UP04979 [PANASONIC]
Silicon N-channel MOSFET (Tr1) Silicon P-channel MOSFET (Tr2); 硅的N沟道MOSFET ( Tr1的)硅P沟道MOSFET ( Tr2的)型号: | UP04979 |
厂家: | PANASONIC |
描述: | Silicon N-channel MOSFET (Tr1) Silicon P-channel MOSFET (Tr2) |
文件: | 总5页 (文件大小:126K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Composite Transistors
UP04979
Silicon N-channel MOSFET (Tr1)
Silicon P-channel MOSFET (Tr2)
Unit: mm
+0.05
–0.02
0.20
(0.30)
5
0.10 0.02
6
1
4
3
For switching
5˚
■ Features
• High-speed switching
• Gate protection diode built-in
• Two elements incorporated into one package
(Each transistor is separated)
2
(0.50)(0.50)
1.00 0.05
1.60 0.05
Display at No.1 lead
5˚
• Reduction of the mounting area and assembly cost by one half
■ Basic Part Number
• 2SJ0672 + 2SK3539
1: Source (FET1)
2: Gate (FET1)
4: Source (FET2)
5: Gate (FET2)
■ Absolute Maximum Ratings Ta = 25°C
3: Drain (FET2)
JEDEC: SOD-723
6: Drain (FET1)
SSMini6-F1 Package
Parameter
Symbol
Rating
Unit
Tr1
Drain-source surrender
voltage
VDSS
50
V
Marking Symbol: 4T
Internal Connection
Gate-source voltage
(Drain open)
VGSO
7
V
(D1) (G2) (S2)
6
5
4
Drain current
ID
IDP
100
200
−30
mA
mA
V
Peak drain current
Tr2
Drain-source surrender
voltage
VDSS
Gate-source voltage
(Drain open)
VGSO
7
V
1
2
3
(S1) (G1) (D2)
Drain current
ID
IDP
PT
−100
−200
mA
mA
mW
°C
Peak drain current
Overall Total power dissipation *
Junction temperature
125
Tch
Tstg
125
Storage temperature
−55 to +125
°C
Note) : Measuring on substrate at 17 mm × 10 mm × 1 mm
*
Publication date: August 2004
SJJ00303AED
1
UP04979
■ Electrical Characteristics Ta = 25°C 3°C
• Tr1
Parameter
Symbol
VDSS
IDSS
Conditions
ID = 10 µA, VGS = 0
VDS = 30 V, VGS = 0
VGS 7 V, VDS = 0
Min
Typ
Max
Unit
V
Drain-source surrender voltage
Drain-source cutoff current
Gate-source cutoff current
Gate threshold voltage
50
1.0
10
µA
µA
V
IGSS
=
Vth
ID = 1.0 µA, VDS = 3.0 V
0.5
20
1.0
8
1.5
15
12
Drain-source ON resistance
RDS(on)
ID = 10 mA, VGS = 2.5 V
Ω
ID = 10 mA, VGS = 4.0 V
6
Forward transfer admittance
Turn-on time *
Yfs
ton
ID = 10 mA, VDS = 3.0 V
60
200
200
mS
ns
VDD = 3 V, VGS = 0 V to 3 V, ID = 10 mA
VDD = 3 V, VGS = 3 V to 0 V, ID = 10 mA
Turn-off time *
toff
ns
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. : Refer to ton, toff test circuit.
*
• Tr2
Parameter
Symbol
VDSS
IDSS
Conditions
ID = −10 µA, VGS = 0
VDS = −20 V, VGS = 0
VGS 7 V, VDS = 0
Min
Typ
Max
Unit
V
Drain-source surrender voltage
Drain-source cutoff current
Gate-source cutoff current
Gate threshold voltage
−30
−1.0
10
µA
µA
V
IGSS
=
Vth
ID = −1.0 µA, VDS = −3.0 V
− 0.5
−1.0
25
−1.5
45
Drain-source ON resistance
RDS(on)
ID = −10 mA, VGS = −2.5 V
Ω
ID = −10 mA, VGS = −4.0 V
15
30
Forward transfer admittance
Turn-on time *
Yfs
ton
ID = −10 mA, VDS = −3.0 V
20
35
mS
ns
VDD = −3 V, VGS = 0 V to −3 V, ID = −10 mA
VDD = −3 V, VGS = −3 V to 0 V, ID = −10 mA
850
850
Turn-off time *
toff
ns
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. : Refer to ton, toff test circuit.
*
ton, toff test citcuit (Tr1)
VOUT
470 Ω
90%
10%
VIN
VGS = 3.0 V
50 Ω
VDD = 3 V
VOUT
10%
90%
ton
toff
ton, toff test citcuit (Tr2)
VOUT
280 Ω
10%
VGS
90%
VGS = 0 V to −3 V
50 Ω
VDD = −3 V
90%
10%
VOUT
ton
toff
SJJ00303AED
2
UP04979
Common characteristics chart
PT Ta
140
120
100
80
60
40
20
0
0
40
80
120
Ambient temperature Ta (°C)
Characteristics charts of Tr1
ID VDS
ID VGS
Yfs ID
180
160
140
120
100
80
300
250
200
150
100
50
70
VGS = 3 V
Ta = 25°C
Ta = 25°C
VDS = 3 V
Ta = −25°C
60
VGS = 2.0 V
25°C
85°C
50
40
30
20
10
0
1.9 V
1.8 V
1.7 V
60
1.6 V
1.5 V
40
20
0
0
0
50
100
150
200
250
0
1
2
3
4
5
6
0
2
4
6
8
10
12
(m
A
)
Drain current ID
(
V
)
(
V
)
Gate-source voltage VGS
Drain-source voltage VDS
Yfs VGS
RDS(on) VGS
180
160
140
120
100
80
40
30
20
10
0
VDS = 3 V
ID = 10 mA
60
Ta = 85°C
40
25°C
20
0
−25°C
0
1
2
3
0
2
4
6
8
10
12
Gate-source voltage VGS (V)
(
V
)
Gate-source voltage VGS
SJJ00303AED
3
UP04979
Characteristics charts of Tr2
ID VDS
ID VGS
Yfs VGS
70
60
50
40
30
20
−180
−160
−140
−120
−100
−80
−120
VDS = −3 V
Ta = 25°C
Ta = 25°C
VDS = −3 V
Ta = −25°C
25°C
VGS = −3.50 V
−100
−3.25 V
−80
−3.00 V
85°C
−2.75 V
−2.50 V
−60
−40
−60
−40
−20
0
−20
10
0
0
0
−2
−4
−6
0
−2
−4
−6
−8
−10 −12
0
−2
−4
−6
Gate-source voltage VGS (V)
(
V
)
( )
Gate-source voltage VGS V
Drain-source voltage VDS
RDS(on) VGS
50
40
30
20
10
0
ID = −10 mA
Ta = 85°C
25°C
−25°C
0
−2
−4
−6
(
V
)
Gate-source voltage VGS
SJJ00303AED
4
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general elec-
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-
hold appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-
tions satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP
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