NP04601 [PANASONIC]

Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 2-Element, NPN and PNP, Silicon, ROHS COMPLIANT, SSSMINI6-F1, 6 PIN;
NP04601
型号: NP04601
厂家: PANASONIC    PANASONIC
描述:

Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 2-Element, NPN and PNP, Silicon, ROHS COMPLIANT, SSSMINI6-F1, 6 PIN

放大器 光电二极管 晶体管
文件: 总5页 (文件大小:599K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Composite Transistors  
NP04601  
Silicon NPN epitaxial planar type (Tr1)  
Silicon PNP epitaxial planar type (Tr2)  
Unit: mm  
For general amplification  
0.12+0.03  
0.02  
6
5
4
Features  
0 to 0.02  
Two elements incorporated into one package (Each transistor is separated)  
SSSMini type package, reduction of the mounting area and assembly cost  
Maximum package height (0.4 mm) contributes to develop thinner equipments  
1
2
3
(0.35) (0.35)  
1.00±0.05  
Display at No.1 lead  
Basic Part Number  
2SD0601A+ 2SB0709A  
Absolute Maximum Ratings T
a
= 25
°
C  
Parameter  
Symbol  
Rating  
Unit  
1: Emitter (Tr1)  
4: Emitter (Tr2)  
5: Base (Tr2)  
Collector-base voltage  
(Emitter open)  
VCBO  
60  
V
2: Base (Tr1)  
3: Collector (Tr2)  
6: Collector (Tr1)  
SSSMini6-F1 Package  
Collector-emitter voltage  
(Base open)  
VCEO  
50  
7
V
V
Marking Symbol: 5C  
Tr1  
Emitter-base voltage  
(Collector open)  
VEBO  
Internal Connection  
(C1) (B2) (E2)  
Collector current  
IC  
100  
200  
mA  
mA  
6
5
4
Peak collector current  
ICP  
Collector-base voltage  
(Emitter open)  
Tr2  
Tr1  
VCBO  
VCEO  
VEBO  
V
V
V
60  
50  
7  
Collector-emitter voltage  
(Base open)  
1
2
3
(E1) (B1) (C2)  
Tr2  
Emitter-base voltage  
(Collector open)  
Collector current  
IC  
ICP  
PT  
Tj  
mA  
mA  
mW  
°
C  
100  
200  
Peak collector current  
Total power dissipation
*  
Junction temperature  
Storage temperature  
125  
125  
Overall  
T
stg  
55 to +125  
°
C  
Note) : Measuring on substrate at 17 mm 10 mm 1 mm  
*
Publication date: November 2005  
SJJ00344AED  
1
NP04601  
Electrical Characteristics T
a
= 25
°
C±3
°
C  
Tr1  
Parameter  
Symbol  
Conditions  
Min  
60  
50  
7
Typ  
Max  
Unit  
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)
*  
Emitter-base voltage (Collector open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Forward current transfer ratio  
VCBO I
C
= 10 µA, I
E
= 0  
VCEO IC = 2 mA, IB = 0  
VEBO I
E
= 10 µA, I
C
= 0  
V
V
ICBO  
ICEO  
hFE  
VCB = 20 V, I
E
= 0  
VCE = 10 V, IB = 0  
VCE = 10 V, I
C
= 2 mA  
0.1  
100  
390  
0.3  
µA  
µA  
V
180  
Collector-emitter saturation voltage  
VCE(sat) IC = 100 mA, IB = 10 mA  
Collector output capacitance  
Cob  
fT  
VCB = 10 V, IE = 0, f = 1 MHz  
3.5  
pF  
(Common base, input open circuited)  
Transition frequency  
VCB = 10 V, I
E
2 mA, f = 200 MHz  
150  
MHz  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Pulse measurement  
*
Tr2  
Parameter  
Symbol  
Conditions  
Min  
60  
50  
7  
Typ  
Max  
Unit  
V
Collector-base voltage (Emitter open)  
Collector-emitter voltage (Base open)
*  
Emitter-base voltage (Collector open)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Forward current transfer ratio  
VCBO I
C
10 µA, I
E
= 0  
VCEO I
C
2 mA, IB = 0  
VEBO I
E
10 µA, IC = 0  
V
V
ICBO  
ICEO  
hFE  
VCB
20 V, I
E
= 0  
V
CE
10 V, IB = 0  
V
CE
10 V, IC
2 mA  
0.1  
100  
390  
µA  
µA  
V
180  
Collector-emitter saturation voltage  
VCE(sat) I
C
100 mA, IB
10 mA  
0.3  
2.7  
0.5  
Collector output capacitance  
Cob  
VCB
10 V, IE = 0, f = 1 MHz  
pF  
(Common base, input open circuited)  
Transition frequency  
fT  
VCB
10 V, IE = 1 mA, f = 200 MHz  
80  
MHz  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Pulse measurement  
*
2
SJJ00344AED  
NP04601  
Common characteristics chart  
PT
T  
a
120  
80  
40  
0
0
40  
80  
120  
Ambient temperature Ta (°C)  
Characteristics charts of Tr1  
IC
V
BE  
IC
V
CE  
VCE(sat)
IC  
60  
40  
100  
1
VCE = 10 V  
IC /IB = 10  
Ta = 25°C  
IB = 160 µA  
140 µA  
80  
Ta = 85°C  
60  
120 µA  
100 µA  
25°C  
101  
40  
20  
0
80 µA  
60 µA  
40 µA  
20 µA  
25°C  
Ta = 85°C  
25°C  
20  
0
25°C  
102  
101  
0
0.4  
0.8  
1.2  
1
10  
102  
0
4
8
12  
Collector-emitter voltage VCE (V)  
Base-emitter voltage VBE (V)  
Collector current IC (mA)  
hFE
I
C  
Cob
VCB  
102  
10  
1
400  
300  
200  
100  
0
f = 1 MHz  
Ta = 25°C  
V
CE = 10 V  
Ta = 85°C  
25°C  
25°C  
102  
0
10  
20  
30  
40  
1
10  
103  
Collector-base voltage VCB (V)  
Collector current IC (mA)  
SJJ00344AED  
3
NP04601  
Characteristics charts of Tr2  
IC
V
BE  
IC
V
CE  
VCE(sat)
IC  
80  
1  
100  
VCE = 10 V  
IB = 300 µA  
250 µA  
Ta = 25°C  
IC /IB = 10  
80  
60  
40  
20  
0
200 µA  
Ta = 85°C  
60  
150 µA  
100 µA  
25°C  
101  
Ta = 85°C  
40  
20  
0
25°C  
25°C  
25°C  
50 µA  
102  
101  
1  
10  
102  
0
4  
8  
12  
0
0.4  
0.8  
1.2  
Collector-emitter voltage VCE (V)  
Collector current IC (mA)  
Base-emitter voltage VBE (V)  
hFE
I
C  
Cob
VCB  
10  
400  
300  
200  
f = 1 MHz  
Ta = 25°C  
V
CE = −10 V  
Ta = 85°C  
25°C  
25°C  
100  
0
1
102  
103  
0
10  
20  
30  
40  
1  
10  
Collector-base voltage VCB (V)  
Collector current IC (mA)  
4
SJJ00344AED  
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd. Industrial Co., Ltd.  

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