
50
IF = 50 mA
10 mA
40
30
1 mA
IC
20
10
0
−25
−40
0
20
40
60
80
100
0
0.4
0.8
1.2
1.6
2.0
2.4
0
40
80
Forward voltage VF (V)
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
IC IF
IC VCE
∆IC Ta
102
102
10
160
120
80
40
0
Ta = 25°C
VCE = 5 V
Ta = 25°C
VCC = 5 V
IF = 20 mA
RL = 100 Ω
10
1
1
IF = 30 mA
20 mA
10 −1
10 −1
10 mA
10 −2
10 −1
10 −2
10 −1
102
1
10
102
0
40
80
−40
1
10
Forward current IF (mA)
Collector-emitter voltage VCE (V)
Ambient temperature Ta (°C)
ICEO Ta
tr IC
∆IC d
10
1
103
100
80
60
40
20
0
VCC = 10 V
Ta = 25°C
VCE = 10 V
102
10
RL = 1 kΩ
10 −1
10 −2
10 −3
500 Ω
100 Ω
1
VCC = 5 V
Ta = 25°C
RL = 100 Ω
IF = 20 mA
10 −1
10 −2
10 −1
1
10
0
4
8
12
16
−40
0
40
80
Ambient temperature Ta (°C)
Collector current IC (mA)
Distance d (mm)
SHG00054BED
2
Caution for Safety
■ This product contains Gallium Arsenide (GaAs).
GaAs powder and vapor are hazardous to human health if inhaled or
ingested. Do not burn, destroy, cut, cleave off, or chemically dis-
solve the product. Follow related laws and ordinances for disposal.
The product should be excluded form general industrial waste or
household garbage.
DANGER
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general elec-
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-
hold appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-
tions satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP
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