ERJ12ZYJ241V [PANASONIC]

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 240ohm, 200V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 2010, CHIP;
ERJ12ZYJ241V
型号: ERJ12ZYJ241V
厂家: PANASONIC    PANASONIC
描述:

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 240ohm, 200V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 2010, CHIP

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中文:  中文翻译
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Thick Film Chip Resistors  
Thick Film Chip Resistors  
0201, 0402, 0603, 0805, 1206,  
1210, 1812, 2012, 2512  
Type: ERJ 1G, 2G, 3G, 6G, 8G, 14,  
12, 12Z, 1T  
Features  
Small size and lightweight  
For PCB size reduction and lightweight products  
High reliability  
Metal glaze thick film resistive element and three layers of electrodes result in high reliability  
Matching with placement machine  
Taping and bulk case packagings for automatic placement machine  
Solderability  
Suitable for both reflow soldering and flow soldering  
Approved under the ISO 9001 system  
Approved under the QS-9000 system  
Reference Standards  
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A  
Explanation of Part Numbers  
E
R
J
3
G
E
Y
J
1
0
2
V
When omitted, all the rest P/N factors shall be moved up respectively.  
Thick Film Chip Resistors  
Dimensions in mm (not to scale)  
Construction  
Dimensions (mm)  
Weight  
(1000 pcs.)  
Type  
(inches)  
L
W
a
b
t
ERJ1G  
(0201)  
0.60±0.03 0.30±0.03 0.15±0.05 0.15±0.05 0.25±0.05 0.15 g  
ERJ2G  
(0402)  
ERJ3G  
(0603)  
1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05  
0.8 g  
2 g  
1.60±0.15 0.80  
0.30±0.20 0.30±0.15 0.45±0.10  
+0.15  
Ð0.05  
ERJ6G  
(0805)  
2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10  
4 g  
ERJ8G  
(1206)  
ERJ14  
(1210)  
+0.05  
Ð0.20  
+0.05  
Ð0.15  
3.20  
1.60  
0.50±0.20 0.50±0.20 0.60±0.10  
10 g  
16 g  
27 g  
27 g  
45 g  
3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10  
4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10  
5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10  
6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10  
ERJ12  
(1812)  
ERJ12Z  
(2010)  
ERJ1T  
(2512)  
Ratings  
Power Rating Limiting Element Maximum Overload  
T.C.R.  
Type  
(inches)  
Resistance  
Tolerance(%)  
Standard  
Resistance Values  
Resistance Range ()  
at 70 ¡C  
(W)  
Voltage (Maximum  
RCWV)(1) (V)  
Voltage(2)  
(V)  
×10-6/¡C  
(ppm/¡C)  
min.  
10  
max.  
1 M  
ERJ1G  
(0201)  
ERJ2G  
(0402)  
ERJ3G  
(0603)  
ERJ6G  
(0805)  
ERJ8G  
(1206)  
ERJ14  
(1210)  
<10 Ω:  
Ð100 to  
+600  
0.05  
0.063  
0.1  
15  
50  
30  
± 5  
± 5  
± 5  
± 5  
± 5  
± 5  
± 5  
± 5  
E24  
E24  
E24  
E24  
E24  
E24  
E24  
E24  
100  
100  
200  
400  
400  
400  
400  
1
1
1
1
1
1
1
2.2 M  
10 M  
10 M  
10 M  
10 M  
10 M  
1 M  
50  
10 to  
1 MΩ:  
±200  
0.125  
0.25  
0.25  
0.5  
150  
200  
200  
200  
200  
ERJ12, 12Z  
(1812, 2010)  
ERJ1T  
(2512)  
1 MΩ<:  
Ð400 to  
+150  
1
Rated Current Maximum Overload Current  
1G  
2G á 3G  
6Gá8Gá14á12á12Zá1T  
0.5 A  
1 A  
2 A  
1 A  
2 A  
4 A  
Jumper  
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating × Resistance Values, or Limiting Element Voltage  
(max. RCWV) listed above, whichever less.  
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 × Power Rating or max. Overload Voltage listed above  
whichever less.  
Thick Film Chip Resistors  
Power Derating Curve  
For resistors operated in ambient temperatures above  
70 ¡C, power rating shall be derated in accordance  
with the right figure.  
Packaging Methods  
Standard Quantity  
Type  
(inches)  
Thickness  
(mm)  
Punched (Paper) Taping  
(4 mm pitch)  
Embossed Taping  
Bulk Case  
(4 mm pitch)  
ERJ1G  
(0201)  
0.25  
0.35  
0.45  
0.6  
10000 pcs./reel (2 mm pitch)  
10000 pcs./reel (2 mm pitch)  
ERJ2G  
(0402)  
50000 pcs./case  
25000 pcs./case  
10000 pcs./case  
ERJ3G  
(0603)  
10000 pcs./reel (2 mm pitch)  
5000,10000 pcs./reel  
ERJ6G  
(0805)  
5000,10000 pcs./reel  
5000,10000 pcs./reel  
ERJ8G  
(1206)  
0.6  
ERJ14  
(1210)  
0.6  
5000 pcs./reel  
5000 pcs./reel  
4000 pcs./reel  
ERJ12,12Z  
(1812,2010)  
0.6  
ERJ1T  
(2512)  
0.6  
Taping Reel  
Bulk Case  
(mm)  
Type  
fA  
fB  
fC  
W
T
Dimensions  
(mm)  
1G,2G,3G  
6G,8G,14  
9.0±1.0 11.4±2.0  
13.0±1.0 15.4±2.0  
180.0Ð03.0 60 min. 13.0±1.0  
12,12Z,1T  
Note fA: 10000 pcs./reel=255 20000 pcs./reel=330  
Thick Film Chip Resistors  
Punched (Paper) Taping  
Embossed Taping  
Type  
A
B
W
F
E
Type  
A
B
W
F
E
P1  
1G 0.40±0.05 0.70±0.05  
2G 0.70±0.05 1.20±0.05  
3G 1.10±0.10 1.90±0.10  
6G 1.65±0.15 2.50±0.20  
8G 2.00±0.15 3.60±0.20  
14 2.80±0.20 3.50±0.20 8.00±0.30 3.50±0.05  
12 3.50±0.20 4.80±0.20  
Dimensions  
(mm)  
1.75±0.10 4.00±0.10  
Dimensions  
(mm)  
8.00±0.20 3.50±0.05 1.75±0.10  
12Z 2.80±0.20 5.30±0.20 12.00±0.30 5.50±0.05  
1T 3.60±0.20 6.90±0.20  
Type  
1G  
P1  
P2  
P0  
fD0  
T
Type  
14  
P2  
P0  
fD0  
t
fD1  
1 min.  
0.30±0.05  
0.45±0.05  
0.64±0.05  
2.00±0.10  
Dimensions  
(mm)  
12  
2G  
Dimensions  
(mm)  
2.00±0.05 4.00±0.10 1.50+0.10 1.00±0.10  
0
2.00±0.05 4.00±0.10 1.50+0.10  
12Z  
1T  
1.5 min.  
3G  
0
6G 4.00±0.10  
8G  
0.84±0.05  
Cautions for Safety  
In the case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount  
properly. Generally, the land width should be chip resistor width (W) 0.7 to 0.8 times of the width of chip resistor.  
In the case of reflow soldering, solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3  
times chip resistor width (W).  
Dimensions (mm)  
Type  
(inches)  
a
b
c
ERJ1G  
(0201)  
0.3 to 0.4  
0.8 to 0.9 0.25 to 0.35  
ERJ2G  
(0402)  
ERJ3G  
(0603)  
ERJ6G  
(0805)  
ERJ8G  
(1206)  
ERJ14  
(1210)  
ERJ12  
(1812)  
ERJ12Z  
(2010)  
ERJ1T  
(2512)  
0.5 to 0.6  
0.7 to 0.9  
1 to 1.4  
2 to 2.4  
2 to 2.4  
3.3 to 3.7  
3.6 to 4  
5 to 5.4  
1.4 to 1.6  
2 to 2.2  
0.4 to 0.6  
0.8 to 1  
3.2 to 3.8  
4.4 to 5  
0.9 to 1.4  
1.2 to 1.8  
1.8 to 2.8  
2.3 to 3.5  
1.8 to 2.8  
2.3 to 3.5  
4.4 to 5  
5.7 to 6.5  
6.2 to 7  
7.6 to 8.6  
1. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and  
confirmation test with the resistors actually mounted on your own board.  
When the load of more than rated power is applied under the load condition at steady state, it may  
impair performance and/or reliability of resistor.  
Never exceed the rated power.  
2. Chlorine type or other high-activity flux is not recommended as the residue may affect performance or reliability of  
resistors.  
3. When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When  
using a soldering iron with a tip at high temperature, solder for a time as short as possible (three seconds or less  
up to 350 ¡C).  
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may  
damage protective film or the body of resistor and may affect resistorÕs performance.  

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