R-2400 [PANASONIC]
高热传导性多层基板用薄膜;
| 型号： | R-2400 |
| 厂家： | 
PANASONIC |
| 描述： | 高热传导性多层基板用薄膜 |
| 文件： | 总2页 (文件大小：546K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Thermal conductivity
2.7W/m・K*
Excellent resin flowability
R-2400
High-thermal conductive film
for multi-layer circuit board
RTI 150℃
* Measured with the laser flash method
High-thermal conductivity of 2.7 W/m・K* helps reduce the
number of thermal management components. The excellent
resin flowability enables multilayering of electronic circuit
boards, contributing to the miniaturization of equipment.
Certified to meet the UL-specified rated temperature of 150℃
and can be used in high-temperature environment.
AApuplticoatmionos tive
Vehicle chargers, Power supplies for railroads,
Power conditioners for photovoltaic power
generation, Inverters, Step-up converters, etc.
Conventional materials
Superiority of R-2400ꢀMiniaturization of circuit boards by multilayeringR(c-r2os4s0-s0ectional view)
Excellent resin flowability achieves superior circuit
Insufficient resin flowability makes circuit filling difficult.
Multilayering of circuit boards is not possible because
insulating layers cannot be formed.
filling properties.
Multilayering of circuit boards is possible because
insulating layers can be formed satisfactorily.
Power
Power
<Double-sided circuit board>
<Double-sided circuit board>
semiconductor
semiconductor
Conventional
materials*
Conventional
materials*
Heat sink
Heat sink
Power
Power
R-2400
semiconductor
semiconductor
Conventional
Circuit board
Circuit board
materials*
miniaturization
miniaturization
by multilayering
by multilayering
Heat sink
Heat sink
Circuits are not filled (Generation of voids)
*Conventional materials: High thermal conductive materials
Circuits are filled
*Conventional materials: High thermal conductive materials
●Example of copper
●
Component-embedded applications
Product line-up(Thickness)
100μm, 150μm
pattern embedding
It is expected to apply R-2400's
excellent resin
Cu thickness : 105um
flowability
to component-embedded circuit boards.
Film thickness : 100um x 2ply
R-2400
R-2400
R-1566
Power
semiconductor
Heat sink
R-2400
200.00μm
Please refer to the reverse side for "Comparison of thermal conductivity" and "General properties".
Comparison of thermal conductivity
R-1566
R-2400
Temperature
℃
℃
distribution map
170
160
150
140
130
120
110
100
90
170
160
150
140
130
120
110
100
90
Surface
80
80
70
70
60
60
50
50
40
40
Cross
section
Maximum temperature
174℃
138℃
Layer configuration
6.5
6.5
FET: 2.4 mm
Calorific power5W
Calorific power5W
Copper foil: 0.018 mm
R-1566/R-2400: 0.8 mm
Copper foil: 0.018 mm
50
50
(Unit:ｍｍ)
(Unit:ｍｍ)
Analyzed by using Murata software’s Femtet.
General properties
Item
Test method
Condition
Unit
R-2400
3.8
ASTM D5470
Laser flash
DMA
A
Thermal conductivity
W / m・K
A
2.7
200
Glass transition temp. (Tg)
E-1/105
C-48/23/50
E-2/105
C-48/23/50
ー
℃
kV
ppm
V
Withstand voltage vertical to layer
CLTE
ASTM D149
IPC-TM-650 2.4.24
ASTM D3638
UL
6.5 (100um)
30 (40-260℃)
600 (PLC-0)
150
Tracking resistance
Rated temperature (RTI)
Flammability
℃
UL
C-48/23/50
－
94V-0
The sample thickness is 0.8mm. Withstand voltage vertical to layer data is for a thickness of 0.1mm.
Tracking resistance, rated temperature and flammability are data for a combination of R-2400 0.1mm above and below a 0.38mm core material.
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
The above data are typical values and not guaranteed values.
Please see our website for Notes before you use.ꢀ
industrial.panasonic.com/ww/electronic-materials
Panasonic Industry Co., Ltd. Electronic Materials Business Division
Ⓒ Panasonic Industry Co., Ltd.ꢀ202305
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