ERJ3EKF3301V
更新时间:2024-09-18 12:54:05
品牌:PANASONIC
描述:Synchronous DC-DC Step down Regulator comprising of Controller IC and Power MOSFET
ERJ3EKF3301V 概述
Synchronous DC-DC Step down Regulator comprising of Controller IC and Power MOSFET 同步DC-DC降压稳压器,包括控制器IC和功率MOSFET 电阻 固定电阻器
ERJ3EKF3301V 规格参数
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | CHIP |
Reach Compliance Code: | compliant | 风险等级: | 0.63 |
其他特性: | PRECISION, STANDARD: IEC60115-8 | 构造: | Chip |
JESD-609代码: | e3 | 安装特点: | SURFACE MOUNT |
端子数量: | 2 | 最高工作温度: | 155 °C |
最低工作温度: | -55 °C | 封装高度: | 0.45 mm |
封装长度: | 1.6 mm | 封装形状: | RECTANGULAR PACKAGE |
封装形式: | SMT | 封装宽度: | 0.8 mm |
包装方法: | TR, PUNCHED, 7 INCH | 额定功率耗散 (P): | 0.1 W |
额定温度: | 70 °C | 参考标准: | AEC-Q200 |
电阻: | 3300 Ω | 电阻器类型: | FIXED RESISTOR |
尺寸代码: | 0603 | 表面贴装: | YES |
技术: | METAL GLAZE/THICK FILM | 温度系数: | 100 ppm/°C |
端子面层: | Matte Tin (Sn) - with Nickel (Ni) barrier | 端子形状: | WRAPAROUND |
容差: | 1% | 工作电压: | 75 V |
Base Number Matches: | 1 |
ERJ3EKF3301V 数据手册
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PDF下载NN30312A
VIN = 4.5 V to 30 V, 10 A
Synchronous DC-DC Step down Regulator
comprising of Controller IC and Power MOSFET
FEATURES
DESCRIPTION
NN30312A is a synchronous DC-DC Step down
Regulator (1-ch) comprising of a Controller IC and two
power MOSFETs and employs the hysteretic control
system.
z High-Speed Response DC-DC Step Down Regulator
Circuit that employs Hysteretic Control System
z Two 11 mΩ (Typ.)
MOSFETs for High Efficiency at 10 A
z SKIP (discontinuous) Mode for Light Load Efficiency
z Up to 10 A Output Current
By this system, when load current changes suddenly, it
responds at high speed and minimizes the changes of
output voltage.
Since it is possible to use capacitors with small
capacitance and it is unnecessary to add external parts
for system phase compensation, this IC realizes
downsizing of set and reducing in the number of external
parts. Output voltage is adjustable by user.
z Input VoltageRange : AVIN : 4.5 V to 30 V,
PVIN : 4.5 V to 30 V,
Output Voltage Range : 0.75 V to 5.5 V
Selectable Switching Frequency 250 kHz , 750 kHz ,
1250 kHz
Maximum current is 10 A.
z Adjustable Soft Start
z Low Operating and Standby Quiescent Current
APPLICATIONS
z Open Drain Power Good Indication for Output Over ,
Under Voltage
High Current Distributed Power Systems such as
・HDDs (Hard Disk Drives)
・SSDs (Solid State Drives)
・PCs
z Built-in Under Voltage Lockout (UVLO),
Thermal Shut Down (TSD),
Over Voltage Detection (OVD),
Under Voltage Detection (UVD),
Over Current Protection (OCP),
Short Circuit Protection (SCP)
・Game consoles
・Servers
・Security Cameras
・Network TVs
z HQFN040-A3-0606B ( Size : 6 mm X 6 mm, 0.5 mm
pitch ), 40pin Plastic Quad Flat Non-leaded Package
Heat Slug Down (QFN Type)
・Home Appliances
・OA Equipment etc.
SIMPLIFIED APPLICATION
EFFICIENCY CURVE
VREG
Frequency = 250 kHz
100
90
80
70
60
50
40
30
20
10
0
PVIN
EN
PVIN
100k Ω
PGOOD
BST
VOUT
AVIN
AVIN
FCCM/ Vo= 1.05V
FCCM/ Vo= 1.2V
FCCM/ Vo= 1.8V
FCCM/ Vo= 3.3V
FCCM/ Vo= 5.0V
SKIP/ Vo= 1.05V
SKIP/ Vo= 1.2V
SKIP/ Vo= 1.8V
SKIP/ Vo= 3.3V
SKIP/ Vo= 5.0V
0.1μF
4.7μH
NN30312A
DCDCOUT
1.05 V
LX
1.5k Ω
1k Ω
22μF x 3
VFB
VREG
SS
AGND PGND
10nF
1μF
Notes) This application circuit is an example. The operation
of mass production set is not guaranteed. You should
perform enough evaluation and verification on the
design of mass production set. You are fully
responsible for the incorporation of the above
application circuit and information in the design of
your equipment.
IOUT (A)
Condition )
IN = 12 V, Vout = 1.05 V , 1.2 V , 1.8V , 3.3V , 5.0 V,
L = 4.7 µH, Cout = 66 µF ( 22 µF x 3 ), Frequency = 250 kHz
V
Ver. CEB
Publication date: October 2012
1
NN30312A
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply voltage
Symbol
VIN
Rating
33
Unit
V
Notes
*1
Operating free-air temperature
Operating junction temperature
Storage temperature
Topr
Tj
– 40 to + 85
– 40 to + 150
– 55 to + 150
°C
°C
°C
*2
*2
Tstg
*2
*1
*3
MODE,FSEL,VOUT,VFB,
– 0.3 to (VREG + 0.3)
-0.3 to 6.0
V
V
V
Input Voltage Range
EN
*1
*1
*3
PGOOD
– 0.3 to (VREG + 0.3)
Output Voltage Range
ESD
*1
*4
LX
– 0.3 to ( VIN + 0.3 )
2
V
HBM (Human Body Model)
kV
—
Notes) Do not apply external currents and voltages to any pin not specifically mentioned.
This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating.
This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated
recommended operating range. When subjected under the absolute maximum rating for a long time, the reliability of the product
may be affected. VIN is voltage for AVIN, PVIN. AVIN = PVIN.
*1:The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*2:Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25 °C.
*3:(VREG + 0.3) V must not be exceeded 6 V.
*4:(VIN + 0.3) V must not be exceeded 33 V.
POWER DISSIPATION RATING
PACKAGE
θJA
PD ( Ta = 25 °C)
PD ( Ta = 85 °C ) Notes
1.47 W *1
40pin Plastic Quad Flat Non-leaded Package
Heat Slug Down (QFN Type)
44.2 °C / W
2.82 W
Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, follow the power supply
voltage, load and ambient temperature conditions to ensure that there is enough margin and the thermal design does not
exceed the allowable value.
*1:Glass Epoxy Substrate ( 4 Layers ) [ Glass-Epoxy: 50 X 50 X 0.8 t ( mm ) ]
Die Pad Exposed , Soldered.
CAUTION
Although this has limited built-in ESD protection circuit, but permanent damage may occur on it.
Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates
Ver. CEB
2
NN30312A
RECOMMENDED OPERATING CONDITIONS
Parameter
Pin Name
AVIN
Min.
4.5
Typ.
12
12
—
Max.
30
Unit Notes
V
V
V
V
V
V
V
—
—
*1
*1
—
*1
*2
Supply voltage range
PVIN
4.5
30
MODE
FSEL
EN
– 0.3
– 0.3
– 0.3
– 0.3
– 0.3
VREG + 0.3
VREG + 0.3
6.0
Input Voltage Range
Output Voltage Range
—
—
PGOOD
LX
—
VREG + 0.3
VIN + 0.3
—
Note) Do not apply external currents and voltages to any pin not specifically mentioned.
Voltage values, unless otherwise specified, are with respect to GND. GND is voltage for AGND, PGND. AGND = PGND
VIN is voltage for AVIN, PVIN. AVIN = PVIN.
The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.
*1 : (VREG + 0.3) V must not be exceeded 6 V.
*2 : (VIN + 0.3) V must not be exceeded 33 V.
Ver. CEB
3
NN30312A
ELECRTRICAL CHARACTERISTICS
Co = 22 μF X 3 (Murata), Lo= 1 μH (TDK), VOUT Setting = 3.3 V, VIN = AVIN = PVIN = 12 V,
Switching Frequency = 750 kHz, MODE = VREG (FCCM), Ta = 25 °C 2 °C unless otherwise noted.
Limits
Parameter
Symbol
Condition
Unit Note
Min
Typ
Max
Current Consumption
EN= 5 V, IOUT = 0 A
RFB1 = 4.5 kΩ
RFB2 = 1.0 kΩ
MODE=GND
Consumption current at active
IVDDACT
—
—
650
—
1000
2
μA
μA
—
—
(Skip MODE)
Consumption current at standby
Logic Pin
IVDDSTB
EN = 0 V
EN pin Low-level input voltage
EN pin High-level input voltage
EN pin leak current
VENL
VENH
—
—
—
1.5
—
—
—
0.3
5.0
V
V
—
—
—
ILEAKEN
EN = 5 V
6.25
12.5
μA
VREG
X 0.3
MODE pin Low-level input voltage
MODE pin High-level input voltage
VMODEL
—
—
—
—
—
V
V
—
—
VREG
X 0.7
VMODEH
VREG
MODE pin leak current
ILEAKMODE MODE = 5 V
—
—
6.25
—
12.5
0.3
μA
—
—
FSEL pin Low-level input voltage
VMODEL
VMODEH
ILEAKMD
—
V
VREG
– 0.3
FSEL pin High-level input voltage
—
—
VREG
25.0
V
—
—
FSEL pin leak current
VREG
FSEL = 5 V
—
15.0
μA
VREG output voltage
VREGOUT
VREGLINE
IVREG = – 20 mA
IN = 12 V to 6 V
IVREG = – 20 mA
IN = 4.5 V
5.1
—
5.5
—
5.9
V
—
—
V
VREG line regulation
200
mV
V
VREG drop out voltage
VREGDO
4.11
—
—
V
—
IVREG = – 20 mA
Ver. CEB
4
NN30312A
ELECRTRICAL CHARACTERISTICS ( Continued )
Co = 22 μF X 3 (Murata), Lo= 1 μH (TDK), VOUT Setting = 3.3 V, VIN = AVIN = PVIN = 12 V,
Switching Frequency = 750 kHz, MODE = VREG (FCCM), Ta = 25 °C 2 °C unless otherwise noted.
Limits
Parameter
Symbol
Condition
Unit Note
Min
Typ
Max
VFB Characteristics
VFB comparator threshold
Under Voltage Lock Out
UVLO start voltage 1
UVLO recover voltage 1
PGOOD
VFBTS
—
0.594 0.600 0.606
V
—
VUVLODET VIN = 5 V to 0 V
VUVLORMV VIN = 0 V to 5 V
3.5
3.9
3.8
4.2
4.1
4.5
V
V
—
—
PGOOD Threshold 1
(VFB ratio for UVD detect)
PGOOD Hysteresis 1
(VFB ratio for UVD release)
PGOOD Threshold 2
VTHPG1
VHYSPG1
VTHPG2
PGOOD : High to Low
77
3.5
107
85
5.0
115
93
6.5
123
%
%
%
—
—
—
PGOOD : Low to High
PGOOD : High to Low
(VFB ratio for OVD detect)
PGOOD Hysteresis 2
(VFB ratio for OVD release)
VHYSPG2
RPG
PGOOD : Low to High
—
3.5
—
5.0
10
6.5
15
%
—
—
PGOOD ON resistance
Ω
Ver. CEB
5
NN30312A
ELECRTRICAL CHARACTERISTICS ( Continued )
Co = 22 μF X 3 (Murata), Lo= 1 μH (TDK), VOUT Setting = 3.3 V, VIN = AVIN = PVIN = 12 V,
Switching Frequency = 750 kHz, MODE = VREG (FCCM), Ta = 25 °C 2 °C unless otherwise noted.
Limits
Parameter
Symbol
Condition
Unit Note
Min
Typ
Max
DC-DC
PVIN = 6V to 30 V
DC-DC line regulation
DC-DC load regulation
DDREGIN
—
—
0.25
3.5
0.75 %/V
—
*1
I
OUT = – 0.5 A
DDREGLD IOUT = – 10 mA to – 10 A
—
—
%
%
%
IOUT = – 10 mA
MODE=GND
(Skip MODE)
DC-DC efficiency 1
DDEFF1
—
65
*1
DC-DC efficiency 2
DDEFF2
I
OUT = – 5A
—
—
88
20
—
—
*1
*1
mV
[p-p]
DC-DC output ripple voltage 1
DDVRPL1 IOUT = – 10 mA
DDVRPL2 IOUT = – 5A
mV
[p-p]
DC-DC output ripple voltage 2
DC-DC load transient response
—
—
20
20
—
—
*1
*1
IOUT = – 100 mA ↔ – 1.5
A
Vout = 1 V
Δt = 0.5 A / μs
DDDVAC
mV
DC-DC High Side MOS ON
resistance
DDRONH
DDRONL
VGS = 5.5 V
VGS = 5.5 V
—
—
11
11
22
22
mΩ
mΩ
—
—
DC-DC Low Side MOS ON
resistance
MIN Input and output voltage
difference
DV
DV = PVIN – VOUT
—
2.5
—
V
*1
VFB Characteristics
VFB pin leak current 1
VFB pin leak current 2
ILEAKFB1
ILEAKFB2
VFB = 0 V
VFB = 6 V
– 1
– 1
—
—
1
1
μA
μA
—
—
*1 :Typical Value checked by design.
Ver. CEB
6
NN30312A
ELECRTRICAL CHARACTERISTICS ( Continued )
Co = 22 μF X 3 (Murata), Lo= 1 μH (TDK), VOUT Setting = 3.3 V, VIN = AVIN = PVIN = 12 V,
Switching Frequency = 750 kHz, MODE = VREG (FCCM), Ta = 25 °C 2 °C unless otherwise noted.
Limits
Parameter
PROTECTION
Symbol
Condition
Unit Note
Min
Typ
Max
DC-DC output current limit
DDILMT
—
—
15.0
60
—
A
*1
—
DC-DC Output GND Short
Protection Threshold
DDSHPTH FB = 0.6 V to 0.0 V
50
70
%
Soft-Start Timing
SS Charge Current
ISSCHG
RSSDIS
VSS = 0.3 V
EN = 0 V
– 4
—
– 2
5
—
μA
kΩ
—
—
SS Discharge Resistance (Shut-down)
Switching Frequency Adjustment
DC-DC Switching Frequency 1
DC-DC Switching Frequency 2
DC-DC Switching Frequency 3
10
DDFSW1
DDFSW2
DDFSW3
IOUT = – 5 A
—
—
—
250
750
—
—
—
kHz *1
kHz *1
kHz *1
I
OUT = – 5 A
IOUT = – 5 A
1250
*1 :Typical Value checked by design.
Ver. CEB
7
NN30312A
PIN CONFIGURATION
Top View
30 29 28 27
26 25 24 23 22 21
PGOOD
AGND
BST
20 AVIN
31
32
33
34
35
19
18
17
16
15
14
13
12
11
41
AGND
AGND
MODE
N.C
36
37
38
43
LX
42
PVIN
PGND
PVIN
39
40
1
2
3
4
5
6
7
8
9 10
PIN FUNCTIONS
Pin No. Pin name
Type
Description
1
2
3
4
LX
Output
Power MOSFET output pin
5
6
7
8
9
10
11
12
PGND
Ground
Ground pin for Power MOSFET
13
14
15
16
17
Notes) Concerning detail about pin description, please refer to OPERATION and APPLICATION INFORMATION section.
Ver. CEB
8
NN30312A
PIN FUNCTIONS ( Continued )
Pin No. Pin name
Type
Input
Description
18
19
20
21
22
23
24
25
26
27
MODE
AGND
AVIN
Skip / FCCM mode select pin
Ground pin
Ground
Power supply Power supply pin
N.C.
-
No connection pin (don’t use pin)
FSEL
EN
Input
Input
Frequency selection pin
ON/OFF control pin
VREG
VFB
Output
Input
LDO output pin (Power supply for internal control circuit)
Comparator negative input pin
VOUT
SS
Input
Output voltage sense pin
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
Output
Soft start capacitor connect pin
N.C.
-
No connection pin (don’t use pin)
PGOOD
AGND
BST
Output
Ground
Output
-
Power good open drain pin
Ground pin
Supply input pin for high side FET gate driver
No connection pin (don’t use pin)
N.C.
PVIN
Power supply Power supply pin for Power MOSFET
AGND
PVIN
LX
Ground
Power supply Power supply pin for radiation of heat
Output Power MOSFET output pin for radiation of heat
Ground pin for radiation of heat
Notes) Concerning detail about pin description, please refer to OPERATION and APPLICATION INFORMATION section.
Ver. CEB
9
NN30312A
FUNCTIONAL BLOCK DIAGRAM
AVIN
20
SS
28
Soft-Start
31
SS
VBG
PGOOD
EN
BGR
VINT
24
25
27
VREG
ON / OFF
VREG
VREG
33
VREG : 5.5 V
BST
UVLO
SCP
OCP
TSD
35,36,37,38,39,40,42
PVIN
0.6 V + 15 %
VOUT
Fault
0.6 V – 15 %
HGATE
HPD
HGO
26
VFB
Soft-Start
0.6 V
1,2,3,4,5,6,7,8,43
LX
VREF
Ton
Aux
Timer
REF
Control
Logic
ON
CMP
LGATE
23
18
Toff
Timer + Comp
FSEL
LPD
LGO
Timer + Comp
VIN
Coast
PGND
FCCM
/ Skip
9,10,11,12,13,14,15,16,17
MODE
19,32,41
AGND
Notes) This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified.
Ver. CEB
10
NN30312A
OPERATION
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
1. Protection
(1).Output Over-Current Protection (OCP) function
115 %
110 %
And Short-Circuit Protection (SCP) function
0.6 V
0.6 V
VFB
1) The Over Current Protection is activated at about 15
A (Typ.) During the OCP, the output voltage continues
to drop at the specified current.
90 %
85 %
2) The Short-Circuit Protection function is implemented
when the output voltage decreases and the VFB pin
reaches to about 60 % of the set voltage of 0.6 V.
1 ms
2)
1 ms
4)
1)
3)
3) The SCP operates intermittently at 2 ms-ON, 16 ms
OFF intervals.
PGOOD
Note: PGOOD Pin is pulled up to VREG pin
Figure : OVD and UVD Operation
Over Current Protection ( typ : 15 A )
10.5 A to 20.5 A
(3).Thermal Shut Down (TSD)
When the IC internal temperature becomes more than
about 130 °C, TSD operates and DCDC turns off.
1)
(Ground short
protection Detection
2. Pin Setting
2)
about 60% of Vout )
(1).Operating Mode Setting
3)
Pendency
characteristics
The IC can operate at two different modes : Skip mode
and Forced Continuous Conduction mode (FCCM).
Intermittent
operation area
In Skip mode, the IC is working under pulse skipping
mechanism to improve efficiency at light load condition.
about 2 A
In FCCM mode, the IC is working at fixed frequency to
avoid EMI issues.
Output current [A]
The Operating Mode can be set by MODE pin as follows.
Figure : OCP and SCP Operation
MODE pin
Low
Mode
Skip
(2).Over Voltage Detection (OVD) and Under Voltage
Detection (UVD)
1).The NMOS connected to the PGOOD pin turns ON
when the output voltage rises and the VFB pin voltage
reaches 115 % of its set voltage (0.6 V).
High
FCCM
(2).Switching Frequency Setting
2).After (1) above, the NMOS connected to the PGOOD
pin is turned OFF after 1 ms when the output voltage
drops and the VFB pin voltage reaches 110 % of its set
voltage (0.6 V).
The IC can operate at three different frequency : 1250
kHz, 750 kHz and 250 kHz.
The Switching Frequency can be set by FSEL pin as
follows.
3).The NMOS connected to the PGOOD pin turns ON
when the output voltage drops and the VFB pin
voltage reaches 85 % of its set voltage (0.6 V).
4).After (3) above, the NMOS connected to the PGOOD
pin is turned OFF after 1 ms when the output voltage
drops and the VFB pin voltage reaches 90 % of its set
voltage (0.6 V).
FSEL pin
Low
Frequency [kHz]
1250
250
High
Open
750
Ver. CEB
11
NN30312A
OPERATION ( Continued )
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
3. Output Voltage Setting
Because the voltage of FB pin is controlled by the
voltage of SS pin during start up, the voltage of FB
increase straightly to the regulation voltage (0.6 V)
together with the voltage of SS pin and keep the
regulation voltage after that. On the other hand, the
voltage of SS pin increase to about 2.8 V and keep the
voltage. The calculation of Soft Start Time is as follows.
The Output Voltage can be set by external resistance of
FB pin, and its calculation is as follows.
(VIN = 12 V, IOUT = 0 A, FCCM, Fsw = 750 kHz).
VOUT
RFB1
RFB1
RFB2
VFB (0.6 V)
VOUT = ( 1 +
) × 0.6
0.6
Soft Start Time(sec) =
×Css
RFB2
2μ
When Css is set at 10 nF, soft-start time is
approximately 3ms.
Below resistors are recommended for following popular
output voltage.
VOUT [V]
5.0
RFB1 [Ω]
11.0 k
4.5 k
RFB2 [Ω]
1.5 k
EN
3.3
1.0 k
1.8
2.0 k
1.0 k
4.2 V
1.0
1.0 k
1.5 k
VREG
Note: RFB2 can be set to a maximum value of 10 kΩ.
A larger FBR2 value will be more susceptible
to noise.
UVLO
Soft Start Time (s)
VFB comparator threshold is adjusted to 1 %, but the
actual output voltage accuracy becomes more than
1 % due to the influence from the circuits other than VFB
comparator.
SS
0.6 V
In the case of VOUT setting = 3.3 V, the actual output
voltage accuracy becomes 2.5 %.
VFB
(VIN = 12 V, IOUT = 0 A, FCCM, Fsw = 750 kHz).
4. Soft Start Setting
VOUT
Soft Start function maintains the smooth control of the
output voltage during start up by adjusting soft start
time. When the EN pin becomes High, the current (2
µA) begin to charge toward the external capacitor
(Css) of SS pin, and the voltage of SS pin increases
straightly.
Figure : Soft Start Operation
Ver. CEB
12
NN30312A
OPERATION ( Continued )
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
5. Start-up / Shut-down Settings
6. Power ON / OFF sequence
The Start-up / Shut-down is enabled by the EN pin.
The EN pin can be set by either applying voltage from an
external voltage source or through a resistor
connected to the AVIN pin.
(1) When the EN pin is set to High after the VIN settles,
the BGR and the VREG start-up.
(2) When the VREG pin exceeds its threshold value, the
UVLO is released and the SOFT START sequence is
enabled.
Case 1: Setting up the EN pin using an external voltage
source. When an external voltage source is used, the
EN pin input voltage (VENH, VENL) should satisfy the
conditions as defined in the electrical characteristics
The capacitor connected to the SS pin begins to charge
and the SS pin voltage increases linearly.
(3) The VOUT pin (DC-DC Output) voltage increases at
the same rate as the SS pin.
AVIN VREG
Normal operation begins after the VOUT pin reaches the
set voltage.
(4) When the EN pin is set to “Low”, the BGR, VREG
and UVLO stop operation. The VOUT pin / SS pin
Voltage starts to drop and the VOUT pin discharge time
depends on the value of the Feedback resistors and the
output load current.
5 V (Max.)
EN
24
0 V
Figure : Internal circuit with EN pin
Note: The SS pin capacitor should be discharged
completely before restarting the startup sequence.
An incomplete discharge process might result in an
overshoot of the output voltage.
Case 2: Setting up the EN pin through a resistor
connected to AVIN pin. When setting up the EN pin
through a resistor connected to the AVIN pin, refer to
equations (1) and (2) to calculate the optimal resistor
settings.
VIN
EN
AVIN – Vd
Equation (1) : REN1 >
Id
(AVIN – VENH) × REN2
Equation (2) : REN1 <
VENH
4.2 V
12 V – 6 V
100 µA
VREG
= 60 kΩ
Equation (1) : REN1 >
Equation (2) : REN1 <
(12 V – 5 V) × 400 kΩ
= 560 kΩ
UVLO
5 V
0.6
2 µ
× Css
Soft Start Time (s) =
AVIN VREG
0.6 V
SS
AVIN
REN1
EN
VFB
VOUT
500
24
0.09
2 µ
× Css + 1 m
Delay Time (s) =
REN2 : 800 kΩ 50 %
PGOOD
Vd : 5.7 V 0.3 V
Id : more than 100 μA
Figure : Internal circuit with EN pin
(1) (2) (3)
(4)
Figure : Power ON/OFF sequence
Ver. CEB
13
NN30312A
OPERATION ( Continued )
Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.
7. Inductor and Output Capacitor Setting
IL
Eo⋅
2Ei⋅ Iox⋅ f
(
Ei − Eo
)
@ Ei = Ei_max
Io
0
Lo ≥
And its maximum current rating is
⊿IL/2
ΔIL
2
IL_max = Io_max +
(@ Ei = Ei_max)
0
Ic
The selection of COUT is primarily determined by the
ESR (Rc) required to minimize voltage ripple and load
transients. The output ripple Vrpl is approximately
bounded by:
⊿IL/2
Vo
Eo
Vrpl
Co⋅ Rc2
2Lo
ΔIL
8Co⋅ f
Vrpl =Vop −Vob = Ei⋅
Co⋅ Rc2
+
Ton
Q1
Eo⋅
(
Ei − Eo
)
= Ei⋅
+
T=1/f
Lo
2Lo
8Ei⋅ Lo⋅Co⋅ f 2
From the above equation, to achieve desired output
ripple, low ESR ceramic capacitors are recommended,
and its required RMS current rating is:
Vo(Eo)
IL
Q2
Io
Ic
Ei
Co
ΔIL
2 3
Ic(rms)_max =
(@ Ei = Ei_max)
Rc
Given the desired input and output voltages, the inductor
value and operating frequency determine the ripple
Current.
Eo⋅
Ei⋅ Lo⋅ f
(
Ei − Eo
)
ΔIL =
ΔIL
2
Iox =
Highest efficiency operation is obtained at low frequency
with small ripple current. However, achieving this
requires a large inductor. There is a trade-off among
component size, efficiency and operating frequency. A
reasonable starting point is to choose a ripple current
that is about 40 % of IOUT(MAX). The largest ripple
current occurs at the highest VIN. To guarantee that
ripple current does not exceed a specified maximum, the
inductance should be chosen according to:
Ver. CEB
14
NN30312A
TYPICAL CHARACTERISTICS CURVES
(1) Output Ripple Voltage
Condition : VIN=12V,Vout = 1.05V,Frequency = 750kHz,Skip Mode
I Load = 0A
I Load = 3A
Vout
Vout
LX
LX
I Load = 6A
I Load = 10A
Vout
Vout
LX
LX
Ver. CEB
15
NN30312A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(1) Output Ripple Voltage
Condition : VIN=12V,Vout = 1.05V,Frequency = 750kHz,FCCM Mode
I Load = 0A
I Load = 3A
Vout
Vout
LX
LX
I Load = 6A
I Load = 10A
Vout
Vout
LX
LX
Ver. CEB
16
NN30312A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(2) Load transient
Condition : VIN = 12 V, Vout = 1.05 V, Frequency = 750 kHz, Iout = 10 mA ÅÆ 10 A ( 0.5 A / μs )
Skip Mode FCCM Mode
VOUT (50 mV/div)
VOUT (50 mV/div)
16.5mV
11mV
10.5mV
10.5mV
IOUT (10 A/div)
IOUT (10 A/div)
Time (100 us/div)
Time (100 us/div)
Condition : VIN = 12 V, Vout = 1.05 V, Frequency = 750 kHz, Iout = 1 A ÅÆ 10 A ( 0.4 A / μs )
Skip Mode FCCM Mode
VOUT (50 mV/div)
VOUT (50 mV/div)
10mV
9.5mV
10.5mV
10mV
IOUT (10 A/div)
IOUT (10 A/div)
Time (100 us/div)
Time (100 us/div)
(3) Efficiency
Condition : Vin = 12 V, Vout = 1.05 V / 1.2 V / 1.8V / 3.3V / 5.0 V, Condition : Vin = 12 V, Vout = 1.05 V / 1.2 V / 1.8V / 3.3V / 5.0 V,
L = 4.7 μH, Cout = 66 μF (22 μF x 3), Frequency = 250 kHz
L = 1 μH, Cout = 66 μF (22 μF x 3), Frequency = 750kHz
Frequency = 750 kHz
100
Frequency = 250 kHz
100
90
80
70
60
90
80
70
60
FCCM/ Vo= 1.05V
50
40
30
20
10
0
FCCM/ Vo= 1.05V
FCCM/ Vo= 1.2V
FCCM/ Vo= 1.8V
FCCM/ Vo= 3.3V
FCCM/ Vo= 5.0V
SKIP/ Vo= 1.05V
SKIP/ Vo= 1.2V
SKIP/ Vo= 1.8V
SKIP/ Vo= 3.3V
SKIP/ Vo= 5.0V
50
40
30
20
10
0
FCCM/ Vo= 1.2V
FCCM/ Vo= 1.8V
FCCM/ Vo= 3.3V
FCCM/ Vo= 5.0V
SKIP/ Vo= 1.05V
SKIP/ Vo= 1.2V
SKIP/ Vo= 1.8V
SKIP/ Vo= 3.3V
SKIP/ Vo= 5.0V
IOUT (A)
IOUT (A)
Ver. CEB
17
NN30312A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(4) Load regulation
Condition : VIN = 12 V, Vout = 1.05 V, Frequency = 250 kHz
Load Regulation_f = 250kHz (skip mode)
Load regulation_f = 250kHz (FCCM mode)
1.100
1.080
1.060
1.040
1.020
1.000
1.100
1.080
1.060
1.040
1.020
1.000
IOUT (A)
IOUT (A)
Condition : VIN = 12 V, Vout = 1.05 V, Frequency = 750 kHz
Load Regulation_f = 750kHz (skip mode)
Load Regulation_f = 750kHz (FCCM mode)
1.100
1.080
1.060
1.040
1.020
1.000
1.100
1.080
1.060
1.040
1.020
1.000
IOUT (A)
IOUT (A)
(5) Line regulation
Condition : VIN = 12 V, Vout = 1.05 V, Frequency = 750 kHz, Iout = 1.5 A
Line Regulation_f = 750kHz (FCCM mode)
Line Regulation_f = 750kHz (skip mode)
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
VIN (V)
VIN (V)
Ver. CEB
18
NN30312A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(6) start/shut down
Condition : VIN = 12 V, Vout = 1.05 V, Frequency = 750 kHz, SKIP mode, Iout = 0 A
EN
SS
EN
SS
VOUT
VOUT
Time = 10ms/div
Time = 10ms/div
Condition : VIN = 12 V, Vout = 1.05 V, Frequency = 750 kHz, FCCM mode, Iout = 0 A
EN
SS
EN
SS
VOUT
VOUT
Time = 10ms/div
Time = 10ms/div
Condition : VIN = 12 V, Vout = 1.05 V, Frequency = 750 kHz, SKIP mode, Rload = 0.5 Ω
EN
SS
EN
SS
VOUT
VOUT
Time = 10ms/div
Time = 10ms/div
Condition : VIN = 12 V, Vout = 1.05 V, Frequency = 750 kHz, FCCM mode, Rload = 0.5 Ω
EN
SS
EN
SS
VOUT
VOUT
Time = 10ms/div
Time = 10ms/div
Ver. CEB
19
NN30312A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(7) Short Current Protection
Condition : VIN = 12 V, Vout = 1.05 V, Frequency = 750 kHz
Skip Mode
FCCM Mode
LX
LX
SS
SS
VOUT
VOUT
IOUT
IOUT
Time = 10ms/div
Time = 10ms/div
(8) Switching Frequency
Condition : Vin = 12 V, Vout = 1.05 V, Frequency = 750 kHz, Iout = 10 mA ~ 10 A
LX Average Frequency (MHz) Skip Mode
LX Average Frequency (MHz) FCCM Mode
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.01
0.1
1
10
0.01
0.1
1
10
ILOAD (A)
ILOAD (A)
Condition : Vout = 1.05 V, Frequency = 750 kHz, Iout = 5 A
LX Average Frequency (MHz) Skip Mode
LX Average Frequency (MHz) FCCM Mode
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0.55
0.50
4
6
8
10
12
14
16
18
20
22
24
26
28
30
4
6
8
10
12
14
16
18
20
22
24
26
28
30
VIN(V)
VIN(V)
Ver. CEB
20
NN30312A
TYPICAL CHARACTERISTICS CURVES ( Continued )
(9) Thermal Performance
Condition : VIN=12V , Vout = 1.05V , Frequency = 750kHz , ILoad = 6A , FCCM Mode
Ver. CEB
21
NN30312A
APPLICATIONS INFORMATION
Condition : Vout = 3.3 V, Frequency = 750 kHz, SKIP mode
PVIN
PVIN
C-BST
4 0 3 9 3 8 3 7 3 6 3 5 3 3 3 2
3 1
LX
SS
SS
C-PVIN5
C-PVIN6
VOUT
VOUT
VOUT
VFB
L-LX
R-FBX
R-FBX
VREG
VOUT
LX
VFB
EN
C-VREG
EN
FSEL
91011121314151617
18 19 20
C-DCDCOUT1
C-DCDCOUT2
C-DCDCOUT3
AVIN
AVIN
C-AVIN2
C-AVIN1
DCDCOUT
L-LX
PGND
Figure : layout
Figure : Application circuit
NN30312A
Figure : Top Layer with silk screen
( Top View ) with Evaluation board
Figure : Bottom Layer with silk screen
( Bottom View ) with Evaluation board
Notes) This application circuit and layout is an example. The operation of mass production set is not guaranteed. You should perform
enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the
above application circuit and information in the design of your equipment.
Ver. CEB
22
NN30312A
APPLICATIONS INFORMATION ( Continued )
Reference Designator
C-AVIN1
C-AVIN2
C-BST
QTY
2
Value
10 μF
0.1 μF
0.1 μF
22 μF
10 μF
0.1 μF
10 nF
1.0 μF
1.0 μH
Manufacturer
TAIYO YUDEN
Murata
Part Number
Note
UMK325AB7106MM-T
GRM188R72A104KA35L
GRM188R72A104KA35L
GRM32ER71E226KE15L
UMK325AB7106MM-T
GRM188R72A104KA35L
GRM188R72A103KA01L
GRM188R71E105KA12L
SPM6530-1R0M120
—
—
—
—
—
—
—
—
1
1
Murata
C-DCDCOUT
C-PVIN5
C-PVIN6
C-SS
3
Murata
2
TAIYO YUDEN
Murata
1
1
Murata
C-VREG
1
Murata
L-LX
1
TDK
FSEL
GND ( 1250 kHz )
OPEN ( 750 kHz )
4.7 μH
TOKO
FDA1254-4R7M
FSEL
VREG ( 250 kHz )
R-FB1
R-FB2
R-RB3
R-FB4
R-PG
1
1
1
1
1
3.3 kΩ
1.2 kΩ
1.0 kΩ
0
Panasonic
Panasonic
Panasonic
Panasonic
Panasonic
ERJ3EKF3301V
ERJ3EKF1201V
ERJ3EKF1001V
ERJ3GEY0R00V
ERJ3EKF1003V
—
—
—
—
—
100 kΩ
Figure : Recommended component
Ver. CEB
23
NN30312A
PACKAGE INFORMATION ( Reference Data )
Ver. CEB
24
NN30312A
PACKAGE INFORMATION ( Reference Data )
Power dissipation (Supplementary explanation)
Ver. CEB
25
NN30312A
IMPORTANT NOTICE
1.The products and product specifications described in this book are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore,
ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your
requirements.
2.When using the LSI for new models, verify the safety including the long-term reliability for each product.
3.When the application system is designed by using this LSI, be sure to confirm notes in this book.
Be sure to read the notes to descriptions and the usage notes in the book.
4.The technical information described in this book is intended only to show the main characteristics and application
circuit examples of the products. No license is granted in and to any intellectual property right or other right owned
by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to
the infringement upon any such right owned by any other company which may arise as a result of the use of
technical information de-scribed in this book.
5.This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of
our company.
6.This LSI is intended to be used for general electronic equipment.
Consult our sales staff in advance for information on the following applications: Special applications in which
exceptional quality and reliability are required, or if the failure or malfunction of this LSI may directly jeopardize
life or harm the human body.
Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automobile, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in
connection with your using the LSI described in this book for any special application, unless our company agrees
to your using the LSI in this book for any special application.
7.This LSI is neither designed nor intended for use in automotive applications or environments unless the specific
product is designated by our company as compliant with the ISO/TS 16949 requirements.
Our company shall not be held responsible for any damage incurred by you or any third party as a result of or in
connection with your using the LSI in automotive application, unless our company agrees to your using the LSI in
this book for such application.
8.If any of the products or technical information described in this book is to be exported or provided to non-residents,
the laws and regulations of the exporting country, especially, those with regard to security export control, must be
observed.
9. Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive.
Our company shall not be held responsible for any damage incurred as a result of your using the LSI not
complying with the applicable laws and regulations.
Ver. CEB
26
NN30312A
USAGE NOTES
1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed
operating conditions (operating power supply voltage and operating environment etc.). Especially, please be
careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off
and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as
redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical
injury, fire, social damages, for example, by using the products.
2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external
factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's
process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf
life and the elapsed time since first opening the packages.
3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board),
it might smoke or ignite.
4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit
between pins. In addition, refer to the Pin Description for the pin configuration.
5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to
problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical
verification on the assembly quality, because the same damage possibly can happen due to conductive
substances, such as solder ball, that adhere to the LSI during transportation.
6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs
such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin
short (load short) .
And, safety measures such as an installation of fuses are recommended because the extent of the above-
mentioned damage and smoke emission will depend on the current capability of the power supply.
7. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit
should not work during normal operation.
Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is
momentarily exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground
fault), the LSI might be damaged before the thermal protection circuit could operate.
8. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not
applied to the pins because the device might be damaged, which could happen due to negative voltage or
excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator
coils of optical pick-up is being driven.
9. The product which has specified ASO (Area of Safe Operation) should be operated in ASO
10. Verify the risks which might be caused by the malfunctions of external components.
11. Connect the metallic plates on the back side of the LSI with their respective potentials (AGND, PVIN, LX). The
thermal resistance and the electrical characteristics are guaranteed only when the metallic plates are connected
with their respective potentials.
Ver. CEB
27
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
ERJ3EKF3301V 替代型号
型号 | 制造商 | 描述 | 替代类型 | 文档 |
CRCW06033K30FKEA | VISHAY | Fixed Resistor, Metal Glaze/thick Film, 0.1W, 3300ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface | 完全替代 | |
ERJU03F3301V | PANASONIC | 耐硫化贴片电阻器 | 类似代替 |
ERJ3EKF3301V 相关器件
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ERJ3EKF3320B | PANASONIC | Fixed Resistor, Metal Glaze/thick Film, 0.063W, 332ohm, 50V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP | 获取价格 | |
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ERJ3EKF3323V | PANASONIC | Fixed Resistor, Metal Glaze/thick Film, 0.1W, 332000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603, CHIP | 获取价格 | |
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