EXBA10P154J [PANASONIC]
贴片电阻电路;型号: | EXBA10P154J |
厂家: | PANASONIC |
描述: | 贴片电阻电路 电阻器 |
文件: | 总5页 (文件大小:462K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Chip Resistor Networks
Chip Resistor Networks
Type: EXBD:1206
EXBE:1608
EXBA:2512
EXBQ:1506
n Features
l High density placing for digital signal circuits
á Bussed 8 or 15 resistors for pull up/down circuits
EXBD: 3.2 mm ´ 1.6 mm ´ 0.55 mm, 0.635 mm pitch
EXBE: 4.0 mm ´ 2.1 mm ´ 0.55 mm, 0.8 mm pitch
EXBA: 6.4 mm ´ 3.1 mm ´ 0.55 mm, 1.27 mm pitch
EXBQ: 3.8 mm ´ 1.6 mm ´ 0.45 mm, 0.5 mm pitch
á Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB
(ÒHigh density placingÓ is shown below)
l High speed mounting using conventional placing machine
l Approved under the ISO 9001 system
<High density placing>
Direct placement on the bus line
n Explanation of Part Numbers
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeroes
following.
Rev.02/04
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Chip Resistor Networks
n Construction (Example : EXBD)
Protective coating
High purity alumina substrate
Terminals
n Dimensions in mm (not to scale)
EXBD
EXBE
EXBA
EXBQ
n Circuit Configuration
EXBD, EXBE
EXBA
EXBA10E
EXBQ
EXBA10P
n Ratings
Item
Specifications
Series
EXBD
EXBE
EXBA
EXBQ
Resistance Range
47 W to 1 MW (E12 series)
±5 %
100 W to 470 kW (E6 series)
Resistance Tolerance
Number of Terminals
Number of Resistors
Power Rating at 70 ¡C
10 terminals
8 resistors
16 terminals
15 resistors
0.025 W/element
0.05 W/element
0.063 W/element
Limiting Element Voltage
25 V
50 V
50 V
25 V
50 V
(Maximum Rated Continuous Working Voltage)(1)
Maximum Overload Voltage(2)
T.C.R.
100 V
±200 ´10-6/ûC( ppm/ûC)
Category Temperature Range
Ð55 ûC to +125 ûC
(Operating Temperature Range)
(1) Rated Continuous Working Voltage (RCWV) should be determined from RCWV= Power Rating ´ Resistance Value, or Limiting Element Voltage
Ö
(maximum RCWV) listed above, whichever is less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) should be determined
from SOTV=2.5 ´ RCWV] or Maximum Overload Voltage listed above whichever is less.
Power Derating Curve
For resistors operating in ambient temperature above
70 ¡C, power rating should be derated in accordance
with the right figure.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Chip Resistor Networks
n Recommended Land Pattern (mm)
EXBD
EXBE
Pitch 0.8 mm
Pitch 0.635 mm
For
popular
pattern
Pitch 0.4 mmáááThrough-hole less
For high
density
]
pattern
EXBA
EXBQ
Pitch 1.27 mm
For
popular
pattern
Pitch 0.5 mm
Pitch 0.635 mmáááThrough-hole less
For high
density
]
pattern
] When designing high density land patterns, examine the reliability of isolation among the lines and adopt the
chip resistor networks.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Chip Resistor Networks
n Packaging Specifications
l
Standard Quantity
Type
Thickness (mm)
0.55 ± 0.10
Weight (mg) Punched (Paper) Taping Embossed Taping
(inches)
EXBD
(1206)
10
16
40
9
5000 pcs./reel
Ñ
EXBE
(1608)
4000 pcs./reel
Ñ
EXBA
(2512)
EXBQ
(1506)
0.45 ± 0.10
5000 pcs./reel
Ñ
n Taping Dimensions
l
Embossed Taping Reel
l Embossed Taping
Type
EXBE
EXBA
fA
fB
fC
Type
EXBE
A
B
W
F
E
P0
2.50±0.20 4.40±0.20
3.50±0.20 6.80±0.20
Dimensions
(mm)
0
Dimensions
(mm)
12.00±0.30 5.50±0.10 1.75±0.20 4.00±0.10
180.0 Ð3.0
60 min.
13.0±1.0
EXBA
Type
EXBE
EXBA
W
T
Type
EXBE
EXBA
P1
P2
fD0
t1
t2
fD1
Dimensions
(mm)
Dimensions
(mm)
4.00±0.10 2.00±0.10 1.50+0.10 0.25±0.05 1.10±0.20 1.50+0.10
13.0±1.0
15.4±2.0
0
0
l
Punched (Paper) Taping Reel
l
Punched (Paper) Taping
Type
fA
fB
fC
Type
A
B
W
F
E
P0
EXBD 2.00±0.20 3.60±0.20
EXBQ 1.90±0.20 4.10±0.20
EXBD
EXBQ
Dimensions
(mm)
Dimensions
(mm)
0
13±1.0
8.00±0.20 3.50±0.10 1.75±0.10 4.00±0.10
180.0 Ð3.0
60 min.
Type
W
T
Type
EXBD
EXBQ
P1
P2
fD0
t
0.84±0.10
0.64±0.05
EXBD
EXBQ
Dimensions
(mm)
Dimensions
(mm)
9.0±1.0
11.4±2.0
4.00±0.10
2.00±0.10
1.50+0.10
0
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
Chip Resistor Networks
Safety Precautions
1. Soldering
Recommendations for soldering method.
lRecommended soldering conditions for reflow
áReflow soldering should be a maximum of two times
áPlease contact us for additional information when
used in conditions other than those specified.
áPlease measure the temperature of the terminations and
For solder (Example : Sn/Pb)
Temperature
140 ¡C to 160 ¡C
Above 200 ¡C
235 ± 5 ¡C
Time
Preheating
Main heating
Peak
60 s to 120 s
30 s to 40 s
max. 10 s
every type of the printed circuit board for solderability,
study
before actual use.
For lead-free solder (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
Main heating
Peak
150 ¡C to 180 ¡C
Above 230 ¡C
max. 260 ¡C
60 s to 120 s
30 s to 40 s
max. 10 s
l Flow soldering
Cosult us for using flow soldering to EXBA series. Flow soldering is not recommended for Chip Resistor Networks:
EXBD/EXBE/EXBQ, because solder bridge may occur due to the 0.635 mm/0.8 mm/0.5 mm pitch of
EXBD/EXBE/EXBQ series.
l Iron soldering
1 Solder at 350 ¡C max. and 3 seconds max. with the soldering iron tip.
2 The soldering iron tip shall not touch the protective coating of the part.
l Use rosin type flux. Do not use high-activity flux (the chlorine content is 0.2 wt% or more).
l Allow enough preheating so that the difference of soldering temperature and surface
temperature of the part is 100 ¡C or less. This temperature difference should be controlled by immersion into solvent.
l Avoiding excessive amounts of solder. More solder causes mechanical stress to the part which may result in cracking
or impaired characteristics.
2. Cleaning
l Residual flux after board washing may cause solder migration. Carefully monitor board after washing.
Carefully select the type and amount of flux to be used when no washing is done. Study type of water-soluble flux and
cleaning agent and drying condition when water washing is done. Confirm that cleaning will not affect the device
performace.
3. Others
l Take necessary precautions to avoid any abnormal stress caused by bending of the board.
l Do not use the product in high humidity atmospheres.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
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