DB2W318 [PANASONIC]

Silicon epitaxial planar type; 硅外延平面型
DB2W318
型号: DB2W318
厂家: PANASONIC    PANASONIC
描述:

Silicon epitaxial planar type
硅外延平面型

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DB2W318  
Silicon epitaxial planar type  
Unit: mm  
For rectication  
Features  
Low forward voltage VF  
Low terminal capacitance Ct  
Halogen-free / RoHS compliant  
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)  
Marking Symbol: 3V  
Packaging  
DB2W31800L Embossed type (Thermo-compression sealing): 3000 pcs / reel (standard)  
Absolute Maximum Ratings Ta = 25°C  
1: Cathode  
2:Anode  
Parameter  
Symbol  
VR  
Rating  
Unit  
V
Reverse voltage  
30  
Panasonic  
Mini2-F3-B  
1
Forward current (Average) *  
Non-repetitive peak forward surge current *  
Junction temperature  
IF(AV)  
IFSM  
Tj  
2
30  
A
JEITA  
Code  
SC-109B  
2
A
125  
°C  
°C  
Storage temperature  
T
–55 to +125  
stg  
Note) 1: Mounted on an alumina PC board (Board: 50 mm × 50 mm)  
*
2: 50 Hz sine wave 1 cycle (Non-repetitive peak current)  
*
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Symbol  
Conditions  
Min  
Typ  
0.38  
50  
Max  
0.43  
200  
Unit  
V
Forward voltage  
Reverse current  
VF  
IR  
Ct  
trr  
IF = 2A  
VR = 30 V  
mA  
pF  
ns  
Terminal capacitance  
VR = 10 V, f = 1 MHz  
70  
1
Reverse recovery time *  
IF = 100 mA, Irr = 0.1 × IR , RL = 100 Ω  
23  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage  
of current from the operating equipment.  
3. 1: trr measurement circuit  
*
Input Pulse  
Output Pulse  
trr  
Bias Application Unit (N-50BU)  
tp  
tr  
t
10%  
IF  
t
A
90%  
VR  
I
rr = 0.1 × IR  
tp = 2 µs  
tr = 0.35 ns  
δ = 0.05  
IF = 100 mA  
IR = 100 mA  
RL = 100 Ω  
Pulse Generator  
Wave Form Analyzer  
(SAS-8130)  
Ri = 50 Ω  
(PG-10N)  
Rs = 50 Ω  
Publication date: January 2013  
Ver. BED  
1
DB2W318  
IF VF  
IR VR  
Ct VR  
101  
102  
103  
104  
105  
106  
107  
108  
10  
500  
400  
100°C  
85°C  
Ta = 125°C  
Ta = 25°C  
Ta = 125°C  
1
101  
300  
102  
103  
104  
105  
106  
25°C  
100°C  
85°C  
200  
100  
0
25°C  
30°C  
30°C  
0
0.2  
0.4  
0.6  
0
10  
20  
30  
0
10  
20  
30  
Reverse voltage VR (V)  
Forward voltage VF (V)  
Reverse voltage VR (V)  
Rth t  
IF(AV) Tl  
PF(AV) IF(AV)  
103  
102  
10  
1
2.5  
2.0  
1.5  
1.0  
0.5  
0
1.0  
0.8  
IF  
tp / T  
DC  
IF  
tp  
(1)  
(2)  
tp  
T
T
DC  
VR = 15 V  
Tj = 125°C  
1/2  
Rth(j-l) = 15°C/W  
(3)  
1/2  
0.6  
0.4  
0.2  
0
Sine Wave  
Sine Wave  
1/4  
1/4  
(1) Non-heat sink  
(2) Mounted on glass epoxy print board.  
(3) Mounted on alumina print board.  
(50 mm × 50 mm × 0.8 mm)  
Solder in : 2 mm × 2 mm  
103  
101  
10  
103  
0
0
25 50 75 100 125 150 175  
0.5  
1.0  
1.5  
2.0  
2.5  
Time t (s)  
Lead temperature Tl (°C)  
Forward current (Average) IF(AV) (Α)  
Ver. BED  
2
DB2W318  
Unit: mm  
Mini2-F3-B  
Land Pattern (Reference) (Unit: mm)  
Ver. BED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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