ERJ2GEYJ332B [PANASONIC]
Fixed Resistor, Metal Glaze/thick Film, 0.063W, 3300ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402, CHIP;型号: | ERJ2GEYJ332B |
厂家: | PANASONIC |
描述: | Fixed Resistor, Metal Glaze/thick Film, 0.063W, 3300ohm, 50V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0402, CHIP |
文件: | 总5页 (文件大小:101K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Thick Film Chip Resistors
Thick Film Chip Resistors
01005, 0201, 0402, 0603, 0805,
1206, 1210, 1812, 2010, 2512
Type:
ERJ XG, 1G, 2G, 3G, 6G, 8G,
14, 12, 12Z, 1T
■ Features
● Small size and lightweight
For PCB size reduction and lightweight products
● High reliability
Metal glaze thick film resistive element and three layers of electrodes result in high reliability
● Suitable for use with placement machines
Taping and bulk case packagings for automatic placement machine
● Solderability
Suitable for both reflow soldering and flow soldering
● Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B
Explanation of Part Numbers
■
ERJXGE, 1GE, 2GE, 3GE, 6GE, 8GE, 14, 12, 12Z, 1T Series, ±5 % type
●
1
2
3
4
5
6
7
8
9
10
11
12
E
R
J
3
G
E
Y
J
1
0
2
V
Packaging Methods
Packaging
Pressed Carrier Taping
2 mm pitch, 20000 pcs.
Marking
Resistance Tolerance
Size, Power Rating
Type : inches Power R.
Product Code
Thick Film
Chip Resistors
Code
Y
Marking
Code
Code
Tolerance
5 %
XGE : 01005
1GE : 0201
2GE : 0402
3GE : 0603
6GE : 0805
8GE : 1206
14 : 1210
0.031 W
0.05 W
0.063 W
0.1 W
J
Value Marking on
black side
Y
0
Jumper
(Only XGE type)
✽
Nil
No marking
Pressed Carrier Taping
2 mm pitch, 15000 pcs.
(Only 1GE type)
C
0.125 W
0.25 W
0.25 W
0.5 W
Resistance Value
Punched Carrier Taping
2 mm pitch, 10000 pcs.
(Only 2GE type)
The first two digits are significant figures of resistance and
the third one denotes number of zeros following.
Decimal Point is expressed by R as 4.7 = 4R7.
Jumper is expressed by R00.
X
V
12 : 1812
Punched Carrier Taping
(Only 3GE, 6GE, 8GE type)
12Z : 2010
1T : 2512
0.5 W
1 W
Embossed CarrierTaping
(Only 14, 12, 12Z, 1T type)
U
B
Bulk case
(Only 2GE, 3GE type)
✽ When omitted, all the rest P/N factors shall be moved up respectively.
(Only XGE, 1GE, 2GE type and Bulk case)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Thick Film Chip Resistors
■ Dimensions in mm (not to scale)
■ Construction
L
a
W
Protective coating
t
Electrode (Inner)
Alumina substrate
b
Dimensions (mm)
Type
(inches)
Mass (Weight)
(g /1000 pcs.)
L
W
a
b
t
ERJXG
(01005)
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
0.40± 0.02 0.20± 0.02 0.10± 0.03 0.10± 0.03 0.13± 0.02
0.60± 0.03 0.30± 0.03 0.10± 0.05 0.15± 0.05 0.23± 0.03
0.04
0.15
0.8
2
Electrode
(Between)
1.00± 0.05 0.50± 0.05 0.20± 0.10 0.25± 0.05 0.35± 0.05
+0.15
–0.05
1.60± 0.15 0.80
0.30± 0.20 0.30± 0.15 0.45± 0.10
ERJ6G
(0805)
2.00± 0.20 1.25± 0.10 0.40± 0.20 0.40± 0.20 0.60± 0.10
4
ERJ8G
(1206)
ERJ14
(1210)
ERJ12
(1812)
ERJ12Z
(2010)
+0.05
–0.20
+0.05
–0.15
3.20
1.60
0.50± 0.20 0.50± 0.20 0.60± 0.10
10
16
27
27
45
3.20± 0.20 2.50± 0.20 0.50± 0.20 0.50± 0.20 0.60± 0.10
4.50± 0.20 3.20± 0.20 0.50± 0.20 0.50± 0.20 0.60± 0.10
5.00± 0.20 2.50± 0.20 0.60± 0.20 0.60± 0.20 0.60± 0.10
6.40± 0.20 3.20± 0.20 0.65± 0.20 0.60± 0.20 0.60± 0.10
Thick film
resistive element
Electrode (Outer)
ERJ1T
(2512)
■ Ratings
<For Resistor>
Category Temperature
Range (Operating
Temperature Range)
(°C)
Limiting Element Maximum Overload Resistance
Resistance
Range
(ꢀ)
T.C.R.
Type
(inches)
Power Rating
at 70 °C (W)
Voltage (Maximum
Voltage (2)
(V)
Tolerance
(%)
[ꢁ10–6/°C
(ppm/°C)]
RCWV)(1) (V)
<100 ꢀ:±300
100 ꢀ<:±200
ERJXG
(01005)
0.031
0.05
0.063
0.1
15
15
30
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
10 to 1 M (E24)
1 to 10 M (E24)
1 to 10 M (E24)
1 to 10 M (E24)
1 to 10 M (E24)
1 to 10 M (E24)
1 to 10 M (E24)
1 to 10 M (E24)
1 to 10 M (E24)
1 to 1 M (E24)
–55 to +125
–55 to +125
–55 to +155
–55 to +155
–55 to +155
–55 to +125
–55 to +125
–55 to +125
–55 to +125
–55 to +125
ERJ1G
(0201)
30
ERJ2G
(0402)
<10 ꢀ:
–100 to +600
50
100
100
200
400
400
400
400
400
ERJ3G
(0603)
50
ERJ6G
(0805)
0.125
0.25
0.25
0.5
150
200
200
200
200
200
10 ꢀ to 1 Mꢀ:
±200
ERJ8G
(1206)
ERJ14
(1210)
ERJ12
(1812)
1 Mꢀ<:
–400 to +150
ERJ12Z
(2010)
0.5
ERJ1T
(2512)
1
ꢂ
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating ꢁ Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5ꢁPower Rating or max. Overload Voltage listed above
whichever less.
<For Jumper>
Power Derating Curve
Type
(inches)
Rated Current Maximum Overload Current
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the following figure.
(A)
0.5
(A)
ERJ1G (0201)
ERJ2G (0402)
ERJ3G (0603)
ERJ6G (0805)
ERJ8G (1206)
ERJ14 (1210)
ERJ12 (1812)
ERJ12Z (2010)
ERJ1T (2512)
1
1
2
2
4
–55 °C
100
70 °C
80
60
40
20
0
3G, 6G, 8G
XG, 1G,2G,14,12,12Z,1T
155 °C
125 °C
–60 –40 –20
0
20 40 60 80 100 120 140 160 180
Ambient Temperature (°C)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Thick Film Chip Resistors
■ Packaging Methods (Taping)
● Standard Quantity
Type
Kind of Taping
Pitch (P1)
2 mm
Quantity
ERJXG
ERJ1G
ERJ2G
ERJ3G
ERJ6G
ERJ8G
ERJ14
ERJ12
ERJ12Z
ERJ1T
20000 pcs./reel
15000 pcs./reel
10000 pcs./reel
Pressed Carrier Taping
Punched Carrier Taping
5000 pcs./reel
4 mm
Embossed Carrier Taping
4000 pcs./reel
● Carrier Tape
(Unit : mm)
Pressed Carrier
Punched Carrier
Embossed Carrier
P1
P2
P0
fD0
P1
(2 mm pitch)
T
A
T
T
fD1 (Only Emboss)
fD0
fD1
–
Type
A
B
W
F
E
P1
P2
P0
T
ERJXG
ERJ1G
ERJ2G
ERJ3G
ERJ6G
ERJ8G
ERJ14
ERJ12
ERJ12Z
ERJ1T
0.25± 0.03 0.45± 0.03
0.38± 0.05 0.68± 0.05
0.70± 0.05 1.20± 0.05
1.10± 0.10 1.90± 0.10
1.65± 0.15 2.50± 0.20
2.00± 0.15 3.60± 0.20
0.31± 0.05
0.42± 0.05
0.52± 0.05
0.70± 0.05
2.00± 0.10
–
–
8.00± 0.20
3.50± 0.05
–
–
1.75± 0.10
2.00± 0.05 4.00± 0.10 1.50
+0.10
0.84± 0.05
−0
–
+0.10
2.80± 0.20 3.50± 0.20 8.00± 0.30
3.50± 0.20 4.80± 0.20
2.80± 0.20 5.30± 0.20 12.00± 0.30 5.50± 0.20
3.60± 0.20 6.90± 0.20
4.00± 0.10
1.0
−0
1.00± 0.10
1.5 min.
● Taping Reel
(Unit : mm)
T
fA
fB
fC
Type
W
T
ERJXG
ERJ1G
ERJ2G
ERJ3G
ERJ6G
ERJ8G
ERJ14
ERJ12
ERJ12Z
ERJ1T
fC
9.0±1.0 11.4±1.0
+0
180.0
60 min. 13.0±1.0
–3.0
13.0±1.0 15.4±2.0
fA
W
■ Packaging Methods (Bulk Case)
● Standard Quantity
(Unit : mm)
● Bulk Case
Type
Quantity
Slider
12
ERJ2G
ERJ3G
50000 pcs. / Case
25000 pcs. / Case
Shutter
110
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Thick Film Chip Resistors
■ Recommended Land Pattern
In the case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In the case of reflow soldering,
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Dimensions (mm)
b
Type
(inches)
a
c
Chip Resistor
ERJXG(01005) 0.15 to 0.20
0.5 to 0.7
0.8 to 0.9
1.4 to 1.6
2 to 2.2
3.2 to 3.8
4.4 to 5
4.4 to 5
5.7 to 6.5
6.2 to 7
0.20 to 0.25
0.25 to 0.35
0.4 to 0.6
0.8 to 1
ERJ1G(0201)
ERJ2G(0402)
ERJ3G(0603)
ERJ6G(0805)
ERJ8G(1206)
ERJ14(1210)
ERJ12(1812)
ERJ12Z(2010)
ERJ1T(2512)
0.3 to 0.4
0.5 to 0.6
0.7 to 0.9
1 to 1.4
2 to 2.4
2 to 2.4
3.3 to 3.7
3.6 to 4
5 to 5.4
0.9 to 1.4
1.2 to 1.8
1.8 to 2.8
2.3 to 3.5
1.8 to 2.8
2.3 to 3.5
a
b
7.6 to 8.6
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
Recommended soldering conditions for reflow
●
· Reflow soldering shall be a maximum of two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure a temperature of electrodes and study
solderability every kind of solder and board, before actual
use.
For solder (Example : Sn/Pb)
Temperature
Time
Preheating
Main heating
Peak
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
60 s to 120 s
30 s to 40 s
max. 10 s
Peak
Preheating
For lead-free solder (Example : Sn/Ag/Cu)
Temperature
Time
Heating
Preheating
Main heating
Peak
150 °C to 180 °C
Above 230 °C
max. 260 °C
60 s to 120 s
30 s to 40 s
max. 10 s
Time
Recommended soldering conditions for flow
●
For solder
For lead -free solder
Temperature
140 °C to 180 °C
245 ± 5 °C
Time
Temperature
Time
Preheating
Soldering
60 s to 120 s
20 s to 30 s
150 °C to 180 °C
max. 260 °C
60 s to 120 s
max. 10 s
Cautions for Safety
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Thick Film Chip Resistors (hereafter called the
Resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the Resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the Resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the Resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the Resistors' bodies with the tip of the soldering iron. When using
a soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at 350 °C
max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the Resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply a shock to the Resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the Resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the Resistors from abnormal stress.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Cautions for Safety
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
✽
✽
(1) Precautions for use
• These products are designed and manufactured for general purpose and standard use in general electronic
equipment (e.g. AV equip ment, home electric appliances, offic e e quipme nt, information a nd c ommunication
equipment)
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. In an environment where strong static electricity or electromagnetic waves exist
5. In an environment where these products cause dew condensation
6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or
inflammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the perfor
mance or reliability of the products.
• Ca re fully s e le c t a flux c le a ning a g e nt for us e a fte r s old e ring . An uns uita b le a g e nt ma y d e te riora te the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their
electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials)
may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
This is all for the precautions common to Fixed Resistors. Also refer to the "CAUTION AND WARNING" section located
on the back of the front cover of this catalog and precautions for individual products shown in the subsequent pages.
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
– ER3 –
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