EZASTB12AAJ [PANASONIC]
RC Network, RC Low Pass Filter, 0.063W, 22ohm, 25V, 0.000047uF, Surface Mount, 12 Pins, CHIP;
| 型号： | EZASTB12AAJ |
| 厂家： | 
PANASONIC |
| 描述： | RC Network, RC Low Pass Filter, 0.063W, 22ohm, 25V, 0.000047uF, Surface Mount, 12 Pins, CHIP LTE 电容器 电阻器网络 电容器网络 |
| 文件： | 总9页 (文件大小：242K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Chip RC Networks
Chip RC Networks
Type:
EZASTB/SSB
Type:
EZACT
EZADT
EZAST/SS
EZANT
GND
GND
GND
GND
■ Features
Smallest SMD R/C networks
● 4 popular noise reduction circuits made
EZACT
EZADT
EZAST/SS
: 2.0 mm ҂ 1.2 mm ҂ 0.6 mm, 0.5 mm pitch (Flat terminal type)
: 3.2 mm ҂ 1.6 mm ҂ 0.65 mm, 0.635 mm pitch (Concave terminal type)
: 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.8 mm pitch (Concave terminal type)
EZASTB/SSB : 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.65 mm pitch (Convex terminal type)
EZANT : 6.4 mm ҂ 3.1 mm ҂ 0.80 mm, 1.27 mm pitch (Concave terminal type)
● Takes up less space than discrete chip resistor & chip capacitor
EZACT:25 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area
EZADT:50 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area
EZAST/SS, EZASTB/SSB:70 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area
EZANT:55 % of 0805 inches (2.0 mm ҂ 1.2 mm) chips placing area
<Effect of high density placing, PWB space saving>
RC Low pass filter
AC Terminator
I/O
I/O
I/O
I/O
Chip RC Network
(EZACT, EZADT, EZAST/SS, EZANT)
I/O
I/O
Chip RC Network
(EZACT, EZADT, EZAST/SS, EZANT)
I/O
I/O
Discrete Chips
I/O
I/O
I/O
I/O
Discrete Chips
Chip RC Network
(EZASTB/SSB)
Chip RC Network
(EZASTB/SSB)
■ Recommended Applications
● Digital equipment such as PCs, printers, HDD, PCMCIA cards, PDAs, and word processors
● Communication equipment, digital cordless phones, automobile phones, GSM, PHS, DECT
● Digital audio and video equipment
● Electronic musical instruments, and other digital devices
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip RC Networks
■ Explanation of Part Numbers
EZACT (R/C Standard Combination)
●
1
2
3
4
5
6
7
8
9
10
11
12
E
Z
A
C
T
3
0
A
A
A
J
R/C Standard Combination
Design
Resistance Suffix for Special
Common Code
Dimension and
Configuration
Tolerance
Requirement
Circuit Configuration
2.0 mm
҂1.2 mm
Chip RC
Networks
Resistance Value
Configuration
Capacitance Value
Configuration
Thick Film Noise
Suppression and
Filtering
AAA
Standard
J
5 %
CT
10 ȑ
22 ȑ
47 ȑ
100 ȑ
220 ȑ
470 ȑ
1 k ȑ
0
10 pF
22 pF
0
1
2
3
4
5
6
Components
1
•
•
EZADT EZAST EZANT (R/C Standard Combination)
●
1
2
3
4
5
6
7
8
9
10
11
12
E
Z
A
S
T
3
3
A
A
A
J
R/C Standard Combination
Design
Resistance Suffix for Special
Common Code
Dimension and
Configuration
Tolerance
Requirement
Circuit Configuration
3.2 mm
҂1.6 mm
4.0 mm
҂2.1 mm
6.4 mm
Thick Film Noise
Suppression and
Filtering
Resistance Value
Configuration
Capacitance Value
Configuration ✽
AAA
Standard
J
5 %
DT
ST
Chip RC
Networks
1
2
3
4
5
6
22 ȑ
47 ȑ
100 ȑ
220 ȑ
470 ȑ
1 k ȑ
1
22 pF
47 pF
100 pF
220 pF
470 pF
1000 pF
Components
2
3
4
5
6
NT
҂3.1 mm
✽ 220 pF to 1000 pF available for EZANT, 22 pF to 100 pF available for EZAST, EZADT
•
•
•
EZACT EZADT EZASS EZANT (R/C Except the standard Combination)
●
1
2
3
4
5
6
7
8
9
10
11
12
E
Z
A
S
S
7
0
1
Y
A
J
Design Number
Resistance Suffix for Special
Common Code
Dimension and
Tolerance
Requirement
Circuit Configuration
Resistance Value : 10 ȑ to 100 kȑ
2. 0 mm
҂1.2 mm
3.2 mm
҂1.6 mm
4.0 mm
҂2.1 mm
6.4 mm
҂3.1 mm
Thick Film Noise
Suppression and
Filtering
J
5 %
CT
DT
SS
NT
Capacitance Value : 10 pF to 33 pF
CT
In above-mentioned range, it is possible to
choose optional R/C.
Resistance Value : 10 ȑ to 100 kȑ
Capacitance Value : 10 pF to 100 pF
In above-mentioned range, it is possible to
choose optional R/C.
Chip RC
Networks
Components
DT
SS
NT
Resistance Value : 10 ȑ to 100 kȑ
Capacitance Value : 10 pF to 180 pF
In above-mentioned range, it is possible to
choose optional R/C.
Resistance Value : 10 ȑ to 100 kȑ
Capacitance Value : 220 pF to 1000 pF
In above-mentioned range, it is possible to
choose optional R/C.
EZASTB (R/C Standard Combination)
●
1
2
3
4
5
6
7
8
9
10
11
12
E
Z
A
S
T
B
3
3
A
A
J
R/C Standard Combination
Design
Resistance Suffix for Special
Common Code
Dimension and
Configuration
AA
Tolerance
Requirement
Circuit Configuration
Thick Film Noise
Suppression and
Filtering
Convex
Resistance Value
Capacitance Value
Configuration
Standard
J
5 %
Configuration
terminal type
Chip RC
Networks
4.0 mm
҂2.1 mm
STB
1
2
3
4
5
6
22 ȑ
47 ȑ
100 ȑ
220 ȑ
470 ȑ
1 k ȑ
1
2
3
22 pF
47 pF
Components
100 pF
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip RC Networks
■ Explanation of Part Numbers
● EZASSB (R/C Except the standard Combination)
1
2
3
4
5
6
7
8
9
10
11
12
E
Z
A
S
S
B
7
0
1
A
J
Design Number
Resistance Suffix for Special
Common Code
Dimension and
Tolerance
Requirement
Circuit Configuration
Resistance Value : 10 ȑ to 100 kȑ
Capacitance Value : 10 pF to 180 pF
In above-mentioned range, it is possible to
choose optional R/C.
Thick Film Noise
Suppression and
Filtering
Convex
terminal type
Chip RC
J
5 %
4.0 mm
҂2.1 mm
SSB
Components
Networks
■ Construction
EZACT
EZADT
EZAST/SS
Alumina substrate Marking
Alumina substrate Marking
Marking
Protective coating
Alumina substrate
GND
GND
Electrode
(Outer)
Electrode
(Outer)
33
GND
Electrode
(Outer)
GND
Electrode
(Outer)
GND
Electrode
(Outer)
Electrode
(Outer)
Protective coating
Electrode
(Outer)
Protective coating Electrode
(Outer)
EZANT
EZASTB/SSB
Marking
Alumina substrate
Alumina substrate
Marking
GND
Electrode
(Outer)
GND
Electrode
(Outer)
GND
Electrode
(Outer)
33
GND
Electrode
(Outer)
Protective coating Electrode
(Outer)
Protective coating Electrode
(Outer)
■ Circuit Configuration
•
•
EZACT
EZADT EZAST/SS EZANT
EZASTB/SSB
12
11 10
9
8
7
6
10
R1
9
8
7
10
R1
9
8
7
R1 R2 R3 R4
R2
R3
R4
R2
R3
R4
GND
6 GND
1
6 GND
GND
1
C4
C2
C1
C2
C3
C4
C1
C3
C1
C2
C3
C4
2
3
4
5
2
3
4
5
1
2
3
4
5
GND
R1=R2=R3=R4
C1=C2=C3=C4
GND
R1=R2=R3=R4
C1=C2=C3=C4
R1=R2=R3=R4
C1=C2=C3=C4
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip RC Networks
■ Dimensions in mm(not to scale)
EZACT
EZADT
0.33 0.10
10
9
8
7
10
9
8
7
1
6
1
6
2
3
4
5
(0.635)
2
3
4
5
0.65+–
0.20
(0.5)
3.20 0.15
0.10
2.0 0.1
0.55 0.10
0.35 0.15
0.35 0.10
0.30 0.15
0.20 0.15
Size : 0805 inches
Size : 1206 inches
(
(
(
) Reference
Mass (Weight) [1000 pcs.] :4 g
(
) Reference
Mass (Weight) [1000 pcs.] :11 g
EZAST/SS
EZANT
0.5 0.2
10
9
8
7
10
9
8
7
1
6
1
6
33
2
3
4
5
(1.27)
0.65 0.20
2
3
4
5
(0.8)
0.80+–
0.20
6.4 0.2
0.10
0.65+–
0.20
0.10
4.0 0.2
0.45 0.20
0.75 0.20
0.4 0.2
0.5 0.2
Size : 1608 inches
Mass (Weight) [1000 pcs.] :17 g
Size : 2512 inches
Mass (Weight) [1000 pcs.] :55 g
) Reference
(
) Reference
EZASTB/SSB
0.58 0.2 0.4 0.2
0.25 0.15
10
9
8
7
11
12
33
1
2
3
4
5
6
(0.65)
0.65+–
4.0 0.2
0.20
0.10
0.2+–
0.275+–
0.2
0.1
0.200
0.100
Size : 1608 inches
Mass (Weight) [1000 pcs.] :18 g
) Reference
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Apr. 2007
Chip RC Networks
■ Ratings
Item
Specification
10 to 100 k
ȑ
ȑ
Resistance Values
Resistance Tolerance
EZAC Standard : 10 , 22 , 47 , 100 , 220 , 470 , 1 k
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
EZAD/S/N Standard : 22 , 47 , 100 , 220 , 470 , 1 k
ȑ
ȑ
5 %
Temperature Coefficient of Resistance (T.C.R.)
200 10–6/°C(ppm/°C)
҂
EZAC : 0.031 W( 70 °C(1))
<
Rated Power
EZAD/S/N : 0.063 W( 70 °C(1))
<
Limiting Element Voltage (Maximum Rated Continuous Working Voltage)
25 V(2)
EZAC : 10 pF to 33 pF
Standard : 10 pF, 22 pF
EZAD : 10 pF to 100 pF
Capacitance Values
EZAS : 10 pF to 180 pF
(25 °C, 1 kHz(3), 1 Vrms)
Standard : 22 pF, 47 pF, 100 pF
EZAN : 220 pF to 1000 pF
Standard : 220 pF, 470 pF, 1000 pF
Capacitance Tolerance
+30 %/–20 %
Capacitance Temperature Characteristics
Dissipation Factor
E Characteristic: +20 %/–55 %(–25 to +85 °C)
Less than 3 %(25, 1 kHz(3), 1 Vrms)
EZAC, EZAD : 12 V
EZAS : 25 V
Rated Voltage
EZAN : 50 V
Category Temperature Range (Operating Temperature Range)
–25 °C to +85 °C
(1) For resistors operated in ambient temperature above 70 °C, rated power shall be derated. (“Power Derating Curve” is shown below)
(2) Rated Voltage for resistor shall be determined from ǰRated Power҂Resistance Value, or Limiting Element Voltage (Max. Rated Continuous Working
Voltage) whichever less.
70 °C
(3) In measuring at 1 MHz, Capacitance and Dissipation Factor are different.
100
80
60
40
20
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the figure on the right.
85 °C
030
20 10
0
10 20 30 40 50 60 70 80 90
Ambient Temperature (°C)
■ Attenuation Characteristics
EZACT
EZADT
●
●
10
0
0
10
–10
–20
20
30
40
50
–30
–40
–50
1M
10M
100M
1G
3G
1M
10M
100M
1G
3G
Frequency (Hz)
Frequency (Hz)
•
EZST EZASTB
EZANT
●
●
0
10
20
30
40
50
60
70
80
0
10
20
30
40
50
1 M
10 M
100 M
Frequency (Hz)
1 G
3 G
1M
10M
100M
Frequency (Hz)
1G
EZACT
EZADT
EZAST
EZASTB
EZANT
Measurement Circuit
50 ȑ
~
50 ȑ
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip RC Networks
■ Packaging Methods (Taping)
● Standard Quantity
Type
Kind of Taping
Pitch (P1)
4 mm
Quantity
EZACT
EZADT
EZAST/SS
EZASTB/SSB
EZANT
Punched Carrier Taping
5000 pcs./reel
Embossed Carrier Taping
4000 pcs./reel
● Carrier Tape
(Unit : mm)
P1
P2
P0
fD0
T
A
T
fD1 (Only Emboss)
f
f
D1
Type
EZACT
EZADT
EZAST/SS
EZASTB/SSB
EZANT
A
1.55
2.00
B
2.30
3.60
W
F
E
P1
P2
P0
D0
T
0.15
0.20
0.20
0.20
0.20
0.30
0.05
0.20
0.10
0.20
0.05
8.00
3.50
1.75
0.85
—
0.10
0.05
0.10
+0.10
1.50
−0
4.00
2.00
4.00
0.20
0.20
0.20
0.20
0.20
0.20
2.50
3.50
4.40
6.80
1.15
1.30
+0.10
12.00
5.50
1.75
1.50
−0
● Taping Reel
(Unit : mm)
T
f
f
f
C
Type
A
B
W
EZACT
EZADT
1.0
2.0
T
9.0
11.4
+0
1.0
EZAST/SS
180.0
60 min. 13.0
–3.0
1.0
2.0
EZASTB/SSB
EZANT
13.0
15.4
f C
f A
W
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Apr. 2007
Chip RC Networks
■ Recommended Land Pattern Design
EZACT
●
b g
P
Land pattern
a
b
c
d
Dimensions
0.75
0.25
1.70
0.35
(mm)
c
h
e
h
g
P
Dimensions
(mm)
1.85
2.60
0.25
0.50
b
P
EZADT
●
Land pattern
a
b
c
d
Dimensions
(mm)
0.9 to 1.1 0.2 to 0.3 2.6 to 2.8 0.3 to 0.4
f
g
P
Dimensions
(mm)
2.0 to 2.6 3.6 to 4.2
0.635
c
g
EZAST/SS
Solder resistant
●
f2
c
Land pattern
a
b
c
d
Dimensions
1.2 to 1.4
0.4
3.1 to 3.3 0.4 to 0.5
(mm)
GND
e
f1
f2
P
Dimensions
(mm)
0.8
2.9 to 3.3 4.8 to 5.2
0.8
b
P
EZASTB/SSB
●
f2
Land pattern
a
b
c
d
Dimensions
(mm)
1.4 to 1.6
0.35
0.45
0.3
GND
f1
f2
P
Dimensions
(mm)
2.7 to 3.5
3.8
0.65
c
d
b
P
P
EZANT
●
b
Land pattern
a
b
c
d
Dimensions
(mm)
2.3 to 2.5 0.4 to 0.6 5.6 to 5.8 0.4 to 0.8
f
g
P
Dimensions
(mm)
4.3 to 4.7 7.6 to 8.0
1.27
c
g
• Design to make GND pattern as large as possible, because high
frequency noise is removed from GND terminals of chip RC network.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
May. 2006
Chip RC Networks
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
Recommended soldering conditions for reflow
●
·Reflow soldering shall be performed a maximum of
two times.
·Please contact us for additional information when
used in conditions other than those specified.
·Please measure the temperature of the terminals and
study every kind of solder and printed circuit board
for solderability before actual use.
For soldering (Example : Sn/Pb)
Temperature
140 °C to 160 °C
Above 200 °C
235 5 °C
Time
Preheating
Main heating
Peak
60 s to120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Peak
Temperature
150 °C to 180 °C
Above 230 °C
max. 260 °C
Time
Preheating
Main heating
Peak
60 s to 120 s
30 s to 40 s
max. 10 s
Preheating
Heating
This product has circuits on both sides. Therefore, do not use
adhesives because they may impair the products characteristics.
Time
Flow Soldering
●
We do not recommend flow soldering to the product, because solder bridging may occur due to the
narrow pitch of the terminals and the characteristics of the product may be badly affected when using
adhesive to affix it to a circuit board.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip RC Networks (hereafter called the RC networks)
so as not to damage their electrodes and protective coatings.
Be careful not to misplace the RC networks on the land patterns. Otherwise, solder bridging may occur.
2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the RC networks' performance
and/or reliability.
3. Perform sufficient preheating so that the difference of the solder temperature and the RC networks chip surface
°
°
temperature becomes 100 C or less. Maintain the temperature difference within 100 C during rapid cooling by
immersion into solvent after soldering.
4. When soldering with a soldering iron, never touch the RC networks' bodies with the tip of the soldering iron. When
using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at
°
350 C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the RC networks increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the RC networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the RC networks'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the RC networks from abnormal stress.
8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to
dielectric materials having a high dielectric constant.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
✽
✽
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO
4. Electric Static Discharge (ESD) Environment
2
2
3
2
2
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
2
2
3
2
2
1. In salty air or in air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Feb. 2006
– EX2 –
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