ON2280S [PANASONIC]
Optoelectronic Device;
| 型号： | ON2280S |
| 厂家： | 
PANASONIC |
| 描述： | Optoelectronic Device |
| 文件： | 总3页 (文件大小：587K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Reflective Photosensors (Photo Reflectors)
ON2280
Reflective Photosensor
Unit : mm
Outline
Mark for indicating
emitter side
C0.5
ONN2280 is a small, thin reflective photosensor consisting of a
high efficiency GaAs infrared light emitting diode which is integrated
with a high sensitivity Darlington phototransistor is used as the
photodetector in a single resin package.
1
3
Chip
center
Features
Ultraminiature : 2.7 × 3.4 mm
4-0.
0.5
Visible light cutoff resin is used
High current-transfer ratio
0.5
2
4
1.8
0.15
Application
3.4±0.3
Detection of paper, film and cloth
Detectiosition and ede
Liqud level sensor
Detection of rotary positioning
Start, end mark detection of gnetitape
3
4
1
2
Pin connection
Absolute MaximRangs Ta = 25˚C)
Parameter
Symbol Ratings Unit
Reverse vltage (DC)
Forward current (DC
Power dissipation
Collector curent
V
3
V
mA
mW
mA
V
Input (Light
50
75
30
20
5
emitting diode)
IC
Reflective
Photo
sensors
Collector to emtter voltae VCEO
Emittr to collector voltage VECO
Otput (
ranstor)
V
*1 Input power derating ratio is
*2
Collecor power issipation P
75
mW
˚C
1.0 mW/˚C at Ta ≥ 25˚C.
*2 Output power derating ratio is
Opering ambient temperature
Topr –25 to +85
Temp
orage temperature
Tstg –30 to +100 C
1.0 mW/˚C at Ta ≥ 25˚C.
Elearacteristics (Ta = 25˚C)
Parameter
Symbol
VF
Conditions
min
typ
1.3
max
1.5
Unit
V
Forward voltage (DC)
Reverse current (DC)
Capacitance between terminals
IF = 50mA
VR = 3V
Input
IR
0.01
30
10
µA
pF
characteristics
Ct
VR = 0V, f = 1MHz
Output characteristics Collector cutoff current
ICEO VCE = 10V
1.0
12.0
2.0
µA
mA
µA
V
*1, *2
Collector current
IC
VCC = 5V, IF = 2mA, RL = 100Ω, d = 1mm
0.46
Leakage current
ID
VCC = 5V, IF = 2mA, RL = 100Ω
Transfer
characteristics
Collector to emitter saturation voltage VCE(sat) IF = 5mA, IC = 0.5mA
1.5
Response time
*1 IC classifications
tr*3 , tf*4 VCC = 10V, IC = 1mA, RL = 100Ω
150
µs
*2
Output current Measurement Method
Evaporated Al
Glass plate
(t = 1mm)
Class
Q
R
S
IC (mA)
0.46 to 1.75
1.3 to 4.95
3.15 to 12.0
*3
Time required for the collector current to increase from 10% to 90% of its final value.
RL
*4
90%
10%
IF
IC
VCC
Time required for the collector current to decrease from
90% to 10% of its initial value.
tr
tf
95
Reflective Photosensors (Photo Reflectors)
ON2280
IF , IC — Ta
IF — VF
VF — Ta
60
50
40
30
20
10
0
60
50
40
30
20
10
0
1.6
1.2
0.8
0.4
0
Ta = 25˚C
IF
IF = 50mA
10mA
1mA
IC
– 25
0
20
40
60
80
100
0
0.4
0.8
1.2
1.6
2.0
2.4
– 40 – 20
0
20
40
60
80 100
Ambient temperature Ta (˚C )
Forward voltage VF (V)
Ambient temperature Ta (˚C )
IC — IF
IC — VCE
IC — Ta
10 3
10 2
10 2
10
160
120
80
VCC = 5V
Ta = 25˚C
Ta = 25˚C
VCC = 5V
IF = 2mA
RL = 100Ω
RL = 100Ω
d = 1mm
IF = 10mA
5mA
10
1
2mA
1mA
1
10 –1
40
10 –1
10 –2
10 –1
0
1
10
10 2
10 3
1
10
10 2
– 40 – 20
0
20
40
60
80 100
Forward current IF (mA)
Collector to emitter voltage VCE (V)
Ambient temperature Ta (˚C )
ICEO — Ta
tr — IC
IC — d
10 2
10
10 4
10 3
100
80
60
40
20
0
VCC = 10V
Ta = 25˚C
VCC = 5V
IF = 2mA
VCE = 10V
d
RL = 1kΩ
500Ω
100Ω
10 2
10
1
10 –1
10 –2
– 40 – 20
1
0
20
40
60
80 100
10 –2
10 –1
1
10
0
2
4
6
8
10
Ambient temperature Ta (˚C )
Collector current IC (mA)
Distance d (mm)
96
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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