J3303 [PANASONIC]

Silicon P-channel MOS FET;
J3303
型号: J3303
厂家: PANASONIC    PANASONIC
描述:

Silicon P-channel MOS FET

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中文:  中文翻译
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This product complies with the RoHS Directive (EU 2002/95/EC).  
FJ330301  
Silicon P-channel MOS FET  
For switching circuits  
Overview  
Package  
FJ330301 is P-channel small signal MOS FET employed small size surface  
mounting package.  
Code  
SSSMini3-F2-B  
Pin Name  
1: Gate  
Features  
Low drain-source ON resistance: RDS(on) typ. = 4 W (VGS = -4.0 V)  
High-speed switching  
2: Source  
3: Drain  
Small size surface mounting package: SSSMini3-F2-B  
Contributes to miniaturization of sets, reduction of component count.  
Eco-friendly Halogen-free package  
Marking Symbol: U1  
Internal Connection  
Packaging  
(D)  
3
Embossed type (Thermo-compression sealing): 10000 pcs / reel (standard)  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Drain-source surrender voltage  
Gate-source surrender voltage  
Drain current  
Symbol  
VDSS  
VGSS  
ID  
Rating  
-30  
Unit  
V
1
2
V
±12  
(G)  
(S)  
mA  
mA  
mW  
°C  
-100  
Peak drain current  
IDP  
-200  
Power dissipation  
PD  
100  
Channel temperature  
Storage temperature  
T
ch  
150  
T
stg  
–55 to +150  
°C  
Publication date: January 2011  
Ver. CED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
FJ330301  
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Drain-source surrender voltage  
Drain-source cutoff current  
Gate-source cutoff current  
Gate threshold voltage  
Symbol  
Conditions  
ID = -1 mA, VGS = 0  
Min  
Typ  
Max  
Unit  
V
VDSS  
IDSS  
IGSS  
VTH  
-30  
VDS = -30 V, VGS = 0  
VGS = ±10 V, VDS = 0  
-1.0  
±10  
mA  
mA  
ID = -1.0 mA, VDS = -3.0 V  
ID = -10 mA, VGS = -2.5 V  
ID = -10 mA, VGS = -4.0 V  
ID = -10 mA, VDS = -3 V  
V
W
- 0.5  
- 1.0  
7
-1.5  
17  
7
Drain-source ON resistance  
RDS(on)  
4
W
Forward transfer admittance  
20  
40  
mS  
Yfs  
Ciss  
Short-circuit input capacitance (Common source)  
Short-circuit output capacitance (Common source)  
Reverse transfer capacitance (Common source)  
12  
7
pF  
pF  
pF  
Coss  
Crss  
VDS = -3 V, VGS = 0, f = 1 MHz  
3
VDD = -3 V, VGS = 0 V to -3 V,  
ID = -10 mA  
Turn-on time *  
Turn-off time *  
ton  
100  
100  
ns  
ns  
VDD = -3 V, VGS = -3 V to 0 V,  
ID = -10 mA  
toff  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Test circuit  
*
V
DD = −3 V  
10%  
I
D = −10 mA  
VIN  
R
L = 300 Ω  
90%  
VOUT  
D
V
GS = 0 V to 3 V  
90%  
G
VIN  
VOUT  
10%  
50 Ω  
S
td(on) tr  
td(off) tf  
Ver. CED  
2
This product complies with the RoHS Directive (EU 2002/95/EC).  
FJ330301  
ID VDS  
ID VGS  
RDS(on) VGS  
103  
102  
10  
−100  
−80  
−60  
−40  
−20  
0
Ta = 25°C  
ID = 0.01 A  
Ta = 25°C  
VGS = 4.5 V  
VDS = 3 V  
2.5 V  
102  
10  
1
Ta = 85°C  
1  
25°C  
101  
30°C  
102  
103  
1.5 V  
0
0.1 0.2 0.3 0.4 0.5  
0
0
0.5  
1.0  
1.5  
−2.0  
2  
4  
6  
8  
10  
Drain-source voltage VDS (V)  
Gate-source voltage VGS (V)  
Gate-source voltage VGS (V)  
RDS(on) ID  
PD T  
Safe operation area  
a
102  
10  
120  
100  
80  
103  
102  
10  
1  
Ta = 25°C  
Ta = 25°C  
Glass epoxy board  
(25.4 mm× 25.4 mm × t0.8 mm) coated with  
copper foil, which has more than 300 mm2.  
IDP = 0.2 A  
Limited by  
10 ms  
RDS(on) = 7 (max)  
(VGS = −4.0 V)  
VGS = 2.5 V  
4.0 V  
1 s  
100 ms  
60  
DC  
1
40  
20  
0
101  
101  
1  
10  
102  
0
102  
101  
1  
10  
102  
40  
80  
120  
160  
Drain-source voltage VDS (V)  
Ambient temperature Ta (°C)  
Drain current ID (mA)  
Ciss , Crss , Coss VDS  
Yfs  ID  
1
25  
Ta = 25°C  
Ta = 25°C  
VDS = 3 V  
20  
15  
10  
5
101  
102  
103  
Ciss  
Coss  
Crss  
0
0
101  
1  
10  
102  
5  
10  
15  
20  
Drain current ID (mA)  
(
)
Drain-source voltage VDS  
V
Ver. CED  
3
This product complies with the RoHS Directive (EU 2002/95/EC).  
FJ330301  
SSSMini3-F2-B  
Unit: mm  
1.20 ±0.05  
0.30 +00..0025  
3
2
1
0.13 +00..0025  
0.20 +00..0025  
(0.4)  
(0.4)  
0.80 ±0.05  
(5°)  
Ver. CED  
4
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications  
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,  
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of  
the products may directly jeopardize life or harm the human body.  
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with  
your using the products described in this book for any special application, unless our company agrees to your using the products in  
this book for any special application.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.  
20100202  

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