R-3566D/R-3551D [PANASONIC]

High CTI, High RTI Halogen-free multi-layer circuit board materials;
R-3566D/R-3551D
型号: R-3566D/R-3551D
厂家: PANASONIC    PANASONIC
描述:

High CTI, High RTI Halogen-free multi-layer circuit board materials

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中文:  中文翻译
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CTI600V*¹  
PLC=0  
UL FR-15.1  
Laminate  
Prepreg  
RTI 150℃*²  
R-3566D R-3551D  
High voltage CAF  
resistance (1000V)  
High CTI, High RTI Halogen-free  
multi-layer circuit board materials  
Applications  
Supports high heat resistance and high withstand voltage  
required for xEV and industrial devices.  
Automotive/Industry  
Support in reduction of PCB board size due to reduced  
creepage distances by excellent tracking resistance (PLC=0).  
Halogen-free material reducing environmental impact.  
On Board Charger, DC/DC Converter, Inverter,  
In-Wheel Motor.  
EV Charging Stand, HV Control Unit, PV Module.  
R-3566D  
Tg:175℃  
Line-up  
FR-15.1  
CTI≧600V  
RTI 150℃  
High Tg  
R-1566S  
CTI<600V  
FR-4.1  
Tg : 175℃  
RTI 130℃  
Mid Tg  
R-1755V  
Tg : 173℃  
R-1566(WN)  
R-1755M  
Tg : 148℃  
Tg : 153℃  
R-1566(W)  
R-1755E  
Tg : 148℃  
Tg : 133℃  
PLC=4  
PLC=3  
PLC=2  
PLC=1  
PLC=0  
100V≦CTI<175V  
175V≦CTI<250V  
250V≦CTI<400V  
400V≦CTI<600V  
600V≦CTI  
CTI Grade  
Through-hole reliability  
Insulation reliability  
Condition  
High voltage CAF evaluation  
Condition  
100  
1.0E+12  
1.0E+10  
1.0E+08  
1.0E+06  
Pretreatment  
Condition  
260℃ Peak reflow x 3 times  
85℃, 85%RH, DC 1000V  
0.89mm  
Conventional  
Cycle  
-40℃  
160℃  
80  
60  
40  
20  
0
FR-4  
condition (15min)  
(15min)  
R-1766  
Through-hole wall to wall distance  
*Failure is over 10% changes of resistance  
*Pretreatment: 260℃ Peak reflow x 3  
TV Design  
Wall to  
wall distance  
R-3566D  
Construction  
50 hole  
0.89mm  
0
1000  
2000  
3000  
Thickness 1.6mm  
0
250  
750  
1000  
Tim5e0(0hrs)  
Cycle number (Cycle)  
General properties  
Halogen-free  
Item  
Test method  
Condition  
A
Unit  
R-3566D  
175  
R-1566(W)  
148  
DSC  
Glass transition temp.(Tg)  
TMA  
TGA  
170  
145  
Thermal decomposition temp.(Td)  
T288(with copper)  
A
355  
350  
IPC-TM-650 2.4.24.1  
IPC-TM-650 2.4.24  
UL  
A
min  
10  
3
CTE z-axis  
α1/α2  
A
ppm/℃  
40 / 180  
150 / 0  
1.6  
40 / 180  
130 / 1  
1.8  
RTI* / PLC*  
Peel strength  
Flammability  
C-48/23/50  
A
-
kN/m  
-
1oz(35μm)  
IPC-TM-650 2.4.8  
UL  
C-48/23/50  
94V-0  
94V-0  
The sample thickness is 0.8mm.  
* The sample thickness is 1.6mm.  
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.  
The above data are typical values and not guaranteed values.  
industrial.panasonic.com/ww/electronic-materials  
panasonic R-3566D  
Panasonic Industry Co., Ltd. Electronic Materials Business Division  
Please see our website for Notes before you use.ꢀ  
Ⓒ Panasonic Industry Co., Ltd.ꢀ202205  

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