LNJ052X8ARA [PANASONIC]
Single Color LED, White, 1.3mm, ROHS COMPLIANT PACKAGE-2;型号: | LNJ052X8ARA |
厂家: | PANASONIC |
描述: | Single Color LED, White, 1.3mm, ROHS COMPLIANT PACKAGE-2 光电 |
文件: | 总3页 (文件大小:296K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
This product complies with the RoHS Directive (EU 2002/95/EC).
Light Emitting Diodes
LNJ052X8ARA
Hight Bright Surface Mounting Chip LED
SV (Side View) -0.4 Type
ꢀAbsolute Maximum Ratings T = 25°C
a
ꢀLighting Color
ꢀWhite
Parameter
Power dissipation
Symbol
PD
Rating
Unit
mW
m
mA
V
70
Forward current
IF
20
70
Pulse forward current *
Reverse voltage
IFP
VR
5
Operating ambient temperature
Storage temperature
Topr
–30 o +85
–40 to 100
°C
T
stg
°C
Note) : The condition of IFP is duty 10%, Pulse width 1 mec.
*
ꢀElectro-Optical Characteristics T = 25°C±3°C
a
Parameter
Luminous intensity *
Smbol
Conditions
Min
Typ
Max
470
Unit
mcd
µA
V
IO
IR
VF
x
IF = 10 mA
VR = V
200
280
Reverse current
Forward voltage
10
IF = 0 mA
= 10 mA
IF = 10 mA
2.7
3.0
3.7
0.260
0.208
0.320
0.357
Chromaticity coordinates
Note) : asurement ce: ±20%
*
I
O IF
IF VF
Relative luminous intensity Ta
10
100
100
3
500
300
50
30
10
1
100
0.5
0.3
50
30
5
3
0.1
10
1
1
3
5
10
30 50
100
1.0
2.0
3.0
4.0
5.0
−20
0
20
40
60
80
100
Forward current IF (mA)
Forward voltage VF (V)
Ambient temperature Ta (°C)
IF Ta
25
20
15
10
5
Y
Directive characteristics
0°
10°
10°
20°
20°
X
30°
30°
40°
40°
80°
60°
40°
20°
X
Y
50°
50°
60°
60°
70°
80°
90°
70°
80°
90°
0
20
−20
0
20
40
60
80
100
100 80
60
40
0
20
40
60
80 100
Ambient temperature Ta (°C)
Relative luminous intensity (%)
Publication date: January 2009
SHD00717BEK
1
This product complies with the RoHS Directive (EU 2002/95/EC).
LNJ052X8ARA
ꢀPackage (Unit: mm)
KLTFSN2K5200
ꢀPin name
1:Ande
2: Cathode
SHD00717BEK
2
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability requied, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subjet to change wit notice for modification and/or im-
provement. At the final stage of your design, purchasingr use of the roducts, therfor the most up-to-date Product
Standards in advance to make sure that the latest specifictions stisfy your requirements.
(5) When designing your equipment, comply with he ange f absolute maximing nd the guaranteed operating conditions
(operating power supply voltage and operating nvirent etc.). Especiall, plee be ceful not to exceed the range of absolute
maximum rating on the transient state, such as powpower-off and modeswitching. Otherwise, we will not be liable for any
defect which may arise later in your equpmen
Even when the products are used withthe guaanteed values, kinto he cosideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the sytems such as redundant design, arresting the spread of fire
or preventing glitch are recommin ordto prevent physicinjury, fre, social damaes, for example, by using the products.
(6) Comply with the instructios for se in rder to prevent breakdwn and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanicastress) at the time of andlig, mounting or at customer's process. When using products for which
damp-proof packinis reqired, stisfy the condtions, sch as shelf life and the elapsed time since first opening the packages.
(7) This book may e not eprinted or reprodhethr wholly or partially, without the prior written permission of our company.
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