DA2J10400L [PANASONIC]

Silicon epitaxial planar type For high speed switching circuits; 硅外延平面型对于高速开关电路
DA2J10400L
型号: DA2J10400L
厂家: PANASONIC    PANASONIC
描述:

Silicon epitaxial planar type For high speed switching circuits
硅外延平面型对于高速开关电路

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中文:  中文翻译
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Doc No. TT4-EA-11489  
Revision. 3  
Switching Diode  
DA2J10400L  
DA2J10400L  
Silicon epitaxial planar type  
Unit: mm  
1.25  
0.35  
0.13  
For high speed switching circuits  
2
Features  
Small reverse current IR  
Low terminal capacitance Ct  
Halogen-free / RoHS compliant  
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)  
1
Marking Symbol:  
Packaging  
C1  
0.5  
0.7  
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)  
1. Cathode  
2. Anode  
Panasonic  
JEITA  
SMini2-F5-B  
SC-90A  
Code  
Absolute Maximum Ratings Ta = 25 C  
Parameter  
Reverse voltage  
Symbol  
VR  
Rating  
80  
Unit  
V
Internal Connection  
Maximum peak reverse voltage  
Forward current  
Peak forward current  
Non-repetitive peak forward surge current  
Junction temperature  
Operating ambient temperature  
Storage temperature  
VRM  
IF  
IFM  
IFSM  
Tj  
Topr  
Tstg  
80  
200  
600  
1
150  
V
2
mA  
mA  
A
°C  
°C  
°C  
*1  
-40 to +85  
-55 to +150  
1
Note)*1: t = 1 s  
Page 1 of 4  
Established : 2009-09-11  
Revised  
: 2013-05-29  
Doc No. TT4-EA-11489  
Revision. 3  
Switching Diode  
DA2J10400L  
Electrical Characteristics Ta = 25 C 3 C  
Parameter  
Forward voltage  
Reverse voltage  
Reverse current  
Symbol  
Conditions  
IF = 200 mA  
IR = 100 μA  
Min Typ Max  
Unit  
V
V
nA  
pF  
VF  
VR  
IR  
0.90 1.10  
80  
VR = 80 V  
500  
4
Terminal capacitance  
Ct  
VR = 0 V, f = 1 MHz  
IF = 10 mA, VR = 6 V  
Irr = 0.25 × IR  
Reverse recovery time *1  
trr  
10  
ns  
Note)1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.  
2. Absolute frequency of input and output is 100 MHz.  
3. *1: trr test circuit  
Input Pulse  
tp  
Output Pulse  
trr  
Bias Application Unit (N-50BU)  
tr  
t
10%  
IF  
t
A
90%  
VR  
Irr = 0.25 × IR  
IF = 10 mA  
VR = 6 V  
tp = 2 μs  
tr = 0.35 ns  
δ = 0.05  
Pulse Generator  
Wave Form Analyzer  
(SAS-8130)  
Ri = 50 Ω  
(PG-10N)  
Rs = 50 Ω  
Page 2 of 4  
Established : 2009-09-11  
Revised  
: 2013-05-29  
Doc No. TT4-EA-11489  
Revision. 3  
Switching Diode  
DA2J10400L  
Technical Data ( reference )  
IF - VF  
IR - VR  
1.E+00  
1.E-01  
1.E-02  
1.E-03  
1.E-04  
1.E-05  
1.E-06  
1.E-04  
IR value is not exceeding  
100 pA at -40 °C  
Ta = 125 °C  
1.E-05  
1.E-06  
1.E-07  
1.E-08  
1.E-09  
1.E-10  
Ta = 125 °C  
85 °C  
85 °C  
25 °C  
25 °C  
-40 °C  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
20  
40  
60  
80  
Forward voltage VF (V)  
Reverse voltage VR (V)  
Ct - VR  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
Ta = 25 °C  
f = 1 MHz  
0
10  
20  
30  
40  
Reverse voltage VR (V)  
Page 3 of 4  
Established : 2009-09-11  
Revised : 2013-05-29  
Doc No. TT4-EA-11489  
Revision. 3  
Switching Diode  
DA2J10400L  
SMini2-F5-B  
Unit: mm  
1.25±0.10  
0.35±0.05  
0.13+-0.052  
2
1
0.50±0.05  
0 to 0.05  
(5°)  
Land Pattern (Reference) (Unit: mm)  
0.9  
1.1  
Page 4 of 4  
Established : 2009-09-11  
Revised : 2013-05-29  
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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