EEF-HE0G181R [PANASONIC]
SP-Cap/ Polymer Aluminum Capacitors; SP -CAP /聚合物铝电容器
| 型号： | EEF-HE0G181R |
| 厂家： | 
PANASONIC |
| 描述： | SP-Cap/ Polymer Aluminum Capacitors |
| 文件： | 总4页 (文件大小：127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SP-Cap/ Polymer Aluminum Capacitors
Surface Mount Type
Series: H
Country of Origin
Japan
Endurance:125°C 1000h
Low ESR
RoHS directive compliant
Reflow 240dC
n Features
n Specification
Series & Size Code
CategoryTemp.Range
Rated W.V.Range
Nominal Cap.Range
Capacitance Tolerance
HL
HD
HE
-40 to 125°C
2 to 8V.DC
68 to 220µF
±20 %
33 to 100µF
100 to 330µF
DC Leakage Current
<
0.1 CV 2minutes
I
°
°
< 0.10(120Hz/ +20 C)
tan δ
< 0.06(120Hz/+20 C)
Surge Voltage
Rated Working Voltage × 1.25 (15 to 35°C)
After applying rated working voltage for 1000 hours at 105±2°C or derated voltage(W.V.×0.875 at 115°C or W.V.
×0.75 at 125°C), and then being stabilized at +20°C,capacitor shall meet the following limits.
Endurance
Capacitance change
±10%of initial measured value
tan δ
< Initial specified value
DC leakage current
< Initial specified value
After storing for 500 hours at 60°C,90%
Capacitance change
2, 2.5V.DC
6.3V.DC
4 V.DC
8V.DC
+40, -20%
Moisture resistance
+70, -20%
+60, -20%
+50, -20%
of initial measurd value
tan δ
DC leakage current
< 200% of initial specified value
Initial specified value
<
n Marking
n Dimensions in mm(not to scale)
Cap.
Polarity bar(Positive)
P
P
W1
L
W.V. code
(mm)
P±0.3
1.3
1.3
1.3
Series &
L±0.2 W1±0.2 W2±0.1
H
Size Code
HL
7.3
7.3
7.3
4.3
4.3
4.3
2.4
2.4
2.4
1.8±0.1
2.8±0.2
4.2±0.1
HD
HE
Design, and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase
and / or use. Should a safety concern arise regarding this product,please be sure to contact us immediately.
Mar.2006
EE21
SP-Cap/ Polymer Aluminum Capacitors
n High heat-resistant products(H series)
Capaci-
Specification
Reflow 260°C
Case Size
W
Reflow 240°C
Min.
Rated
W.V.
(V.DC)
tance
(±20%)
Series &
i1
Ripple
H
i2
ESR
(Ω)
Packaging
L
Size Code
Part number
Part number
(µF)
(Qpc’ tsy)
current
(Ar.m.s.)
(mm) (mm) (mm)
2
2.5
4
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
100
82
7.3 4.3 1.8 1.8 0.018 EEFHL0D101R
3500
3500
3500
3500
3500
3500
2000
2000
2000
2000
2000
2000
2000
2000
2000
1.8
1.8
1.8
1.8
7.3 4.3 1.8
7.3 4.3 1.8
7.3 4.3 1.8
0.018 EEFHL0E820R
56
EEFHL0G560R
EEFHL0G680R
EEFHL0J470R
EEFHL0K330R
EEFHD0D181R
EEFHD0D221R
0.018
0.018
HL
68
6.3
8
47
1.8
7.3 4.3
7.3 4.3
7.3 4.3
7.3 4.3
0.018
33
1.8 1.8
0.018
180
220
150
180
120
100
68
2.8
2.8
2.8
2.8
2.5 0.015
2
0.015
2.5
2.5 0.015 EEFHD0E151R
4.3
4.3
7.3
7.3
7.3
7.3
7.3
7.3
2.5
HD
2.5
2.5
2.5
2.5
3.0
3.0
3.0
3.0
3.0
3.0
3.0
0.015
0.015
EEFHD0E181R
EEFHD0G121R
4
6.3
8
4.3 2.8
4.3 2.8
0.015 EEFHD0J101R
0.015 EEFHD0K680R
4.3
2.8
270
4.3 4.2
EEFHE0D271R
0.012
0.012 EEFHE0D331R
2
330 7.3 4.3 4.2
7.3 4.3 4.2
7.3 4.3 4.2
220
270
180
150
100
EEFHE0E221R
EEFHE0E271R
EEFHE0G181R
EEFHE0J151R
2000
2000
2000
2000
2000
0.012
0.012
0.012
0.012
HE
2.5
4
6.3
8
7.3
4.3 4.2
7.3 4.3
7.3 4.3
4.2
4.2
0.012 EEFHE0K101R
i1: Ripple current (100kHz/ +20 to +105°C ),
i2: ESR (100kHz/+20°C)
Design, and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase
and / or use. Should a safety concern arise regarding this product,please be sure to contact us immediately.
Mar.2006
EE22
SP-Cap/ Polymer Aluminum Capacitors
n Mounting Specifications.
l Recommendable reflow soldering temperature 240°C
EX.)
Peak temperature
240°C, 5s max.
230°C, 5s max.
Time in 200°C or more
30s max.
40s max.
l Typical land pattern (mm)
For standard terminal
( FD, CD, CX, UD, UE, S, H series)
Design, and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase
and / or use. Should a safety concern arise regarding this product,please be sure to contact us immediately.
Mar.2006
EE26
SP-Cap/ Polymer Aluminum Capacitors
n Packaging Specifications
l Reel Dimensions (mm)
l Embossed Taping (mm)
T
Chip pocket
Feeding hole P2 P0
fD0
E
B
C
t
D
P1
R:1.0
Chip component
Tape running direction
A±0.2
7.7
B±0.2
4.6
W±0.3
12.0
F±0.1
5.5
E±0.1 P1±0.1
1.75 8.0
A
W
t
t±0.2 / Series
A
B
C
D
E
W
T
t
FD
CD/CX/SL UD/SD/ UE/SE/
P2 ±0.1 P0±0.1 φD0
330±2 50min. 13.0±0.5 21.0±0.8 2.0±0.5 14±1 20±1 3.0
SX/HL/LL
HD
HE
2.0
4.0 1.5+00.1 1.5
2.1
3.4
4.5
n Packaging Box Dimensions (mm)
400 max.
Design, and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase
and / or use. Should a safety concern arise regarding this product,please be sure to contact us immediately.
Mar.2006
EE27
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