MIPSZ2012D1R0_技术文档

AN30180A

VIN = 2.5V to 5.5V

1.2A Synchronous DC-DC Step Down Regulator

FEATURES

DESCRIPTION

AN30180A is a synchronous DC-DC Step Down

Regulator and employs the hysteretic control system.

By this system, when load current charges suddenly, it

responds at high speed and minimizes the changes of

output voltage.

Since it is possible to use capacitors with small

capacitance and it is unnecessary to add external parts

for system phase compensation, this IC realizes

downsizing of set and reducing in the number of external

parts.

z

Wide output voltage range : 1.15V to 2.80V

Input voltage range : 2.5V to 5.5V

Up to 1200mA Output Current

Load transient response is fast

Output current limit control of 1.8A to prevent

Excessive current flows

High efficiency over a wide load current area by

DCM (discontinuous conductive mode) operation

at light loads, CCM (continuous conductive mode)

operation in heavy loads those two modes can be

automatically switched

z

Switching frequency of 2.6MHz during CCM.

100% duty operation when input voltage goes

down to output voltage.

9 pin Wafer level chip size package (WLCSP Type)

Size : 1.46 × 1.46 mm ( 0.5 mm pitch)

APPLICATIONS

High Current Distributed Power Systems such as

power amplifier in cellular phone etc.

z

SIMPLIFIED APPLICATION

EFFICIENCY CURVE

100

90

80

70

60

50

CNT1

CNT2

VIN

PVIN

AVIN

FB

LX

40

VIN=2.50V

1.0 μH

30

VIN=3.70V

VOUT

4.7 μF x 2

VIN=5.50V

20

AN30180A

4.7 μF

10

0

EN

1

10

100

1000

AGND

PGND

Load Current[mA]

Condition : V_IN=2.5V , 3.7V , 5.5V, Vout=1.15V , Cout=4.7μF , Lout=1.0μH

Notes) This application circuit is an example. The operation

of mass production set is not guaranteed. You should

perform enough evaluation and verification on the

design of mass production set. You are fully

responsible for the incorporation of the above

application circuit and information in the design of

your equipment.

Ver. AEB

Publication date: October 2012

1

AN30180A

ABSOLUTE MAXIMUM RATINGS

Parameter

Supply voltage

Symbol

Rating

6.0

Unit

V

Notes

*1

*3

V_IN

Operating free-air temperature

Operating junction temperature

Storage temperature

T_opr

T_j

– 30 to + 85

– 40 to + 150

– 55 to + 150

°C

*2

T_stg

*1

*3

Input Voltage Range

FB,EN,CTL1,CTL2

– 0.3 to (V_IN+ 0.3)

V

*1

*3

Output Voltage Range

ESD

LX

– 0.3 to (V_IN+ 0.3)

2

V

HBM (Human Body Model)

kV

-

Notes) Do not apply external currents and voltages to any pin not specifically mentioned.

This product may sustain permanent damage if subjected to conditions higher than the above stated absolute maximum rating.

This rating is the maximum rating and device operating at this range is not guaranteeable as it is higher than our stated

recommended operating range. When subjected under the absolute maximum rating for a long time, the reliability of the product

may be affected.

*1:The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.

*2:Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C.

*3:V_INis voltage for AVIN, PVIN. AVIN = PVIN,(V_IN+ 0.3) V must not be exceeded 6 V.

POWER DISSIPATION RATING

PACKAGE

θ_JA

PD(Ta=25°C)

PD(Ta=85°C)

Notes

*1

9pin Wafer level chip size package

(WLCSP Type)

436 °C /W

0.286 W

0.148 W

Note). For the actual usage, please refer to the PD-Ta characteristics diagram in the package specification, follow the power supply

voltage, load and ambient temperature conditions to ensure that there is enough margin and the thermal design does not

exceed the allowable value.

*1:Glass Epoxy Substrate(4 Layers) [Glass-Epoxy: 50 X 50 X 0.8t(mm)]

Die Pad Exposed , Soldered.

CAUTION

Although this has limited built-in ESD protection circuit, but permanent damage may occur on it.

Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS gates

Ver. AEB

2

AN30180A

RECOMMENDED OPERATING CONDITIONS

Parameter

Supply voltage range

Symbol

V_IN

Min.

2.5

Typ.

3.7

Max.

5.5

Unit

V

Notes

*1

*2

FB

EN

– 0.3

—

V_IN+ 0.3

V

*3

Input Voltage Range

Output Voltage Range

CNT1

CNT2

LX

Note) Do not apply external currents and voltages to any pin not specifically mentioned.

Voltage values, unless otherwise specified, are with respect to GND. GND is voltage for AGND, PGND. AGND = PGND

Vin is voltage for AVIN, PVIN. AVIN = PVIN

*1 : Please set the rising time of power input pin to the following range.

In addition, please input the voltage with the rising time which has margin enough in consideration of the variation

in external parts.

*2 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation.

*3 : (V_IN+ 0.3) V must not be exceeded 6 V.

0 V

100 μs < Tr < 1.5 ms

(Tr is the rise time from 0 V to the setup voltage of V_IN.)

Ver. AEB

3

AN30180A

ELECTRICAL CHARACTERISTICS

Cout = 4.7 μF (Murata), Lout = 1.0 μH (FDK) , VOUT Setting = 1.15 V , V_IN= AV_IN= PV_IN= 3.7 V,

T_a= 25 °C 2 °C unless otherwise noted.

Limits

Typ

Notes

Parameter

Symbol

Conditions

Unit

Min

Max

[Current Consumption] (DCDC step down regulator)

Current Consumption

IINQ

IOUT = 0A,VOUT = 1.15 V,

—

40

0

80

1

μA

—

OFF Current Consumption

ISTB EN = L

[DCDC Characteristics] (DCDC step down regulator)

CNT1 = L , CNT2 = L

IOUT = 600 mA

Output Voltage Setting 1

Output Voltage Setting 2

Output Voltage Setting 3

Output Voltage Setting 4

VOUT1

VOUT2

VOUT3

VOUT4

1.115 1.150 1.185

1.260 1.300 1.340

1.745 1.800 1.855

2.715 2.800 2.885

V

—

CNT1 = H , CNT2 = L

IOUT = 600 mA

CNT1 = L , CNT2 = H

IOUT = 600 mA

CNT1 = H , CNT2 = H

IOUT = 600 mA

VIN = 2.5 V to 5.5 V,

REGIN VOUT = 1.15 V

IOUT = 600m A

% / V

Line Regulation

Load Regulation

—

0.25

3.3

0.75

5.8

—

VOUT = 1.15 V,

REGLD

%

IOUT = 10 μA to 1200 mA

Pch-MOS ON Resistance

Nch-MOS ON Resistance

SW Frequency

RONP

—

0.2

2.6

0.4

3.2

Ω

—

RONN

Ω

MHz

FSW IOUT = 600 mA ( CCM )

2.0

Load resistance = 12 Ω

Settling time to reach 90 % of

TSTU

Rising Time

—

120

20

μs

—

setting voltage from EN rising

edge

Output discharge resistance

RDIS EN = L

10

Ω

Ver. AEB

4

AN30180A

ELECRTRICAL CHARACTERISTICS (Continued)

Cout = 4.7 μF (Murata), Lout = 1.0 μH (FDK) , VOUT Setting = 1.15V , V_IN= AV_IN= PV_IN= 3.7 V,

T_a= 25 °C 2 °C unless otherwise noted.

Limits

Typ

Notes

Parameter

Symbol

Conditions

Unit

Min

Max

[Logic Pin Characteristics] (DCDC step down regulator)

EN Control Voltage L

EN Control Voltage H

EN Leak Current

VENTL

VENTH

—

0

0.3

—

1

V

—

1.5

– 1

IENL VIN = VEN = 5.5 V

μA

VCNT1

L

CNT1 Control Voltage L

—

0.3

V

—

VCNT1

H

VIN –

0.3

CNT1 Control Voltage H

CNT1 Leak Current

—

0

—

1

V

μA

V

—

ICNT1L VIN = VCNT1 = 5.5 V

– 1

—

VCNT2

L

CNT2 Control Voltage L

—

0.3

VCNT2

H

VIN –

0.3

CNT2 Control Voltage H

CNT2 Leak Current

—

0

—

1

V

—

ICNT2L VIN = VCNT2 = 5.5 V

– 1

μA

[Under Voltage Lock out] (DCDC step down regulator)

UVLO Detection Voltage

UVLO Hysteresis Voltage

VUON VIN rising to Start Operation

VUHY

2.3

25

2.4

75

2.5

V

—

125

mV

Ver. AEB

5

AN30180A

ELECRTRICAL CHARACTERISTICS (Continued)

Cout = 4.7 μF (Murata), Lout = 1.0 μH (FDK) , VOUT Setting = 1.15V , V_IN= AV_IN= PV_IN= 3.7 V,

T_a= 25 °C 2 °C unless otherwise noted.

Reference values

Notes

Parameter

Symbol

Conditions

Unit

Min

Typ

Max

[DCDC] (DCDC step down regulator)

at VOUT drops

*1

Output current limit

LX leak current

ILMT from 1.15 V to 1.035 V

CNT1 = L , CNT2 = L

—

1.8

0

—

A

VIN = 5.5 V,SHUTDOWN,

ILXL

μA

VLX = 0 V or 5.5 V

*1

Efficiency 1

EF1

VOUT = 1.3 V, IOUT = 200mA

—

82

5

—

%

mV[p-p]

Output ripple voltage 1

Output ripple voltage 2

VRPL1 VOUT = 1.15 V, IOUT=600mA

VRPL2 VOUT = 1.15 V, IOUT = 10 μA

C = 4.7 μF, VOUT = 1.15 V,

VLSU

VLSD

TLSU

mV[p-p]

20

Output voltage fluctuation during

load increase

*1

IOUT = 10 μA to 400 mA ,

Δ t = 1 μs

—

25

50

5

—

mV

C = 4.7 μF, VOUT = 1.15 V,

IOUT = 400 mA to 10 μA,

Δ t = 1 μs

Output voltage fluctuation during

load decrease

mV

VOUT = 1.15 V,

IOUT = 10 μA to 400 mA,

Δ t = 1 μs

Stabilization time when increased

load current

μs

*1 : Typical Value checked by design.

Ver. AEB

6

AN30180A

PIN CONFIGURATION

Top View

A2

A1

B1

C1

A3

B3

C3

B2

C2

PIN FUNCTION

Pin No.

A1

Pin name

AVIN

Type

Power supply

Input

Description

Power supply pin

Feed Back voltage pin

Ground pin

A2

FB

A3

AGND

PVIN

EN

Ground

Power supply

Input

B1

Power supply pin for internal Power MOS

ON / OFF Control pin

B2

B3

CNT2

LX

Input

Output voltage control 2 pin

LX Terminal Output

C1

Output

C2

PGND

CNT1

Ground

Input

Power Ground

C3

Output voltage control 1 pin

Notes) Concerning detail about pin description, please refer to OPERATION and APPLICATION INFORMATION section.

Ver. AEB

7

AN30180A

FUNCTIONAL BLOCK DIAGRAM

PVIN

B1

AVIN

A1

B2

ON/OFF

EN

ENC

BGR

1.24V

2.4V

UVLO

OSP

VREG

OCP

A2

C3

FB

C1

CNT1

DAC

LX

Control

Logic

Driver

B3

CNT2

Generator

Timer

A3

AGND

C2

PGND

Notes) This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified.

Ver. AEB

8

AN30180A

TYPICAL CHARACTERISTICS CURVES

(1) Output ripple voltage

VIN = 3.7 V, Vout = 1.15 V , Cout = 4.7 μF , Lout = 1.0 μH

Iout = 1200 mA

Iout = 600 mA

LX

Vout

(2) Load transient response

VIN = 3.7 V ,Vout = 1.15 V , Cout = 4.7 μF , Lout = 1.0 μH

Iout = 10 μA to 400 mA, Δ t = 1 μsec

Iout = 400 mA to 10 μA, Δ t = 1 μsec

LX

Vout

Iout

Ver. AEB

9

AN30180A

TYPICAL CHARACTERISTICS CURVES (Continued)

(3) Efficiency

VIN = 2.5 V or 3.7 V or 5.5 V , Vout = 1.15 V , Cout = 4.7 μF , Lout = 1.0 μH

100

90

80

70

60

50

40

30

20

10

0

VIN=2.50V

VIN=3.70V

VIN=5.50V

1

10

100

1000

Load Current[mA]

(4) Load regulation

VIN = 2.5 V or 3.7 V or 5.5 V , Vout = 1.15 V , Cout = 4.7 μF , Lout = 1.0 μH

1.4

1.35

1.3

VIN=2.50V

VIN=3.70V

VIN=5.50V

1.25

1.2

1.15

1.1

1.05

1

0

200

400

600

800

1000

1200

Load Current [mA]

Ver. AEB

10

AN30180A

OPERATION

1. Pin Setting

Pin Voltage

Pin No.

Description

ON/OFF Control For DC-DC

Remarks

Low

OFF

High

ON

B2

Pin No.

C3

CNT1

Low

B3

CNT2

Low

Output Voltage

Pin name

1.15 V

1.30 V

1.80 V

2.80 V

High

Low

Pin Voltage (*1)

High

Ver. AEB

11

AN30180A

OPERATION (Continued)

Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed.

1. Power ON / OFF sequence

2. Protection

Output Over-Current Protection (OCP) function and

Short-Circuit Protection (OSP) function

V_IN

(1) The Over-Current Protection is activated at about

1.8 A (Typ.).

During the OCP, the output voltage continues to

drop at the specified current.

(2) The Short-Circuit Protection function is

implemented when the output voltage decreases

and the VFB pin reaches to about 70 % of the

output voltage setting.

EN

BGR

(3) The OSP operates intermittently at 2ms-ON,

16ms-OFF intervals.

UVLO

25 μs

Over Current Protection (typ:1.8 A)

1.3 to 2.3 A

DCDC_ON

SS

(1)

(Ground short

protection detection

- about 70 % of Vout )

(2)

(3)

Pendency

Intermittent

operation area

characteristics

VOUT

about 150 mA

Output current [A]

(5)

(4)

(1)(2) (3)

Figure : OCP and OSP Operation

(1) When the EN pin is set to “High” after the V_INsettles,

the BGR start-up.

(2) When the BGR exceeds its threshold value, the

UVLO is released and the SS(SOFT START)

sequence is enabled.

(1)

IOUT

During soft start the current limit of DC-DC Step

Down Regulator is set to be lower than Normal

current limit

DCDC_ON

for preventing rush current.

SS

Internal circuit power supply is turned on and wait for

the time determined by internal timer.

(3) DCDC_ON is turned on then DC-DC Step Down

Regulator is enabled. VOUT is risen up to reaches

the set voltage.

OSP

(4) After a Soft start timer current limit is set to be

Normal current limit.

(2)

VOUT

(5) When the EN pin is set to “Low”, the BGR and UVLO

stop operation. The VOUT pin voltage starts to drop

by output discharge resister and load resistance.

2 ms

(3)

16 ms

Ver. AEB

12

AN30180A

APPLICATIONS INFORMATION

1. Application circuit

V^IN

CNT1

CNT2

PVIN

Cin1

Cin2

FB

LX

AVIN

EN

VOUT

Cout

Lout

AN30180A

AGND

PGND

2. Recommended component

Reference Designator

QTY

Value

Manufacturer

Murata

Part Number

Note

4.7 μF

1.0 μH

Cin1

Cin2

Cout

Lout

1

GRM21BB31E475KA75B

MIPSZ2012D1R0

—

Murata

FDK

3. Evaluation board layout

Figure Top Layer with silk screen

( Top View ) with Evaluation board

Figure Bottom Layer with silk screen

( Bottom View ) with Evaluation board

Notes) This application circuit and layout is an example. The operation of mass production set is not guaranteed. You should perform

enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the

above application circuit and information in the design of your equipment.

Ver. AEB

13

AN30180A

PACKAGE INFORMATION (Reference Data)

Outline Drawing

Package Code : UBGA009-W-1515AEL

Unit:mm

Body Material : Br/Sb Free Epoxy Resin

Reroute Material : Cu

Bump : SnAgCu

Ver. AEB

14

AN30180A

IMPORTANT NOTICE

1.The products and product specifications described in this book are subject to change without notice for

modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore,

ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your

requirements.

2.When using the LSI for new models, verify the safety including the long-term reliability for each product.

3.When the application system is designed by using this LSI, be sure to confirm notes in this book.

Be sure to read the notes to descriptions and the usage notes in the book.

4.The technical information described in this book is intended only to show the main characteristics and application

circuit examples of the products. No license is granted in and to any intellectual property right or other right owned

by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to

the infringement upon any such right owned by any other company which may arise as a result of the use of

technical information de-scribed in this book.

5.This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of

our company.

6.This LSI is intended to be used for general electronic equipment.

Consult our sales staff in advance for information on the following applications: Special applications in which

exceptional quality and reliability are required, or if the failure or malfunction of this LSI may directly jeopardize

life or harm the human body.

Any applications other than the standard applications intended.

(1) Space appliance (such as artificial satellite, and rocket)

(2) Traffic control equipment (such as for automobile, airplane, train, and ship)

(3) Medical equipment for life support

(4) Submarine transponder

(5) Control equipment for power plant

(6) Disaster prevention and security device

(7) Weapon

(8) Others : Applications of which reliability equivalent to (1) to (7) is required

It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in

connection with your using the LSI described in this book for any special application, unless our company agrees

to your using the LSI in this book for any special application.

7.This LSI is neither designed nor intended for use in automotive applications or environments unless the specific

product is designated by our company as compliant with the ISO/TS 16949 requirements.

Our company shall not be held responsible for any damage incurred by you or any third party as a result of or in

connection with your using the LSI in automotive application, unless our company agrees to your using the LSI in

this book for such application.

8.If any of the products or technical information described in this book is to be exported or provided to non-residents,

the laws and regulations of the exporting country, especially, those with regard to security export control, must be

observed.

9. Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of

controlled substances, including without limitation, the EU RoHS Directive.

Our company shall not be held responsible for any damage incurred as a result of your using the LSI not

complying with the applicable laws and regulations.

Ver. AEB

15

AN30180A

USAGE NOTES

1. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed

operating conditions (operating power supply voltage and operating environment etc.). Especially, please be

careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off

and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of

break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as

redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical

injury, fire, social damages, for example, by using the products.

2. Comply with the instructions for use in order to prevent breakdown and characteristics change due to external

factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's

process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf

life and the elapsed time since first opening the packages.

3. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board),

it might smoke or ignite.

4. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit

between pins. In addition, refer to the Pin Description for the pin configuration.

5. Perform a visual inspection on the PCB before applying power, otherwise damage might happen due to

problems such as a solder-bridge between the pins of the semiconductor device. Also, perform a full technical

verification on the assembly quality, because the same damage possibly can happen due to conductive

substances, such as solder ball, that adhere to the LSI during transportation.

6. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs

such as output pin-VCC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin

short (load short) .

And, safety measures such as an installation of fuses are recommended because the extent of the above-

mentioned damage and smoke emission will depend on the current capability of the power supply.

7. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit

should not work during normal operation.

Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is

momentarily exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground

fault), the LSI might be damaged before the thermal protection circuit could operate.

8. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not

applied to the pins because the device might be damaged, which could happen due to negative voltage or

excessive voltage generated during the ON and OFF timing when the inductive load of a motor coil or actuator

coils of optical pick-up is being driven.

9. The product which has specified ASO (Area of Safe Operation) should be operated in ASO

10. Verify the risks which might be caused by the malfunctions of external components.

11. Connect the metallic plates on the back side of the LSI with their respective potentials (AGND, PVIN, LX). The

thermal resistance and the electrical characteristics are guaranteed only when the metallic plates are connected

with their respective potentials.

Ver. AEB

16

Request for your special attention and precautions in using the technical information and

semiconductors described in this book

(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and

regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples

of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any

other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any

other company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for general applications (such as office equipment, communications

equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.

Consult our sales staff in advance for information on the following applications:

– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,

life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of

the products may directly jeopardize life or harm the human body.

It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with

your using the products described in this book for any special application, unless our company agrees to your using the products in

this book for any special application.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-

provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions

(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

defect which may arise later in your equipment.

Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,

thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which

damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.

20100202


型号：	MIPSZ2012D1R0
厂家：	PANASONIC
描述：	VIN = 2.5V to 5.5V 1.2A Synchronous DC-DC Step Down Regulator VIN = 2.5V至5.5V 1.2A同步DC -DC降压稳压器稳压器
文件：	总17页 (文件大小：360K)
中文：	中文翻译
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MIPSZ2012D1R0 [PANASONIC]

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