MN103S5405YD [PANASONIC]
Chip-set for Digital Still Camera; 芯片组为数码相机
| 型号： | MN103S5405YD |
| 厂家： | 
PANASONIC |
| 描述： | Chip-set for Digital Still Camera |
| 文件： | 总3页 (文件大小：43K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
Part No.
MN103S5405YD
Package Code No.
FLGA324-C1515
SEMICONDUCTOR COMPANY
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Publication date: December 2004
SDB00103AEM
1
MN103S5405YD
MN103S5405YD
Chip-set for Digital Still Camera
Overview
Key devices required for a digital still camera are integrated into this chip set.
We can accommodate marketing needs by providing a total solution, which includes M-pixels CCD image
sensor, high picture quality and high efficiency single processing LSI, power supply, audio playback, and
LCD.
Features
• High picture quality CCD provides high sensitivity and broad dynamic range by a new structure.
• 8-ch. Vertical Driver IC: Suitable for high pixel size frame readout CCD
• Front End IC includes 10/ 12-bit AD converter, Liner Gain Control Amp
• High-performance Image Processing DSP, with moving/still
• 7-ch. DC-DC control IC
• LCD I/F for adjustment with Bus Control
• Low voltage operation audio processing IC
Applications
• Digital Still Cameras, OA, FA Cameras
System Block Diagram
5.3M-pixel system
64M-bit
SDRAM
CDS, AGC
10/12-bit ADC
AN12012A
/AN12011A
DSP MN103S5405YD
Video
output
CCD
process
5.3M pixels
CCD
DAC
ENC
Memory
control
LCD I/F
AN2526FH
DAC
Analog
RGB
YC
process
JPEG
LCD
Panel
V driver
AN20101A
Timing Gen.
Memory Card
I/F
AN12XXX
32-bit micro
Computer Core
SD or CF card
USB I/F
USB Core
7-ch. DC-DC
AN30210A
Audio
AN2905FHQ/
AN2906FJM
Audio
DSP
DAC
SDB00103AEM
2
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general elec-
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-
hold appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-
tions satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP
相关型号：
MN103SB5K
Microcontroller, 32-Bit, MROM, 60MHz, CMOS, PQFP64, 14 X 14 MM, LEAD FREE, PLASTIC, LQFP-64
PANASONIC
©2020 ICPDF网 联系我们和版权申明