XN01116G [PANASONIC]

Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 2-Element, PNP, Silicon, ROHS COMPLIANT, MINI5-G2, 5 PIN;
XN01116G
型号: XN01116G
厂家: PANASONIC    PANASONIC
描述:

Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 2-Element, PNP, Silicon, ROHS COMPLIANT, MINI5-G2, 5 PIN

开关 光电二极管 晶体管
文件: 总4页 (文件大小:203K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
This product complies with the RoHS Directive (EU 2002/95/EC).  
Composite Transistors  
XN01116G  
Silicon PNP epitaxial planar type  
For switching/digital circuits  
Features  
Package  
Two elements incorporated into one package  
(Emitter-coupled transistors with built-in resistor)  
Reduction of the mounting area and assembly cost by onhalf  
Code  
Mini5-G2  
Pin Name  
1: C(Tr1) 4: Emitter  
2: Cr2) 5: Base (Tr1)  
ase )  
Basic Part Number  
UNR2116 × 2  
Marking Symbol: 7N  
Absolute Maximum Ratings Ta = 25°
Parameter  
ymbol  
Rating  
50  
Unit  
V
Internal Connection  
Collector-base voltage (Emitter open) VBO  
Collector-emitter voltage (Base VCEO  
50  
V
(B2) (E) (B1)  
3
4
5
Collector current  
IC  
PT  
Tj  
10  
mA  
mW  
°C  
Total power dissipatin  
Junction temperate  
Storage temperaure  
00  
R1  
R1  
(4.7 Ω) (4.7 Ω)  
150  
Tr2  
2
Tr1  
5 to +150  
°C  
1
(C1)  
(C2)  
ElectricCharacteristics Ta = 25°C 3°C  
er  
Symbol  
VCBO  
VCEO  
ICBO  
Conditions  
Min  
50  
50  
Typ  
Max  
Unit  
V
Collector-Emitter open)  
Collector-emitttage (Base op)  
Collector-base cutoff current (Emitter open)  
Collector-emitter cutoff current (Base open)  
Emitter-base cutoff current (Collector open)  
Forward current transfer ratio  
IC = −10 µA, IE = 0  
IC = −2 mA, IB = 0  
V
VCB = −50 V, IE = 0  
VCE = −50 V, IB = 0  
VEB = −6 V, IC = 0  
VCE = −10 V, IC = −5 mA  
0.1  
0.5  
0.01  
460  
µA  
µA  
mA  
ICEO  
IEBO  
hFE  
160  
h
FE Ratio *  
hFE(Small VCE = −10 V, IC = −5 mA  
/Large)  
0.50  
0.99  
Collector-emitter saturation voltage  
Output voltage high-level  
Output voltage low-level  
Input resistance  
VCE(sat) IC = −10 mA, IB = − 0.3 mA  
0.25  
V
V
VOH  
VOL  
R1  
VCC = −5 V, VB = − 0.5 V, RL = 1 kΩ  
4.9  
VCC = −5 V, VB = −2.5 V, RL = 1 kΩ  
0.2  
V
30%  
4.7  
80  
+30%  
kΩ  
MHz  
Transition frequency  
fT  
VCB = −10 V, IE = 1 mA, f = 200 MHz  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : Ratio between 2 elements  
*
Publication date: March 2009  
SJJ00430AED  
1
This product complies with the RoHS Directive (EU 2002/95/EC).  
XN01116G  
PT Ta  
IC VCE  
VCE(sat) IC  
100  
10  
1  
160  
120  
80  
40  
0
500  
400  
300  
200  
100  
0
IC / IB = 10  
Ta = 25°C  
IB = 1.0 mA  
0.9 mA  
0.8 mA  
0.7 mA  
0.6 mA  
0.5 m
0.4 mA  
A  
0.2 mA  
Ta = 75°C  
25°C  
0.1  
0.1 mA  
25°C  
1  
10  
100  
0
4  
8  
10
0
40  
80  
120  
160  
(
)
Collector current IC mA  
(
(
)
llectoemitter voltage VCE  
Ambient temperature Ta °C  
hFE IC  
Cob VCB  
IO VIN  
400  
300  
200  
0  
0
104  
103  
102  
10  
1  
6
5
3
1
0
VO = 5 V  
a = 25°C  
= 1 MHz  
IE = 0  
VCE =
T
Ta = 25°C  
Ta = 75
25°C  
25°C  
0.1  
1  
10  
100  
10  
100  
1000  
0.4 0.6 0.8  
1.0  
1.2  
1.4  
(
)
Colletor-base voltage VCB (V)  
urrent IC m
( )  
V
Input voltage VIN  
IO  
100  
VO = 0.2 V  
Ta = 25°C  
10  
1  
0.1  
0.01  
0.1  
1  
10  
100  
(
)
Output current IO mA  
SJJ00430AED  
2
This product complies with the RoHS Directive (EU 2002/95/EC).  
XN01116G  
Mini5-G2  
Unit: mm  
2.90 +00..0250  
1.9 0.1  
13 +00..0025  
(0.95)  
(0.95)  
3
4
5
2
1
0.30 +0.0150  
8°  
SJJ00430AED  
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability requied, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subjet to change wit notice for modification and/or im-  
provement. At the final stage of your design, purchasingr use of the roducts, therfor the most up-to-date Product  
Standards in advance to make sure that the latest specifictions stisfy your requirements.  
(5) When designing your equipment, comply with he ange f absolute maximing nd the guaranteed operating conditions  
(operating power supply voltage and operating nvirent etc.). Especiall, plee be ceful not to exceed the range of absolute  
maximum rating on the transient state, such as powpower-off and modeswitching. Otherwise, we will not be liable for any  
defect which may arise later in your equpmen
Even when the products are used withthe guaanteed values, kinto he cosideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the sytems such as redundant design, arresting the spread of fire  
or preventing glitch are recommin ordto prevent physicinjury, fre, social damaes, for example, by using the products.  
(6) Comply with the instructios for se in rder to prevent breakdwn and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanicastress) at the time of andlig, mounting or at customer's process. When using products for which  
damp-proof packinis reqired, stisfy the condtions, sch as shelf life and the elapsed time since first opening the packages.  
(7) This book may e not eprinted or reprodhethr wholly or partially, without the prior written permission of our company.  
2008080

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