ECDGZE3R3B [PANASONIC]
CAPACITOR, CERAMIC, MULTILAYER, 25V, C0G, 0.0000033uF, SURFACE MOUNT, 0201, CHIP;
| 型号： | ECDGZE3R3B |
| 厂家： | 
PANASONIC |
| 描述： | CAPACITOR, CERAMIC, MULTILAYER, 25V, C0G, 0.0000033uF, SURFACE MOUNT, 0201, CHIP CD 电容器 |
| 文件： | 总5页 (文件大小：555K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High-accuracy Types of High-frequency
Multilayer Chip Capacitors
Multilayer Ceramic Capacitors
(
)
High-Q Capacitors (Microwave Chip Capacitors)
[High-accuracy Types of High-frequency
Multilayer Chip Capacitors]
Series:ECD
n Features
n Applications
l Low Capacitance with tight tolerance.
(0.1 to 15.0 pF, ±0.05 pF to ±5 %)
l High Q value / Low ESR at High Frequencies
l Ultra-Stable C0G Performance (0 ± 30 ppm/ûC)
l 0402/0201 Sizes
l Microwave Circuitry
Impedance Matching Circuitry
Resonant Circuitry
á
á
á
Coupling Circuitry
l Application Examples
(0.10 to 15.0 pF/0.10 to 3.0 pF, ±0.05 pF, ±0.075 pF etc)
RF modules, VCO, BPF, DUP, PA
á
Cellular Phone, Bluetooth, Wireless LAN
á
n Handling Precautions
See Page 51 to 57
n Packaging Specifications
See Page 48, 96
n Explanation of Part Numbers
n Construction
No
A
B
C
D
E
Name
Ceramic dielectric
Inner electrode
Substrate electrode
Intermediate electrode
External electrode
n Dimensions in mm (not to scale)
Unit : mm (inch)
Size Code
Code
L
W
T
L
1
, L
2
(EIA)
0
Type “06”
(0201)
Type “10”
(0402)
Z
0.60±0.03
1.00±0.05
0.30±0.03
0.30±0.03
0.15±0.050
0
0
0.50±0.05
0.50±0.05
0.2±0.10
High-accuracy Types of High-frequency
Multilayer Chip Capacitors
Multilayer Ceramic Capacitors
(
)
n Packaging Styles
Type Ò06Ó (0201)
Type Ò10Ó (0402)
Code
Packaging Styles
Paper taping
Quantity
pcs./reel
T=0.3
T=0.5
f 180
reel
E
15,000 pcs. / reel
10,000 pcs. / reel
(Pitch : 2 mm)
n Temperature Coefficient
Characteristics
C0G
Temperature. Coefficient.
0 ± 30 ppm/¡C
These temperature coefficients are calculated between 20¡C and 85¡C
n Rated Voltage
DC25V
Rated Voltage
n Nominal Capacitance
Ex.
R10
1R0
2R7
120
Nominal
0.10 pF
1.0 pF
2.7 pF
12 pF
Capacitance
n Capacitance Tolerance
Size Code
(EIA)
Tol. Code
Capacitance Range
Capacitance Tolerance
8
9
B
8
9
B
C
J
0.10 to 0.50 pF
0.60 to 0.90 pF
1.0 to 3.0 pF
0.10 to 0.50 pF
0.60 to 0.90 pF
1.0 to 3.0 pF
3.3 to 10.0 pF
12 to 15 pF
±0.05 pF
±0.075 pF
±0.1 pF
±0.05 pF
±0.075 pF
±0.1 pF
Type Ò06Ó
(0201)
Type Ò10Ó
(0402)
±0.25 pF
±5 %
High-accuracy Types of High-frequency
Multilayer Chip Capacitors
Multilayer Ceramic Capacitors
(
)
n Specification
Characteristics
Specification
Test Method
Operating
Temperature
Range
Ð55 to 125 ûC
25 VDC
Rated
Voltage
No break down
Dielectric
Withstanding
Voltage
Test voltage:Rated voltage ´300 %
Duration:1 to 5s
Limit suge current:50 mA max.
Insulation
Resistance
(I R)
More than 10000 MW
Measuring voltage:Rated voltage
Duration:60±5s
Limit surge current:50 mA max.
Capacitance Within the specified tolerance
Temperature:20 ûC
Measuring frequency :1 MHz±10 %
Measuring voltage:0.5 to 5 Vrms
tan d < 0.005
Dissipation
Factor
(tan d)
Maximum capacitance change at
stage 1 to 5
Temperature
C0G:0±30 ppm/ ûC
Characteristics
Stage
Stage 1
Temperature
+25±2 ¡C
Ð25±2 ¡C
Stage 2
Stage 3
+25±2 ¡C
(Reference Temperature)
Stage 4
Stage 5
+85±2 ¡C
+25±2 ¡C
Adhesion
The terminal electrode shall be free from peeling or signs
of peeling.
Applied force : 2 N (Type "06")
5 N (Type "10")
Arrow direction for 10 seconds.
Bending value:1 mm
Bending
Strength
Appearance:no mechanical damage
Bending speed:1 mm/s
More than 75 % of the soldered area of both terminal
electrodes shall be covered with fresh solder.
Solder temperature:230±5 ûC
Dipping period:4±1 s
Solderability
Solder:H63A(JIS-Z-3283)
Resistance
to Solder
Heat
Appearance:no mechanical damage
Capacitance change:
Solder temperature:270±5 ûC
Dipping period:3.0±0.5 s
IR:more than 10000 MW
Preheat condition:
Temp.
180 to 100 ûC
150 to 200 ûC
Period
120 to 180s
120 to 180s
Recovery:24±2 h
High-accuracy Types of High-frequency
Multilayer Chip Capacitors
Multilayer Ceramic Capacitors
(
)
Characteristics
Specification
Test Method
Temperature Appearance:no mechanical damage
Condition of one cycle
cycle
IR:more than 1000 MW
Step1:Ð55±3 ûC
30±3 min.
3 min.
Step2:Room temp.
Step3:+125±3 ûC
Step4:Room temp.
Number of cycles:5
Recovery:24±2 h
30±3 min.
3 min.
Moisture
Appearance:no mechanical damage
IR:more than 1000 MW
Temperature:40±2 ûC
Resistance
Relative humidity:90 to 95 %
Test period:500+24/0 h
Recovery:24±2 h
Capacitance change:
Within ±7.5 % or ±0.02 pF whichever is lager.
tand < 0.005
Moisture
Resistant
Loading
Appearance:no mechanical damage
Temperature:40±2 ûC
IR:more than 1000 MW
Relative humidity:90 to 95 %
Applied voltage:25 VDC
Limit surge current:50 mA max.
Test period:500+24/0 h
Recovery:24±2 h
Loading at
high
Appearance:no mechanical damage
Temperature:+125 ûC ±3 ûC
Applied voltage:50 VDC
(Rated voltage ´200 %)
Limit surge current:50 mA max.
Test period:1000+48/0 h
Recovery:24±2 h
IR:more than 10000 MW
temperature
n Typical Performance Data
Q factor
Self Resonant Frequency
High-accuracy Types of High-frequency
Multilayer Chip Capacitors
Multilayer Ceramic Capacitors
(
)
n Standard Products for Type “06” (EIA “0201”),
n Standard Products for Type “10” (EIA “0402”),
Taped Version
Taped Version
Temp. Char.
C0G
Temp. Char.
C0G
Rated voltage
DC 25V
Rated voltage
DC 25V
Capaci-
tance
Capaci-
tance
Dim
T
Dim
T
Capacitance
Tolerance
Capacitance
Tolerance
Part No.
Part No.
(mm)
(mm)
0.1
0.2
ECDGZER108
ECDGZER208
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.5
1.6
1.8
2
2.2
2.4
2.7
3
3.3
3.9
4.7
5.6
6.8
8.2
10
ECDG0ER108
ECDG0ER208
ECDG0ER308
ECDG0ER408
ECDG0ER508
ECDG0ER609
ECDG0ER709
ECDG0ER809
ECDG0ER909
ECDG0E1R0B
ECDG0E1R1B
ECDG0E1R2B
ECDG0E1R3B
ECDG0E1R5B
ECDG0E1R6B
ECDG0E1R8B
ECDG0E2R0B
ECDG0E2R2B
ECDG0E2R4B
ECDG0E2R7B
ECDG0E3R0B
ECDG0E3R3C
ECDG0E3R9C
ECDG0E4R7C
ECDG0E5R6C
ECDG0E6R8C
ECDG0E8R2C
ECDG0E100C
ECDG0E120J
ECDG0E150J
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.3 ±0.05 pF ECDGZER308
±0.05 pF
±0.075 pF
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.5
1.6
1.8
2
ECDGZER408
ECDGZER508
ECDGZER609
ECDGZER709
ECDGZER809
ECDGZER909
ECDGZE1R0B
ECDGZE1R1B
ECDGZE1R2B
ECDGZE1R3B
ECDGZE1R5B
ECDGZE1R6B
ECDGZE1R8B
ECDGZE2R0B
ECDGZE2R2B
ECDGZE2R4B
ECDGZE2R7B
ECDGZE3R0B
ECDGZE3R3B
±0.075 pF
±0.1 pF
±0.1 pF
2.2
2.4
2.7
3
3.3
0.3
ECDGZE3R9B
ECDGZE4R7B
3.9
4.7
0.3
±0.25 pF
±5 %
Packaging Style Code : ÒEÓ for Taped Version (f180 reel, Taping pitch : 2 mm)
12
15
Packaging Style Code : ÒEÓ for Taped Version (f180 reel, Taping pitch : 2 mm)
相关型号：
ECDGZE3R9B
CAPACITOR, CERAMIC, MULTILAYER, 25V, C0G, 0.0000039uF, SURFACE MOUNT, 0201, CHIP
PANASONIC
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Ceramic Capacitor, Multilayer, Ceramic, 25V, 2.13% +Tol, 2.13% -Tol, C0G, 30ppm/Cel TC, 0.0000047uF, Surface Mount, 0201, CHIP
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