MAZN039 [PANASONIC]
Zener Diode, 3.9V V(Z), 5.13%, 0.15W, Silicon, Unidirectional, SS-MINI PACKAGE-2;型号: | MAZN039 |
厂家: | PANASONIC |
描述: | Zener Diode, 3.9V V(Z), 5.13%, 0.15W, Silicon, Unidirectional, SS-MINI PACKAGE-2 测试 光电二极管 |
文件: | 总3页 (文件大小:152K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Zener Diodes
Series
MAZN000
Silicon planer type
Surge absorption circuit
■ Features
Unit : mm
0.80±0.05
0.80
●
SS-Mini type package (2-pin)
2
1
●
No rank classification (VZ= 3.3 to 12V)
0.60
0.60
0.12+–0.053
■ Absolute Maximum Ratings (Ta= 25˚C
Unit
mA
m
mW
˚C
Parameter
Average forward current
Instanious forward current
Total power dissipation
Junction temperature
Symb
)
FRM
Rating
100
1 : Anode
2 : Cathode
SS-Mini Type Package (2-pin)
1.60±0.05
20
P
Tj
*
150
■ Internal Connection
150
˚C
Storage temperature
Tstg
– 5to + 150
* With a printed-circuit bard
2
1
1
*
■ Common Electrical Chaacteristics (Ta= 25˚C)
Pa
Symbol
Condition
min
typ
0.9
max
1.0
Unit
V
Forward v
VF
IF= 10mA
Zener voltag
VZ * 2
RZ
IZ .............. Specified value
IZ .............. Specified value
VR............. Specified value
VR............. Specified value
V
Operating resist
Reverse current
Ω
Refer to the electrical characteristics
list of P487
IR
µA
pF
Terminal capacitance
Ct
Note 1. Test method : Depend on JIS C7031 testing
2. Rated input/output frequency : 5MHz
3. * 1 : The VZ value is for the temperature of 25˚C. In other cases, carry out the temperature compensation.
*
2 : Guaranteeed at 20ms after power application
■Marking (Example)
B1
MAZN033
Zener Diodes
MAZN000 Series
■ Electrical Characteristics (Ta= 25˚C)
Operating resis-
Terminal
capacitance
Ct (pF)
(VR= 0V)
f=1MHz
typ
Zener voltage
Reverse current
IR
tance
RZ
Part Number
VZ
Marking
min
(V)
nom
(V)
max
(V)
IZ
(mA)
max
(µA)
20
10
10
VR
(V)
1.0
1.0
1.0
1.0
1.0
2.0
2.5
4.0
4.0
5.0
5.0
6.0
7.0
8.0
9.0
max
(Ω)
130
130
130
130
80
60
40
30
20
20
20
20
30
30
30
IZ
(mA)
MAZN033
MAZN036
MAZN039
MAZN043
MAZN047
MAZN051
MAZN056
MAZN062
MAZN068
MAZN075
MAZN082
MAZN091
MAZN100
MAZN110
MAZN120
3.10
3.40
3.70
4.00
4.40
4.80
5.30
5.80
6.40
7.00
7.70
8.50
9.40
10.40
11.40
3.30
3.60
3.90
4.30
4.70
5.10
5.60
6.20
6.80
7.50
8.20
9.10
10.00
11.00
12.00
3.50
3.80
4.10
4.60
5.00
5.40
6.00
6.60
7.20
7.90
8.70
9.60
10.60
11.60
12.70
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
100
100
60
60
50
40
30
25
25
20
18
18
18
16
16
B1
B2
B3
C1
C2
D1
D2
E1
E2
F
G
H
10
11
12
10
2.0
1.0
0.5
0.2
0.1
0.1
0.1
0.1
0.05
0.05
0.05
Ptot – Ta
With a printed
-circuit board
300
0.6mm
0.6mm
Cu foil
t=0.035 mm
250
200
150
100
50
0
0
50
100 150 200 250 300
(
)
Ambient temperature Ta ˚C
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
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Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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Electric Industrial Co., Ltd.
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