ERJ6RBD112V [PANASONIC]
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1100ohm, 150V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0805, CHIP;
| 型号： | ERJ6RBD112V |
| 厂家： | 
PANASONIC |
| 描述： | Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1100ohm, 150V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0805, CHIP 电阻器 |
| 文件： | 总6页 (文件大小：847K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Precision Thick Film Chip Resistors
Precision Thick Film Chip Resistors
ERJ G: 0201
ERJ R: 0402, 0603, 0805
ERJ E: 0603, 0805, 1206,
1210, 1812, 2010, 2512
Type: ERJ 1G
ERJ 2R, 3R, 6R
ERJ 3E, 6E, 8E, 14, 12, 1T
n Features
l Small size and lightweight
l Low Resistance Tolerance
ERJ1G, 2R, 3E, 6E, 8E, 14, 12, 1T Series ...
For PCB size reduction and lightweight products
l High reliability
±
1%
ERJ2R, 3R, 6R Series ............................
l Reference Standards
±
0.5%
Metal glaze thick film resistive element and three
layered electrode results in high reliability.
l Matching with placement machines
Bulk, Taping and magazine packagings for
automatic placement machines
IEC 60115-8, JIS C 5201-8
l Solderability
Suitable for both reflow soldering and flow soldering
n Explanation of Part Numbers
l ERJ2R, 3R, 6R Series, ±0.5 % type
Precision Thick Film Chip Resistors
l ERJ1G Series, ±1 % type
l ERJ2R, 3E, 6E, 8E, 14, 12, 1T Series, ±1 % type
n Construction
n Dimensions in mm (not to scale)
Dimensions (mm)
Mass (Weight)
[g/1000 pcs.]
Type
(inches)
L
W
a
b
t
ERJ1G
(0201)
0.60±0.03 0.30±0.03 0.10±0.05 0.15±0.05 0.23±0.03
0.15
0.8
2
ERJ2R1
1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05
(0402)
ERJ3R1
+0.15
1.60±0.15 0.80
0.30±0.20 0.30±0.15 0.45±0.10
Ð0.05
(0603)
ERJ6R1
2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10
4
(0805)
ERJ3EK
(0603)
+0.15
1.60±0.15 0.80
0.30±0.20 0.30±0.15 0.45±0.10
2
Ð0.05
ERJ6EN
(0805)
2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10
4
ERJ8EN
(1206)
+0.05
Ð0.20
+0.05
Ð0.15
3.20
1.60
0.50±0.20 0.50±0.20 0.60±0.10
10
16
27
27
45
ERJ14N
(1210)
3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10
4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10
5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10
6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10
ERJ12N
(1812)
ERJ12S
(2010)
ERJ1TN
(2512)
Precision Thick Film Chip Resistors
n Ratings
<±0.5 %>
Category Temperature
Resistance
Ranges
(W)
Limiting Element
Voltage (Maximum
RCWV)(1) (V)
T.C.R.
[´10-6/ûC
(ppm/ûC)]
Type
Power Rating
at 70 ¡C (W)
Maximum Overload Resistance
TeRmanpgeera¡(tOuCrpeeRraatningge)
)
(inches)
Voltage(2) (V)
Tolerance (%)
(
ERJ2RH
(0402)
to
100
(E24, E96)
to
100 K
±50
-55 to +125
0.063
50
100
±0.5
10
102 k
(E24, E96)
to
97.6
ERJ2RK
(0402)
to
-55 to +125
0.063
0.063
0.063
50
50
50
100
100
100
±0.5
±0.5
±0.5
±0.5
±0.5
1 M
±100
±50
100
(E24, E96)
100 K
ERJ3RB
(0603)
-55 to +125
-55 to +125
to
10
97.6
ERJ3RE
(0603)
102 k to 1 M
(E24, E96)
±100
to
100
100 K
ERJ6RB
(0805)
0.1
0.1
150
150
200
200
±50
-55 to +125
-55 to +125
(E24, E96)
to
10
97.6
ERJ6RE
(0805)
102 k to 1 M
(E24, E96)
±100
<±1 %>
Category Temperature
Resistance
Ranges
(W)
Limiting Element
Voltage (Maximum
RCWV)(1) (V)
T.C.R.
[´10-6/ûC
(ppm/ûC)]
Type
Power Rating
at 70 ¡C (W)
Maximum Overload Resistance
TeRmanpgeera¡(tOuCrpeeRraatningge)
)
(inches)
Voltage(2) (V)
30
Tolerance (%)
(
10 to 1 M
(E24, E96)
10 to 1 M
(E24, E96)
10 to 1 M
(E24, E96)
10 to 2.2 M
(E24, E96)
10 to 2.2 M
(E24, E96)
10 to 1 M
(E24, E96)
10 to 1 M
(E24, E96)
10 to 1 M
(E24, E96)
ERJ1G
(0201)
ERJ2RK
(0402)
ERJ3EK
(0603)
ERJ6EN
(0805)
ERJ8EN
(1206)
ERJ14N
(1210)
ERJ12N
(1812)
0.05
0.063
0.1
15
±1
±1
±1
±1
±1
±1
±1
±1
±1
±200
±100
±100
±100
±100
±100
±100
±100
±100
-55 to +125
-55 to +125
-55 to +155
-55 to +155
-55 to +155
-55 to +125
-55 to +125
-55 to +125
-55 to +125
50
100
50
100
0.125
0.25
0.25
0.5
150
200
200
200
200
200
200
400
400
400
ERJ12S
(2010)
ERJ1TN
(2512)
0.5
400
10 to 1 M
1
400
(E24, E96)
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating ´ Resistance Values, or Limiting Element Voltage
Ö
(max. RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 ´ Power Rating or max. Overload Voltage listed above
whichever less.
Power Derating Curve
For resistors operated in ambient temperatures above
70 ¡C, power rating shall be derated in accordance
with the right figure.
3E, 6E, 8E
1G, 2R, 3R, 6R
14, 12, 1T
Precision Thick Film Chip Resistors
n Packaging Methods (Taping)
l Standard Quantity
Type
Kind of Taping
Pitch (P
2 mm
1
)
Quantity
ERJ1G
Pressed Carrier Taping
15000 pcs./reel
10000 pcs./reel
ERJ2RH, ERJ2RK
ERJ3R1, ERJ3EK
ERJ6R1, ERJ6EN
ERJ8EN
Punched Carrier Taping
5000 pcs./reel
4000 pcs./reel
ERJ14N
4 mm
ERJ12N
Embossed Carrier Taping
ERJ12S
ERJ1TN
(Unit : mm)
l Carrier Tape
Pressed Carrier
Punched Carrier
Embossed Carrier
Type
A
B
W
F
E
P1
P2
P0
fD0
T
fD1
0.38±0.05
0.68±0.05
0.42±0.05
_
ERJ1G
2.00±0.10
ERJ2RH, ERJ2RK 0.70±0.05
ERJ3R1, ERJ3EK 1.10±0.10
ERJ6R1, ERJ6EN 1.65±0.15
ERJ8EN
ERJ14N
ERJ12N
ERJ12S
ERJ1TN
1.20±0.05
1.90±0.10
2.50±0.20
3.60±0.20
3.50±0.20
4.80±0.20
0.52±0.05
0.70±0.05
_
_
_
_
8.00±0.20
3.50±0.05
0.84±0.05
2.00±0.15
2.80±0.20
3.50±0.20
2.80±0.20
3.60±0.20
1.75±0.10
2.00±0.05
4.00±0.10
1.50
+0.10
-0
8.00±0.30
4.00±0.10
1.0
+0.10
-0
1.00±0.10
5.30±0.20 12.00±0.30 5.50±0.20
6.90±0.20
1.5 min.
l Taping Reel
(Unit : mm)
T
Type
ERJ1G
fA
fB
fC
W
ERJ2RH, ERJ2RK
ERJ3R1, ERJ3EK
ERJ6R1, ERJ6EN
ERJ8EN
9.0±1.0
11.4±1.0
15.4±2.0
+0
180.0
60 min. 13.0±1.0
-3.0
ERJ14N
ERJ12N
ERJ12S
13.0±1.0
ERJ1TN
Precision Thick Film Chip Resistors
n Recommended Land Pattern
In the case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In the case of reflow soldering,
solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3 times chip resistor width (W).
Dimensions (mm)
Type (inches)
a
b
c
ERJ1G
ERJ2R
(0201) 0.3 to 0.4
0.8 to 0.9 0.25 to 0.35
(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERJ3R, 3EK (0603) 0.7 to 0.9 2 to 2.2
0.8 to 1
ERJ6R, 6EN (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4
ERJ8EN
ERJ14N
ERJ12N
ERJ12S
ERJ1TN
(1206) 2 to 2.4
(1210) 2 to 2.4
4.4 to 5 1.2 to 1.8
4.4 to 5 1.8 to 2.8
(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5
(2010) 3.6 to 4
6.2 to 7 1.8 to 2.8
(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5
n Recommended Soldering Conditions
Recommendations and precautions are described below.
lRecommended soldering conditions for reflow
áReflow soldering shall be two times maximum.
áPlease contact us for additional information when you
use in conditions other than those specified.
áPlease measure a temperature of terminations and study
solderability every kind of solder and board, before actual
use.
For solder (Example : Sn/Pb)
Temperature
Time
Preheating
Main heating
Peak
140 ¡C to 160 ¡C
Above 200 ¡C
235 ± 5 ¡C
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free solder (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
Main heating
Peak
150 ¡C to 180 ¡C
Above 230 ¡C
max. 260 ¡C
60 s to 120 s
30 s to 40 s
max. 10 s
lRecommended soldering conditions for flow
For solder
For lead-free solder
Temperature
140 ¡C to 160 ¡C
245±5 ¡C
Time
60 s to 120 s
20 s to 30 s
Temperature
150 ¡C to 180 ¡C
max. 260 ¡C
Time
60 s to 120 s
max. 10 s
Preheating
Soldering
Cautions for Safety
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Precision Thick Film Chip Resistors (hereafter
called the Resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the Resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the Resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the Resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the Resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at 350 ¡C
max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the Resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply a shock to the Resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the Resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bend of printed circuit boards in order to protect the Resistors from abnormal stress.
Caution for Safety
(Common precautions for Fixed Resistors)
¥ When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
¥ Do not use the products beyond the specifications described in this catalog.
¥ This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
¥ Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
] Systems equipped with a protection circuit and a protection device
] Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
¥ These products are designed and manufactured for general purpose and standard use in general electronic
equip ment (e.g. AV equipment, home electric appliances, office equipment, information and communication
equipment)
¥ These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl
2
, H
2
3
S, NH , SO
2
, or NO
2
4. In an environment where strong static electricity or electromagnetic waves exist
5. In an environment where these products cause dew condensation
6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
¥ These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
¥ Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products .
¥ Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
perfor mance or reliability of the products.
¥ Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 ¡C to 35 ¡C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl
2
, H
2
3
S, NH , SO
2
, or NO
2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
– ER3 –
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