R-1755V [PANASONIC]

HIPER V Highly heat resistant Low CTE Multi-layer circuit board materials ;
R-1755V
型号: R-1755V
厂家: PANASONIC    PANASONIC
描述:

HIPER V Highly heat resistant Low CTE Multi-layer circuit board materials

文件: 总1页 (文件大小:172K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Circuit Board Materials  
電子回路基板材料  
Highly heat resistant Low CTE  
Multi-layer circuit board materials <High-Tg type>  
高耐熱膨張多層基板材料 <High-Tg>  
Laminate R-1755V  
Prepreg R-1650V  
Applications ⽤途  
ICT infrastructure equipment, Measuring instrument, Etc.  
ICT ンフラ器、計測機器ど  
Network  
ネットワーク  
Good for hybrid board with MEGTRON series. Standard loss material.  
スタン領域の伝送ロスを有ておりMEGTRON リーズとブリが可能  
Dk 4.4 Df 0.016  
@1GHz  
Tg (DSC)  
173℃  
T288 (with copper)  
20min  
IST (Interconnect Stress Test)  
●Result  
Solder heat resistance (float)ꢀはんだフロート耐熱性  
●Result  
R-1755V : No abnormality of cross-sectional observation  
Sample No.  
Reflow condition  
R-1755V  
●Condition  
288℃ 10sec. Solder float 6 cycles  
1
2
3
4
5
Over 1000 cycles OK  
Over 1000 cycles OK  
Over 1000 cycles OK  
Over 1000 cycles OK  
Over 1000 cycles OK  
230℃ x 3times  
230℃ x 6times  
260℃ x 3times  
260℃ x 6times  
●Construction  
Board thickness  
Layer count  
3.1mm  
24 layers  
●Condition  
●Construction  
Drill diameter/Pitch  
0.25 mmφ/0.76mm  
Pretreatment  
Reflow  
Board thickness  
2.1mm  
Number of layers 18 layers  
25℃  
(2min)  
150℃  
Cycle condition  
(3min)  
* Failure is over 10% changes of resistance  
What is IST ?  
IST Coupon  
Carrying out temperature cycling  
experiments 25℃ ⇔ 150℃ by  
electric heating to the power unit.  
By detecting the occurrence of  
deficiencies in the sense unit,  
evaluating the number of cycles to  
failure occurrences.  
Core 0.1mm  
Power  
Prepreg #2116 53% 1ply  
Sense  
General propertiesꢀ⼀般特性  
Item  
Test method  
DSC  
Condition  
A
Unit  
R-1755V  
173  
44  
Glass transition temp.(Tg)  
α1  
CTE z-axis  
α2  
IPC-TM-650 2.4.24  
IPC-TM-650 2.4.24.1  
IPC-TM-650 2.5.5.9  
IPC-TM-650 2.4.8  
A
ppm/℃  
min  
255  
20  
T288 (with copper)  
A
C-24/23/50  
A
Dielectric constant (Dk)  
1GHz  
4.4  
Dissipation factor (Df)  
0.016  
1.5  
Peel strength  
1oz(35μm)  
kN/m  
The sample thickness is 0.8mm.  
The above data are typical values and not guaranteed values. 上記データは当社測定による代表値であり、保証値ではありません。  
Please see the page for “Notes before you use” 商品のご採用に当たっての注意事項は こちら  
2019  
201906  
industrial.panasonic.com/ww/electronic-materials  
panasonic R-1755V  

相关型号:

R-1785

High reliability Glass composite Circuit board materials
PANASONIC

R-1786

Thick copper glass composite circuit board materials
PANASONIC

R-1786/R-1781

Double-sided copper clad Single-sided copper clad
PANASONIC

R-1787

ECOOL High thermal conductivity Glass composite circuit board materials
PANASONIC

R-1804

LIGHT BAR
ETC

R-1804E

LIGHT BAR
ETC

R-1804G

LIGHT BAR
ETC

R-1804SR

LIGHT BAR
ETC

R-1804Y

LIGHT BAR
ETC

R-2-CR

Size 2 .100 Centers
ETC

R-2-RP

Size 2 .100 Centers
ETC

R-2-SC

Size 2 .100 Centers
ETC