UP04979 [PANASONIC]

Silicon N-channel MOSFET (Tr1) Silicon P-channel MOSFET (Tr2); 硅的N沟道MOSFET ( Tr1的)硅P沟道MOSFET ( Tr2的)
UP04979
型号: UP04979
厂家: PANASONIC    PANASONIC
描述:

Silicon N-channel MOSFET (Tr1) Silicon P-channel MOSFET (Tr2)
硅的N沟道MOSFET ( Tr1的)硅P沟道MOSFET ( Tr2的)

晶体 小信号场效应晶体管 开关 光电二极管
文件: 总5页 (文件大小:126K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Composite Transistors  
UP04979  
Silicon N-channel MOSFET (Tr1)  
Silicon P-channel MOSFET (Tr2)  
Unit: mm  
+0.05  
–0.02  
0.20  
(0.30)  
5
0.10 0.02  
6
1
4
3
For switching  
5˚  
Features  
High-speed switching  
Gate protection diode built-in  
Two elements incorporated into one package  
(Each transistor is separated)  
2
(0.50)(0.50)  
1.00 0.05  
1.60 0.05  
Display at No.1 lead  
5˚  
Reduction of the mounting area and assembly cost by one half  
Basic Part Number  
2SJ0672 + 2SK3539  
1: Source (FET1)  
2: Gate (FET1)  
4: Source (FET2)  
5: Gate (FET2)  
Absolute Maximum Ratings Ta = 25°C  
3: Drain (FET2)  
JEDEC: SOD-723  
6: Drain (FET1)  
SSMini6-F1 Package  
Parameter  
Symbol  
Rating  
Unit  
Tr1  
Drain-source surrender  
voltage  
VDSS  
50  
V
Marking Symbol: 4T  
Internal Connection  
Gate-source voltage  
(Drain open)  
VGSO  
7
V
(D1) (G2) (S2)  
6
5
4
Drain current  
ID  
IDP  
100  
200  
30  
mA  
mA  
V
Peak drain current  
Tr2  
Drain-source surrender  
voltage  
VDSS  
Gate-source voltage  
(Drain open)  
VGSO  
7
V
1
2
3
(S1) (G1) (D2)  
Drain current  
ID  
IDP  
PT  
100  
200  
mA  
mA  
mW  
°C  
Peak drain current  
Overall Total power dissipation *  
Junction temperature  
125  
Tch  
Tstg  
125  
Storage temperature  
55 to +125  
°C  
Note) : Measuring on substrate at 17 mm × 10 mm × 1 mm  
*
Publication date: August 2004  
SJJ00303AED  
1
UP04979  
Electrical Characteristics Ta = 25°C 3°C  
Tr1  
Parameter  
Symbol  
VDSS  
IDSS  
Conditions  
ID = 10 µA, VGS = 0  
VDS = 30 V, VGS = 0  
VGS 7 V, VDS = 0  
Min  
Typ  
Max  
Unit  
V
Drain-source surrender voltage  
Drain-source cutoff current  
Gate-source cutoff current  
Gate threshold voltage  
50  
1.0  
10  
µA  
µA  
V
IGSS  
=
Vth  
ID = 1.0 µA, VDS = 3.0 V  
0.5  
20  
1.0  
8
1.5  
15  
12  
Drain-source ON resistance  
RDS(on)  
ID = 10 mA, VGS = 2.5 V  
ID = 10 mA, VGS = 4.0 V  
6
Forward transfer admittance  
Turn-on time *  
Yfs  
ton  
ID = 10 mA, VDS = 3.0 V  
60  
200  
200  
mS  
ns  
VDD = 3 V, VGS = 0 V to 3 V, ID = 10 mA  
VDD = 3 V, VGS = 3 V to 0 V, ID = 10 mA  
Turn-off time *  
toff  
ns  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Refer to ton, toff test circuit.  
*
Tr2  
Parameter  
Symbol  
VDSS  
IDSS  
Conditions  
ID = −10 µA, VGS = 0  
VDS = −20 V, VGS = 0  
VGS 7 V, VDS = 0  
Min  
Typ  
Max  
Unit  
V
Drain-source surrender voltage  
Drain-source cutoff current  
Gate-source cutoff current  
Gate threshold voltage  
30  
1.0  
10  
µA  
µA  
V
IGSS  
=
Vth  
ID = −1.0 µA, VDS = −3.0 V  
0.5  
1.0  
25  
1.5  
45  
Drain-source ON resistance  
RDS(on)  
ID = −10 mA, VGS = −2.5 V  
ID = −10 mA, VGS = −4.0 V  
15  
30  
Forward transfer admittance  
Turn-on time *  
Yfs  
ton  
ID = −10 mA, VDS = −3.0 V  
20  
35  
mS  
ns  
VDD = −3 V, VGS = 0 V to 3 V, ID = −10 mA  
VDD = −3 V, VGS = −3 V to 0 V, ID = −10 mA  
850  
850  
Turn-off time *  
toff  
ns  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Refer to ton, toff test circuit.  
*
ton, toff test citcuit (Tr1)  
VOUT  
470 Ω  
90%  
10%  
VIN  
VGS = 3.0 V  
50 Ω  
VDD = 3 V  
VOUT  
10%  
90%  
ton  
toff  
ton, toff test citcuit (Tr2)  
VOUT  
280 Ω  
10%  
VGS  
90%  
VGS = 0 V to 3 V  
50 Ω  
VDD = −3 V  
90%  
10%  
VOUT  
ton  
toff  
SJJ00303AED  
2
UP04979  
Common characteristics chart  
PT Ta  
140  
120  
100  
80  
60  
40  
20  
0
0
40  
80  
120  
Ambient temperature Ta (°C)  
Characteristics charts of Tr1  
ID VDS  
ID VGS  
Yfs  ID  
180  
160  
140  
120  
100  
80  
300  
250  
200  
150  
100  
50  
70  
VGS = 3 V  
Ta = 25°C  
Ta = 25°C  
VDS = 3 V  
Ta = −25°C  
60  
VGS = 2.0 V  
25°C  
85°C  
50  
40  
30  
20  
10  
0
1.9 V  
1.8 V  
1.7 V  
60  
1.6 V  
1.5 V  
40  
20  
0
0
0
50  
100  
150  
200  
250  
0
1
2
3
4
5
6
0
2
4
6
8
10  
12  
(m  
A
)
Drain current ID  
(
V
)
(
V
)
Gate-source voltage VGS  
Drain-source voltage VDS  
Yfs  VGS  
RDS(on) VGS  
180  
160  
140  
120  
100  
80  
40  
30  
20  
10  
0
VDS = 3 V  
ID = 10 mA  
60  
Ta = 85°C  
40  
25°C  
20  
0
25°C  
0
1
2
3
0
2
4
6
8
10  
12  
Gate-source voltage VGS (V)  
(
V
)
Gate-source voltage VGS  
SJJ00303AED  
3
UP04979  
Characteristics charts of Tr2  
ID VDS  
ID VGS  
Yfs  VGS  
70  
60  
50  
40  
30  
20  
180  
160  
140  
120  
100  
80  
120  
VDS = −3 V  
Ta = 25°C  
Ta = 25°C  
VDS = −3 V  
Ta = −25°C  
25°C  
VGS = −3.50 V  
100  
3.25 V  
80  
3.00 V  
85°C  
2.75 V  
2.50 V  
60  
40  
60  
40  
20  
0
20  
10  
0
0
0
2  
4  
6  
0
2  
4  
6  
8  
10 12  
0
2  
4  
6  
Gate-source voltage VGS (V)  
(
V
)
( )  
Gate-source voltage VGS V  
Drain-source voltage VDS  
RDS(on) VGS  
50  
40  
30  
20  
10  
0
ID = −10 mA  
Ta = 85°C  
25°C  
25°C  
0
2  
4  
6  
(
V
)
Gate-source voltage VGS  
SJJ00303AED  
4
Request for your special attention and precautions in using the technical information  
and semiconductors described in this material  
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of  
the products or technical information described in this material and controlled under the "Foreign Exchange  
and Foreign Trade Law" is to be exported or taken out of Japan.  
(2) The technical information described in this material is limited to showing representative characteristics and  
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right  
or any other rights owned by our company or a third party, nor grants any license.  
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical  
information as described in this material.  
(4) The products described in this material are intended to be used for standard applications or general elec-  
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-  
hold appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-  
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are  
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human  
body.  
Any applications other than the standard applications intended.  
(5) The products and product specifications described in this material are subject to change without notice for  
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,  
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-  
tions satisfy your requirements.  
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-  
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not  
be liable for any defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of  
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such  
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent  
physical injury, fire, social damages, for example, by using the products.  
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life  
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually  
exchanged.  
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written  
permission of Matsushita Electric Industrial Co., Ltd.  
2003 SEP  

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