DSA8004R0A [PANASONIC]
Small Signal Bipolar Transistor, 2A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, HALOGEN FREE AND ROHS COMPLIANT, MT-2-A2-B, 3 PIN;
| 型号： | DSA8004R0A |
| 厂家： | 
PANASONIC |
| 描述： | Small Signal Bipolar Transistor, 2A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, HALOGEN FREE AND ROHS COMPLIANT, MT-2-A2-B, 3 PIN 放大器 晶体管 |
| 文件： | 总4页 (文件大小：509K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This product complies with the RoHS Directive (EU 2002/95/EC).
DSA8004
Silicon PNP epitaxial planar type
For low frequency output amplification
DSA7004 in MT-2 through hole type package
Features
Package
ꢀCode
Low collector-emitter saturation voltage VCE(sat)
Contributes to miniaturization of sets, mount area reduction
Eco-friendly Halogen-free package
MT-2-A2-B
ꢀPin Name
1. Emitter
Collector
Packaging
Radial type : 2000 pcs / carton
Absolute Maximum Ratings Ta = 25°C
Marking Symbol: 4B
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open)
Collector current
Symbol
VCBO
VCEO
VO
IC
ating
Unit
V
0
–50
V
–5
V
–2
A
Peak collector current
ICP
–3
A
Collector power dissipation
Junction temperature
PC
1
W
°C
°C
T
150
Storage temperature
–55 to +150
Note) *: ted crcuiCopper foil ea of 1 cmore, and the board thickness
of 1.7 mm foollector portion
Electrical Characteristics T= 25°C±3°C
P
Symbol
Conditions
Min
–60
–50
–5
Typ
Max
Unit
V
Collector-base vopen)
Collector-emitter voltopen)
Emitter-base voltage (Collector open)
Collector-base cutoff current (Emitter open)
VCBO IC = –10 mA, IE = 0
VCEO IC = –1 mA, IB = 0
VEBO IE = –10 mA, IC = 0
V
V
ICBO
VCB = –20 V, IE = 0
– 0.1
340
mA
2
*
hFE1
hFE2
VCE = –2 V, IC = –200 mA
VCE = –2 V, IC = –1A
120
60
1
Forward current transfer ratio *
1
Collector-emitter saturation voltage *
VCE(sat) IC = –1AIB = –50 mA
VBE(sat) IC = –1A, IB = –50 mA
– 0.2
– 0.9
130
– 0.3
–1.2
V
V
1
Base-emitter saturation voltage *
Transition frequency
fT
VCE = –10 V, IC = –50 mA
MHz
Collector output capacitance
Cob
VCB = –10 V, IE = 0, f = 1 MHz
33
60
pF
(Common base, input open circuited)
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. 1: Pulse measurement
*
2: Rank classification
*
Code
Rank
R
R
S
S
0
No-rank
120 to 340
4B
hFE1
120 to 240
4BR
170 to 340
4BS
Marking Symbol
Product of no-rank is not classified and have no marking symbol for rank.
Publication date: January 2012
Ver. BED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
DSA8004
PC T
IC VCE
hFE IC
a
−1.6
1500
Ta = 25°C
V
CE = −2 V
−9 mA
−1.4
300
200
100
0
I
B = −10 mA
−1.2
−1.0
−8 mA
−7 mA
−6 mA
−5 mA
Ta = 85°C
1000
500
25°C
− 0.8
− 0.6
− 0.4
−4 mA
−3 mA
−30°C
−2 mA
−1 mA
− 0.2
0
0
−10−3
−10−2
−10−1
−1
−10
0
−2
−4
−6
−−10 −12
0
40
80
120
160
200
(
)
Ambient temperature Ta °C
Colletor-mitter voltage VCE (V)
Collector current IC (A)
VCE(sat) IC
IC VBE
Cob VCB
−10
−1
−2.0
−1.6
100
80
60
40
20
0
IC / IB = 20
IE = 0
f = 1 MHz
V
CE = −2 V
Ta = 25°C
Ta = 85°C
25°C
−1.2
Ta = 85°C
− 08
−
10−1
−30°C
−30°
−
10−2
−10
0
−10−1
1
−10
0
− 0.2 − 0.4 − 0.6 − 0.8 −1.0 −1.2
−1
−10
−102
Base-emitter voltage VBE (V)
Collector current IC (A)
Collector-base voltage VCB (V)
200
160
120
80
VCE = −10 V
a = 25°C
T
40
0
−10−4
−10−3
−10−2
−10−1
Collector current IC (A)
Ver. BED
2
This product complies with the RoHS Directive (EU 2002/95/EC).
DSA8004
MT-2-A2-B
Unit: mm
2.5 ±0.1
6.9 ±0.1
(0.8)
(0.7)
(4.0)
0.65 max.
10
+0.10
−0.05
0.45
1.05 ±0.05
2.5 ±0.5
2.5 ±0.5
2
1
3
Ver. BED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, trffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and abilitare required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible foy damge incurred as a result of or in connection with
your using the products described in this book for any special aplication, nless our compny agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in ths book are subject to change wice for modification and/or im-
provement. At the final stage of your design, purchasi, or use f the produceforfor the most up-to-date Product
Standards in advance to make sure that the latest pecications satisfy your requts.
(5) When designing your equipment, comply with thof absolute maximm rating and the guaranteed operating conditions
(operating power supply voltage and opratinenvent etc.). Espeially, plee be careful not to exceed the range of absolute
maximum rating on the transient state, uch as pwer-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are usn the uaranteed values, ake into te consideratioof incidence of break down and failure
mode, possible to occur to semductoproducts. Mesureon thsystems such as redundant design, arresting the spread of fire
or preventing glitch are rcmmeded in order to prevent physicinjury, fire, social damages, for example, by using the products.
(6) Comply with the intructions for se in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and echanicastress) at the time of handlig, mounting or at customer's process. When using products for which
damp-proof pacing irequired, satisfy titios, such as shelf life and the elapsed time since first opening the packages.
(7) This bok mae not eprinted or reprodher wholly or partially, without the prior wrten permission of ur company.
20100202
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