EXBVHV472GV [PANASONIC]
Chip Resistor Array; 片式电阻阵列
| 型号： | EXBVHV472GV |
| 厂家： | 
PANASONIC |
| 描述： | Chip Resistor Array |
| 文件： | 总5页 (文件大小：434K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip Resistor Array
Chip Resistor Array
Type:
EXB1:0201x2
EXB2:0402x2, 0402x4, 0402x8
EXB3:0603x2, 0603x4
EXBV:0603x2, 0603x4
EXBS:0805x4
■ Features
● High density
(14V, Convex Terminal)
2 resistors in 0.8 mm × 0.6 mm size
2 resistors in 1.0 mm × 1.0 mm size
2 resistors in 1.6 mm × 1.6 mm size
2 resistors in 1.6 mm × 1.6 mm size
4 resistors in 2.0 mm × 1.0 mm size
4 resistors in 3.2 mm × 1.6 mm size
4 resistors in 3.2 mm × 1.6 mm size
4 resistors in 5.08 mm × 2.2 mm size
8 resistors in 3.8 mm × 1.6 mm size
● Improvement of placement efficiency
(24V, Convex Terminal)
(34V, Convex Terminal)
(V4V, Concave Terminal)
(28V, Convex Terminal)
(38V, Convex Terminal)
(V8V, Concave Terminal)
(S8V, Concave Terminal)
(2HV, Convex Terminal)
Placement efficiency of Chip Resistor Array is two or four or eight times of the flat type chip resistor
● Approved under the ISO 9001 system
■ Explanation of Part Numbers
E
X
B
V
8
V
4
7
2
J
V
■ Construction (Example : EXBV8V)
■ Schematics
● Isolated type
14V, 24V, 34V, V4V
2 resistors
28V, 38V, V8V, S8V
4 resistors
2HV
8 resistors
Chip Resistor Array
■ Dimensions in mm (not to scale)
24V
V8V, S8V
V4V
28V
38V
14V, 34V
2HV
Type
Dimensions (mm)
(inches)
L
W
T
A
B
fD
P
E
G
EXB14V
(0201×2)
0.80±0.10
0.60±0.10
0.35±0.10
0.35±0.10
(0.15±0.10
)
Ñ
0.50±0.10
Ñ
0.15±0.10
EXB24V
1.00±0.05
1.00±0.05
0.35±0.05
0.35±0.10
0.60±0.10
0.50±0.10
0.60±0.10
0.50±0.10
0.70±0.20
0.45±0.10
0.33±0.05
0.20±0.10
0.60±0.10
0.45±0.15
0.60±0.10
0.45±0.15
0.80±0.15
0.30±0.10
0.15±0.10
0.20±0.10
0.30±0.15
(0.30±0.20
0.30±0.15
(0.30±0.20
0.50±0.15
(0.30±0.10
0.34±0.05
Ñ
0.65±0.10
0.50±0.10
0.80±0.10
0.80±0.15
0.80±0.10
0.80±0.15
1.27±0.20
0.50±0.10
Ñ
Ñ
0.25±0.05
0.25±0.10
0.40±0.15
0.30±0.20
0.45±0.15
0.35±0.20
0.55±0.15
(0402×2)
EXB28V
(0402×4)
2.00±0.10
1.00±0.10
EXBV4V
(0603×2)
+0.20
+0.20
1.60
1.60
(0.3)
Ñ
0.45±0.10
Ñ
Ð0.10
Ð0.10
EXB34V
(0603×2)
1.60±0.20
1.60±0.15
)
)
)
EXBV8V
(0603×4)
+0.20
+0.20
3.20
1.60
(0.3)
Ñ
0.45±0.10
Ñ
Ð0.10
Ð0.10
EXB38V
(0603×4)
3.20±0.20
1.60±0.15
EXBS8V
(0805×4)
+0.20
+0.20
5.08
2.20
(0.5)
Ñ
0.70±0.20
Ñ
Ð0.10
Ð0.10
EXB2HV
(0402×8)
3.80±0.10
1.60±0.10
0.30±0.10
(
) Reference
Chip Resistor Array
■ Ratings
Item
14V
2HV
Specifications
Item
Specifications
12.5
V
(1)
10 Ω to 1 MΩ: E24 series
Limiting Element Voltage
Resistance Range
ResistanceTolerance
25 V
Max. Rated Continuous
J: ±5 %
14V,2HV,24V,28V,38V,34V
24V,28V,38V,34V,V4V,V8V 50 V
(
)
Working Voltage
G: ±2 %, J: ±5 %
S8V
14V
2HV
100 V
25 V
50 V
V4V,V8V,S8V
14V,24V,V4V,34V 4 terminal
Number of Terminal
Number of Resistors
8 terminal
Max. Over-load Voltage(2)
28V,38V,V8V,S8V
2HV
24V,28V,38V,34V,V4V,V8V 100 V
16 terminal
S8V
200 V
2 resistors
14V,24V,V4V,34V
28V,38V,V8V,S8V
2HV
T.C.R.
±200 ×10Ð6/ûC(ppm/ûC)
4 resistors
Category Temperature Range
(Operating Temperature Range)
8 resistors
Ð55 ûC to 125 ûC
0.031 W/element
0.063 W/element
0.1 W/element
14V,28V
1 A
2 A
2 A
4 A
(A) R000
Rated Current
(A) R000
14V,2HV,24V,28V,38V,34V,V4V,V8V
S8V
14V,2HV,24V,28V,38V,34V,V4V,V8V
24V,V4V,34V,V8V,38V
S8V
Power Rating at 70 ¡C
0.063 W/element
2HV
(0.25 W/package)
Max. Overload Current S8V
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating × Resistance Value, or Limiting Element Voltage (max.
√
RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 × Power Rating or max. Overload (Voltage) listed above whichever less.
Power Derating Curve
For resistors operated in ambient temperature above
70 ¡C, power rating shall be derated in accordance
with the right figure.
■ Packaging Methods
● Standard Quantity
Type
(inches)
Thickness
(mm)
Weight/1000 pcs.
(g)
Punched (Paper) Taping
Embossed Taping
EXB14V
0.35
0.35
0.6
14V: 0.5
24V: 1.2 28V:
10000 pcs./reel
10000 pcs./reel
5000 pcs./reel
5000 pcs./reel
Ñ
Ñ
(0201×2)
EXB24V, 28V
(0402×2, 0402×4)
2
Ñ
EXBV4V, V8V
(0603×2, 0603×4)
V4V: 5
V8V: 10
Ñ
EXB34V, 38V
(0603×2, 0603×4)
0.5
34V: 3.5 38V:
S8V: 30
7
Ñ
2500 pcs./reel
Ñ
EXBS8V
(0805×4)
0.7
EXB2HV
(0402×8)
0.45
2HV: 9
5000 pcs./reel
Chip Resistor Array
● Punched (Paper) Taping Reel
● Punched (Paper) Taping
Type
A
B
W
F
E
14V 0.70±0.05 0.90±0.05
24V
28V
V4V
34V
V8V
38V
1.20±0.05
2.20±0.10
1.20±0.05
Dimensions
(mm)
1.95±0.15 1.95±0.20 8.00±0.20 3.50±0.05 1.75±0.10
Type
fA
fB
fC
14V, 2HV
24V, 28V
V4V, 34V
V8V, 38V
2.00±0.15 3.60±0.20
Dimensions
(mm)
180.0Ð03.0
60 min.
13.0±1.0
2HV 1.90±0.15 4.10±0.15
Type
P1
P2
P0
fD0
T
Type
W
T
14V
14V, 2HV
24V, 28V
V4V, 34V
V8V, 38V
24V 2.00±0.10
28V
0.45±0.05
Dimensions
(mm)
9.0±1.0
11.4±2.0
Dimensions
(mm)
V4V
0.84±0.05
0.64±0.05
0.84±0.05
2.00±0.05 4.00±0.10 1.50+0.10
0
34V
V8V 4.00±0.10
38V
0.64±0.05
2HV
● Embossed Taping
● Embossed Taping Reel
Type
A
B
W
F
E
P0
Type
S8V
fA
fB
60 min.
fC
Dimensions
(mm)
Dimensions
(mm)
S8V 2.80±0.20 5.70±0.20 12.00±0.30 5.50±0.05 1.75±0.10 4.00±0.10
0
180.0 Ð3.0
13.0±1.0
Type P1 P2 fD0 t2 fD1
Dimensions
(mm)
Type
S8V
W
T
Dimensions
(mm)
S8V 4.00±0.10 2.00±0.05 1.50+0.10 1.6 max. 1.50+0.10
13.0±1.0
15.4±2.0
0
0
■ Land pattern design
Recommendable land pattern design for Network chip is as shown below figure.
(Not to scale)
Unit (mm)
Dimensions
Type
a
b
c
p
f
14V
24V
28V
0.3
0.5
0.4
0.3
0.3
0.50
0.65
0.50
0.80
0.80
1.27
0.50
0.9
1.4 to 1.5
1.4
2 to 2.4
2.2 to 2.6
3.2 to 3.8
2
0.35 to 0.40 0.35 to 0.40
0.525 0.25
V4V,V8V 0.7 to 0.9 0.4 to 0.45 0.4 to 0.45
34V,38V 0.7 to 0.9 0.4 to 0.5 0.4 to 0.5
S8V
1 to 1.2 0.5 to 0.75 0.5 to 0.75
0.425 0.25
2HV
1
Chip Resistor Array
Cautions for Safety
1. Component Placement
A Take measure against mechanical stress during and after mounting so as not to damage the termination
and protective coating.
B Misplacement of components on the land pattern may cause solder bridge problem.
2. Soldering
Precaution and recommondations are described
below.
(a)Soldering iron
Keep the followings:
A Soldering iron tip shall not touch the protective
coating of the part.
B Solder as quick as possible (within 3 seconds)
when the temperature of the soldering iron tip is
over 280 ¡C.
(b)Reflow soldering
Recommendable reflow soldering is shown right.
3. Cleaning
Recommendable cleaning method is shown below.
Cleaning condition
Solvents
Dipping
Ultrasonic wave washing
1 minute maxium
Isopropyl
Alcohol
5 minutes
maximum
Power: 20 W/L
[
]
Frequency: 10 kHz to 100 kHz
4. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and
confirmation test with the resistors actually mounted on your own board.
When the load of more than rated power is applied under the load condition at steady state, it may impair
performance and/or reliability of resistor. Never exceed the rated power.
5. Chlorine type or other high-activity flux is not recommeded as the residue may affect performance or reliability
of resistors.
6. When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron.
When using a soldering iron with a tip at high temperature, solder for a time as short as possible (three
seconds or less up to 350 ¡C).
7. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as
it may damage protective film or the body of resistor and may affect resistorÕs performance.
8. Do not use the product in dewy atmospheres.
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