DA4J104K

更新时间:2025-07-10 17:43:32
品牌:PANASONIC
描述:Rectifier Diode, 2 Element, 0.2A, 80V V(RRM), Silicon, ROHS COMPLIANT, SMINI4-F3-B, 4 PIN

DA4J104K 概述

Rectifier Diode, 2 Element, 0.2A, 80V V(RRM), Silicon, ROHS COMPLIANT, SMINI4-F3-B, 4 PIN 整流二极管

DA4J104K 规格参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:ROHS COMPLIANT, SMINI4-F3-B, 4 PIN
针数:4Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.70
风险等级:5.71配置:SEPARATE, 2 ELEMENTS
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):1.1 VJESD-30 代码:R-PDSO-F4
元件数量:2端子数量:4
最高工作温度:150 °C最低工作温度:-55 °C
最大输出电流:0.2 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
最大重复峰值反向电压:80 V最大反向电流:0.5 µA
最大反向恢复时间:0.01 µs反向测试电压:75 V
子类别:Other Diodes表面贴装:YES
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

DA4J104K 数据手册

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This product complies with the RoHS Directive (EU 2002/95/EC).  
DA4J104K  
Silicon epitaxial planar type  
For high speed switching circuits  
Package  
Features  
Small reverse current IR  
Code  
Low terminal capacitance Ct  
SMini4-F3-B  
Contributes to miniaturization of sets, reduction of component count.  
Eco-friendly Halogen-free package  
Package dimension clicks here.  
Click!  
Pin Name  
Basic Part Number  
1:Anode-1  
2:Anode-2  
3: Cathode-2  
4: Cathode-1  
Double DA2J104 (Parallel)  
Packaging  
Marking Symbol: C1  
Internal Connection  
DA4J104K0R Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)  
Absolute Maximum Ratings Ta = 25°C  
4
3
Parameter  
Symbol  
VR  
Rating  
Unit  
V
Reverse voltage  
80  
Maximum peak reverse voltage  
VRM  
IF  
80  
200  
V
1
2
1
Forward current *  
mA  
mA  
A
Peak forward current  
IFM  
600  
2
Non-repetitive peak forward surge current *  
IFSM  
Tj  
1
Junction temperature  
150  
°C  
°C  
Storage temperature  
T
stg  
–55 to +150  
Note) 1: I = 200 mA achieved with a printed circuit board.  
*
F
2: 1 t = 1 s  
*
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max  
Unit  
V
Forward voltage  
Reverse voltage  
Reverse current  
VF  
VR  
IR  
IF = 200 mA  
IR = 100 mA  
VR = 80 V  
0.90  
1.10  
80  
V
500  
4
nA  
pF  
ns  
Terminal capacitance  
Ct  
VR = 0 V, f = 1 MHz  
Reverse recovery time *  
trr  
IF = 10 mA, VR = 6 V, Irr = 0.25 × IR  
10  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. Absolute frequency of input and output is 100 MHz  
3. : trr measurement circuit  
*
Input Pulse  
tp  
Output Pulse  
trr  
Bias Application Unit (N-50BU)  
tr  
t
10%  
IF  
t
A
90%  
VR  
I
rr = 0.25 × IR  
F = 10 mA  
VR = 6 V  
tp = 2 µs  
tr = 0.35 ns  
δ = 0.05  
I
Pulse Generator  
Wave Form Analyzer  
(SAS-8130)  
Ri = 50 Ω  
(PG-10N)  
Rs = 50 Ω  
Publication date: February 2012  
Ver. EED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
DA4J104K  
IF VF  
IR VR  
Ct VR  
103  
3.0  
Ta = 25°C  
104  
102  
10  
2.5  
2.0  
1.5  
1.0  
0.5  
0
Ta = 85°C  
25°C  
Ta = 85°C  
106  
25°C  
1
30°C  
101  
102  
108  
30°C  
1010  
103  
0
0
20  
40  
60  
80  
100  
0
10  
20  
30  
40  
0.4  
0.8  
1.2  
Reverse voltage VR (V)  
Reverse voltage VR (V)  
Forward voltage VF (V)  
Ver. EED  
2
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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