EZASCE101M [PANASONIC]

Chip 3-Terminal Capacitor Array; 芯片3端子电容器阵列


型号：	EZASCE101M
厂家：	PANASONIC
描述：	Chip 3-Terminal Capacitor Array 芯片3端子电容器阵列电容器
文件：	总6页 (文件大小：242K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Chip 3-Terminal Capacitor Array

Type:

EZASC

EZANC

GND

■ Features

Suitable for EMI suppression ﬁltering

● The low residual inductance at high frequency range provides effective reduction of noise

● Equivalent noise reduction to the EMI ﬁlters with low cost design

Compact design for high density PWB assembly

● EZASC : 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.8 mm pitch

EZANC : 6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch

● Flat and square packages suitable for high speed automatic placement machine

Superior mountability with concave terminals

● Firm solder joint (2 times that of convex terminal type)

● Self-aligning placement during reﬂow soldering

Digital cordless phone

(4 line mounting)

RF Circuit

(EZA SC)

I/O

Digital Control Circuit

Prevent high frequency harmonic

noise to RF circuits

EZASC: 0.8 mm pitch

EZANC: 1.27 mm pitch

3-Terminal Capacitors or EMI Filters

■ Recommended Applications

● Digital equipment such as PCs, printers, HDD, PCMCIA cards, PDAs, and word processors

● Communication equipment, digital cordless phones, automobile phones, GSM, PHS, DECT

● Digital audio and video equipment

● Electronic musical instruments, and other digital devices

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Feb. 2006

Chip 3-Terminal Capacitor Array

■ Explanation of Part Number

Product Code

Dimensions and

Circuit Configuration

Temperature Capacitance Value

Characteristics

Capacitance Suffix for Special

Tolerance

Requirement

4.0 mm

҂2.1 mm

6.4 mm

҂3.1 mm

Thick Film Noise

Suppression and

Filtering

+20 %/–55 %

(–25°C to +85 °C)

The first two digits are significant

20 %

+30 %

Four 3-Terminal

Capacitors

figures of capacitance value,

and the third one denotes the

number of zeros following

ex. 101ৎ100 pF

When less

–20 %

than 22 pF

Components

■ Construction

■ Circuit Conﬁguration

Alumina substrate

Protective coating

GND

CIOI

Electrode

(Outer)

Electrode

(Outer)

GND

Electrode

(Outer)

■ Dimensions in mm (not to scale)

EZASC

EZANC

f 0.4⁺_–

0.1

0.2

0.4 0.2

0.7 0.2

+0.1

0.25 0.20

f 0.3

–0.2

0.5 0.2

CIOI

1.27 0.10

6.4 0.2

0.8 0.1

4.0 0.2

+0.20

0.75

–0.10

0.4 0.2

0.3 0.2

0.45 0.20

0.65⁺^–⁰⁰^.^.²¹⁰⁰

0.56 0.20

Size : 1608 inches

Mass (Weight) [1000 pcs.] : 17 g

Size : 2512 inches

Mass (Weight) [1000 pcs.] : 52 g

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Feb. 2006

Chip 3-Terminal Capacitor Array

■ Ratings

Speciﬁcation

Item

EZASC

EZANC

Capacitance Values

10 pF to 180 pF

Standard : 22 pF, 47 pF, 100 pF

22 pF, 47 pF, 100 pF, 220 pF, 470 pF

(25 °C, 1 kHz⁽¹⁾, 1 Vrms)

+30%

Capacitance Tolerance

Temperature Characteristic

Dissipation Factor

20% (

in the case of Less than 22 pF)

–20%

E Characteristic: +20 %/ 55 % ( 25 °C to +85 °C)

Less than 2 % (25 °C, 1 kHz⁽¹⁾, 1 Vrms)

25 V

Rated Voltage

Rated Current ⁽²⁾

200 mA

300 mA

Resistance ⁽³⁾

Less than 1

Category Temperature Range (Operating Temperature Range)

–25 °C to +85 °C

(1) In measuring at 1MHz, Capacitance Value and Dissipation Factor are different.

(2) Rated Current between Input terminal and Output terminal.

(3) Resistance value between Input terminal and Output terminal.

■ Attenuation Characteristics

Measurement Circuit

1 kȑ

50 ȑ

EZANC

2000 pF

MN74HC04

MN74HC04 MN74HC04

50 ȑ

8 MHz

EZA

SCE470M

Chip 3-Terminal Capacitor Array (EZANC)

100

200

400

600

800

1000

100

200

400

600

800 1000

Frequency (MHz)

10M

100M

Frequency (Hz)

Equivalent to EMI ﬁlter

✽

■ Packaging Methods (Taping)

● Standard Quantity

Type

Kind of Taping

Embossed Carrier Taping

Pitch (P₁)

4 mm

Quantity

4000 pcs./reel

EZASC

EZANC

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Feb. 2006

Chip 3-Terminal Capacitor Array

● Embossed Carrier Taping

● Taping Reel

t₁

Compartment

Sprocket hole

t₂

P₁P₂P₀

Tape running direction

Chip component

Type

P₀

0.20

EZASC 2.50

EZANC 3.50

4.40

6.80

Dimensions

0.30

0.20

0.10

12.00

5.50

1.75

4.00

(mm)

Dimensions

(mm)

1.0

180

60 min.

13.0

−3.0

Type

EZASC

EZANC

P₁

P₂

D₀

t₁

t₂

1.15

1.30

D₁

0.20

Dimensions

(mm)

Dimensions

(mm)

0.10

0.05

+0.10

−0

4.00

2.00

1.50−⁺⁰0^.100.25

1.50

1.0

2.0

13.0

15.4

■ Recommended Land Pattern Design

Chip 3-Terminal Capacitor Array

(EZANC/EZASC)

GND

Land pattern

Solder resistant

Type

EZASC

EZANC

1.2 to 1.4

0.4

3.1 to 3.3 0.4 to 0.5

0.8

1.8

2.9 to 3.3 4.8 to 5.2

4.2 to 4.6 7.5 to 7.9

0.8

Dimensions

(mm)

2.2 to 2.4 0.4 to 0.6 5.7 to 5.9 0.4 to 0.8

1.27

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Feb. 2006

Chip 3-Terminal Capacitor Array

■ Recommended Soldering Conditions

Recommendations and precautions are described below.

● Recommended soldering conditions for reﬂow

For soldering (Example : Sn/Pb)

Temperature

140 °C to 160 °C

·Reﬂow soldering shall be performed a maximum of

two times.

Time

·Please contact us for additional information when

used in conditions other than those speciﬁed.

·Please measure the temperature of the terminals and

study every kind of solder and printed circuit board

for solderability before actual use.

Preheating

Main heating

Peak

60 s to 120 s

30 s to 40 s

max. 10 s

Above 200 °C

235 5 °C

For lead-free soldering (Example : Sn/Ag/Cu)

Peak

Temperature

150 °C to 180 °C

Above 230 °C

max. 260 °C

Time

Preheating

Main heating

Peak

60 s to 120 s

30 s to 40 s

max. 10 s

Heating

Time

● Flow Soldering

We do not recommend flow soldering to the Chip 3-Terminal Capacitor Array: EZASC, because solder

bridging may occur due to the narrow 0.8 mm pitch of EZASC. Please contact us regarding flow soldering

of EZANC type.

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,

Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.

1. Take measures against mechanical stress during and after mounting of Chip 3-Terminal Capacitor Array (hereafter

called the capacitor arrays) so as not to damage their electrodes and protective coatings.

Be careful not to misplace the capacitor arrays on the land patterns. Otherwise, solder bridging may occur.

2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the capacitors arrays'

performance and/or reliability.

3. When soldering with a soldering iron, never touch the capacitor arrays' bodies with the tip of the soldering iron. When

using a soldering iron with a high temperature tip, ﬁnish soldering as quickly as possible (within three seconds at 350

C max.).

4. As the amount of applied solder becomes larger, the mechanical stress applied to the capacitor arrays increases,

causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.

5. Do not apply shock to the capacitor arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the

capacitor arrays' protective coatings and bodies may be chipped, affecting their performance.

6. Avoid excessive bending of printed circuit boards in order to protect the capacitor arrays from abnormal stress.

7. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to

dielectric materials having a high dielectric constant.

Design and speciﬁcations are each subject to change without notice. Ask factory for the current technical speciﬁcations before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

Feb. 2006

Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])

• When using our products, no matter what sort of equipment they might be used for, be sure to make a written

agreement on the speciﬁcations with us in advance. The design and speciﬁcations in this catalog are subject

to change without prior notice.

• Do not use the products beyond the speciﬁcations described in this catalog.

• This catalog explains the quality and performance of the products as individual components. Before use, check

and evaluate their operations when installed in your products.

• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment

where a defect in these products may cause the loss of human life or other signiﬁcant damage, such as damage to

vehicles (automobile, train, vessel), trafﬁc lights, medical equipment, aerospace equipment, electric heating

appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.

Systems equipped with a protection circuit and a protection device

Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault

✽

(1) Precautions for use

• These products are designed and manufactured for general and standard use in general electronic equipment

(e.g. AV equipment, home electric appliances, ofﬁce equipment, information and communication equipment)

• These products are not intended for use in the following special conditions. Before using the products,

carefully check the effects on their quality and performance, and determine whether or not they can be used.

1. In liquid, such as water, oil, chemicals, or organic solvent

2. In direct sunlight, outdoors, or in dust

3. In salty air or air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO

4. Electric Static Discharge (ESD) Environment

These components are sensitive to static electricity and can be damaged under static shock (ESD).

Please take measures to avoid any of these environments.

Smaller components are more sensitive to ESD environment.

5. Electromagnetic Environment

Avoid any environment where strong electromagnetic waves exist.

6. In an environment where these products cause dew condensation

7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with

resin or other materials

• These products generate Joule heat when energized. Carefully position these products so that their heat will

not affect the other components.

• Carefully position these products so that their temperatures will not exceed the category temperature range due

to the effects of neighboring heat-generating components. Do not mount or place heat-generating components

or inﬂammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).

• Note that non-cleaning solder, halogen-based highly active ﬂux, or water-soluble ﬂux may deteriorate the

performance or reliability of the products.

• Carefully select a ﬂux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance

or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water

residues. Otherwise, the insulation performance may be deteriorated.

(2) Precautions for storage

The performance of these products, including the solderability, is guaranteed for a year from the date of arrival

at your company, provided that they remain packed as they were when delivered and stored at a temperature

of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the

date of arrival at your company)

The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on

the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %

to 60 %. Check the guarantee period in the speciﬁcations. The performance of Thermal Cutoffs is guaranteed for a

year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of

-10 °C to +40 °C and a relative humidity of 30 % to 75 %.

Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,

their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping

materials) may be deformed or deteriorated, resulting in mounting failures.

1. In salty air or in air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO

2. In direct sunlight

Package markings include the product number, quantity, and country of origin.

In principle, the country of origin should be indicated in English.

Feb. 2006

– EX2 –

EZASCE101M [PANASONIC]

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