DZ2J110M0L [PANASONIC]

Silicon epitaxial planar type; 硅外延平面型
DZ2J110M0L
型号: DZ2J110M0L
厂家: PANASONIC    PANASONIC
描述:

Silicon epitaxial planar type
硅外延平面型

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中文:  中文翻译
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Doc No. TT4-EA-11553  
Revision. 3  
Zener Diode  
DZ2J1100L  
DZ2J1100L  
Silicon epitaxial planar type  
Unit: mm  
1.25  
0.35  
0.13  
For constant voltage / For surge absorption circuit  
2
Features  
Excellent rising characteristics of zener current Iz  
Low zener operating resistance Rz  
Halogen-free / RoHS compliant  
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)  
1
Marking Symbol:  
Packaging  
PJ or PU  
0.5  
0.7  
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)  
1. Cathode  
2. Anode  
Absolute Maximum Ratings Ta = 25 C  
Panasonic  
JEITA  
SMini2-F5-B  
SC-90A  
Parameter  
Symbol  
IFRM  
PT  
Rating  
200  
200  
8  
150  
Unit  
mA  
mW  
kV  
C  
C  
Repetitive peak forward current  
Code  
*1  
Total power dissipation  
Electrostatic discharge  
*2  
ESD  
Tj  
Topr  
Tstg  
Junction temperature  
Operating ambient temperature  
Storage temperature  
Internal Connection  
-40 to +85  
-55 to +150  
2
C  
Note)  
*1  
Mounted on glass epoxy print board ( 45 mm 45 mm 1 mm )  
Solder in ( Recommended land pattern )  
*2 Test method : IEC61000_4_2  
( C = 150 pF, R = 330 , Contact discharge : 10 times )  
1
Electrical Characteristics Ta = 25 C 3 C  
Parameter Symbol  
Conditions  
Min Typ Max  
1.0  
Unit  
V
V
Forward voltage  
Zener voltage *1, *2  
VF  
VZ  
IF = 10 mA  
IZ = 5 mA  
IZ = 5 mA  
IZ = 0.5 mA  
VR = 8 V  
10.45  
11.55  
30  
Zener operating resistance  
Zener rise operating resistance  
Reverse current  
RZ  
RZK  
IR  
60  
0.05  
A  
mV/C  
*3  
SZ  
IZ = 5 mA  
8.3  
Temperature coefficient of zener voltage  
Note) 1.  
Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.  
2.  
Absolute frequency of input and output is 5 MHz.  
3. *1  
The temperature must be controlled 25 C for VZ mesurement.  
VZ value measured at other temperature must be adjusted to VZ (25 C).  
*2  
*3  
VZ guaranted 20 ms after current flow  
Rank classification  
Tj = 25 C to 150 C  
Code  
Rank  
M
M
0
No-rank  
VZ  
10.73 to 11.28 10.45 to 11.55  
Marking symbol  
PU  
PJ  
Page 1 of 4  
Established : 2009-10-14  
Revised : 2013-07-11  
Doc No. TT4-EA-11553  
Revision. 3  
Zener Diode  
DZ2J1100L  
Technical Data ( reference )  
PT - Ta  
IF - VF  
250  
200  
150  
100  
50  
1.E+00  
Mounted on glass epoxy print board.  
Board size : 45 mm × 45 mm x 1 mm  
Solder in : land pattern  
Ta = 25 °C  
1.E-01  
1.E-02  
1.E-03  
1.E-04  
1.E-05  
1.E-06  
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0
20 40 60 80 100 120 140 160 180 200  
Ambient temperature Ta (°C)  
Forward voltage VF (V)  
IR - VR  
IZ - VZ  
1.E-06  
1.E-07  
1.E-08  
1.E-09  
1.E-10  
1.E-11  
1.E-12  
1.E-01  
1.E-02  
1.E-03  
1.E-04  
1.E-05  
1.E-06  
Ta = 25 °C  
Ta = 125 °C  
25 °C  
-40 °C  
85 °C  
0
5
10  
15  
20  
25  
0
1
2
3
4
5
6
7
8
Zener voltage VZ (V)  
Reverse voltage VR (V)  
SZ - IZ  
RZ - IZ  
12  
10  
8
100  
10  
1
Ta = 25 °C  
6
4
2
0
0.0001  
0.001  
0.01  
0.1  
0
2
4
6
8
10  
Zener current IZ (A)  
Zener current IZ (mA)  
Page 2 of 4  
Established : 2009-10-14  
Revised : 2013-07-11  
Doc No. TT4-EA-11553  
Revision. 3  
Zener Diode  
DZ2J1100L  
Technical Data ( reference )  
Rth - t  
Ct - VR  
1000  
20  
18  
16  
14  
12  
10  
8
(1)  
Ta = 25 °C  
f = 1 MHz  
Rth(j-l) = 80 °C/W  
(2)  
100  
10  
1
(1) Non-heat sink  
6
(2) Mounted on glass epoxy print board.  
Board size : 45 mm × 45 mm x 1 mm  
Solder in : land pattern  
4
2
0
0.001 0.01  
0.1  
1
10  
100  
1000  
0
2
4
6
8
Time t (s)  
Reverse voltage VR (V)  
PZSM - tw  
100  
10  
1
Ta = 25 °C  
0.1  
100  
1000  
10000  
Pulse width tw (μs)  
Page 3 of 4  
Established : 2009-10-14  
Revised : 2013-07-11  
Doc No. TT4-EA-11553  
Revision. 3  
Zener Diode  
DZ2J1100L  
SMini2-F5-B  
Unit: mm  
1.25±0.10  
0.35±0.05  
2
0.13+-0.052  
1
0.50±0.05  
0 to 0.05  
(5°)  
Land Pattern (Reference) (Unit: mm)  
0.9  
1.1  
Page 4 of 4  
Established : 2009-10-14  
Revised : 2013-07-11  
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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