L-C155TBJSCT-5A [PARALIGHT]
SURFACE MOUNT DEVICE LED;
| 型号： | L-C155TBJSCT-5A |
| 厂家： | 
PARA LIGHT ELECTRONICS CO., LTD. |
| 描述： | SURFACE MOUNT DEVICE LED |
| 文件： | 总13页 (文件大小：234K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Release by
PARALIGHT DCC
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan.
Tel: 886-2-2225-3733
E-mail: para@para.com.tw
Fax: 886-2-2225-4800
http://www.para.com.tw
DATA SHEET
PART NO.: L-C155TBJSCT-5A
REV: A/0
CUSTOMER’S APPROVAL: _______________
DCC: ____________
PAGE 1 of 13
DRAWING NO.: DS-31-09-XXXX
DATE: 2009-06-30
PARA-FOR-065
Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
REV:A/0
ꢀ PACKAGE OUTLINE DIMENSIONS
Notes:
1.②④: Yellow; ①③:Blue
2. All dimensions are in millimeters.
±
3. Tolerance is
0.1mm (.004") unless otherwise noted.
ꢀ
Features
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Dual color, top view, wide view angle Chip LED.
Package in 8mm tape on 7" diameter reels.
Compatible with automatic Pick & Place equipment.
Compatible with Reflow soldering and Wave soldering processes.
EIA STD package.
I.C. compatible.
Pb free product.
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DATE: 2009-06-30
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SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
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ꢀ Chip Materials
Chip
①③
②④
Light Color
Dice Material
InCaN
Lens Color
Water Clear
TB:Blue
JS
:
Yellow
AllnCaP
ꢀ Absolute Maximum Ratings (Ta=25℃)
Rating
Symbol
PD
Parameter
Unit
mW
mA
mA
Yellow
75
Blue
76
Power Dissipation
Peak Forward Current
IPF
100
80
(1/10 Duty Cycle, 0.1ms Pulse Width)
Continuous Forward Current
IF
-
20
0.25
5
30
0.4
5
℃
℃
De-rating Linear From 25
mA/
V
VR
Reverse Voltage
ESD
Topr
Tstg
-
Electrostatic Discharge Threshold (HBM)Note A
Operating Temperature Range
2000
℃
℃
℃
℃
-20 ~ +80
Storage Temperature Range
-30 ~ +100
Wave Soldering Condition (Two times Max.)
Infrared Soldering Condition (Two times MAX.)
260 (for 5 seconds)
260 (for 10 seconds)
-
Note A:
HBM: Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD.
ꢀ Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Yellow
4.5
Unit
mcd
Test Condition
IF=5mA
Blue
4.5
Min.
Typ.
Max.
Typ.
Luminous Intensity
IV
45.0
45.0
θ
2 1/2
Viewing Angle
130
deg
nm
Note 2
Measurement @Peak
IF=5mA
λ
λ
Peak Wavelength
Typ.
p
468
591
Dominant Wavelength
Typ.
Typ.
Typ.
Max.
Max.
d
470
25
589
15
nm
nm
Δλ
Spectral Line Half-Width
3.1
3.6
2.0
2.4
Forward Voltage
Reverse Current
VF
V
IF =5mA
μ
IR
10
A
VR = 5V
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DATE: 2009-06-30
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SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
REV:A/0
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. The dominant wavelength λd is derived from the CIE chromaticity diagram and
represents the single wavelength which defines the color of the device.
4. Caution in ESD:
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
5. Major standard testing equipment by “Instrument System” Model: CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model: 2400.
ꢀ Typical Electro-Optical Characteristics Curves
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DATE: 2009-06-30
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SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
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ꢀ Blue and Yellow Typical Electro-Optical Characteristics Curves
(25℃Ambient Temperature Unless Otherwise Noted)
DRAWING NO.: DS-31-09-XXXX
DATE: 2009-06-30
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SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
REV:A/0
ꢀ Label Explanation
CUS. PART NO: To be denominated.
CUSTOMER: To be denominated.
PART NO: Refer to P15
BATCH: MNGA
M--- a Chip Luminous Intensity Code
N--- b Chip Luminous Intensity Code
GA--- a Chip Dominant Wavelength Code
LOT NO:
E L S 4 7 0009
A
B
C
D
E
F
A---E: For series number
B---L: Local
C---S: SMD
D---Year
F: Foreign
E---Month
F---SPEC.
QUANTITY:
3000pcs for 150、110、155、115、195 series
4000pcs for 191 series
5000pcs for 192 series
DRAWING NO.: DS-31-09-XXXX
DATE: 2009-06-30
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SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
REV:A/0
ꢀ Reel Dimensions
DRAWING NO.: DS-31-09-XXXX
DATE: 2009-06-30
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SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
REV:A/0
ꢀ Package Dimensions Of Tape And Reel
Notes: All dimensions are in millimeters.
Moisture Resistant Packaging
Label
Reel
Label
Desiccant
Aluminum moistue-proof bag
Label
Box
435
Carton
Notes: One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit: mm.
DRAWING NO.: DS-31-09-XXXX
DATE: 2009-06-30
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SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
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ꢀ Cleaning
ꢀ
ꢀ
ꢀ
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
the oscillator output, size of PCB and LED mounting method. The use of ultrasonic
cleaning should be enforced at proper output after confirming there is no problem.
ꢀ Suggest Soldering Pad Dimensions
Direction of PWB camber
and go to reflow furnace
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DATE: 2009-06-30
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SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
REV:A/0
DRAWING NO.: DS-31-09-XXXX
DATE: 2009-06-30
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SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
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ꢀ
Bin Code List
ꢀ CAUTIONS
1.Application Limitation:
The LED’s described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household application). Consult PARA’s sales in advance for information on application
in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LED’s may
directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life support system and
safety devices).
2.Storage:
Before opening the package:
The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used within a year.
After opening the package:
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7
days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur.
3.Soldering
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering:
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time: 10 sec Max.
Soldering Iron: (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 20W Max. use SN60
solder of solder with silver content and don’t to touch LED lens when soldering.
DATE:
PAGE
2009-06-30
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Wave soldering:
Pre-heat 100°C Max, Pre-heat time 60 sec. Max, Solder wave 260°C Max, Soldering time 5 sec. Max. preformed
consecutively cooling process is required between 1st and 2nd soldering processes.
4. Lead-Free Soldering
For Reflow Soldering:
、
℃
1 Pre-Heat Temp:150-180 ,120sec.Max.
、
℃
2 Soldering Temp: Temperature Of Soldering Pot Over 230 ,40sec.Max.
、
℃，
3 Peak Temperature:260
5sec.
、
4 Reflow Repetition:2 Times Max.
、
5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended):
、
℃
1 Iron Tip Temp:350 Max.
、
2 Soldering Iron:30w Max.
、
3 Soldering Time:3 Sec. Max. One Time.
For Dip Soldering:
、
℃
1 Pre-Heat Temp:150
Max. 120 Sec. Max.
、
℃
2 Bath Temp:265 Max.
、
3 Dip Time:5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
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DATE: 2009-06-30
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PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No.: L-C155TBJSCT-5A
REV:A/0
6.Reliability Test
Classification
Test Item
Test Condition
Reference Standard
Ta= Under Room Temperature As Per Data
Sheet Maximum Rating
*Test Time= 1000HRS
MIL-STD-750D: 1026 (1995)
MIL-STD-883D: 1005 (1991)
JIS C 7021:B-1 (1982)
Operation Life
(-24HRS,+72HRS)*@20mA.
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 1000HRS±2HRS
MIL-STD-202F: 103B(1980)
JIS C 7021: B-11 (1982)
Endurance Test
High Temperature
Storage
Ta= 105±5℃
Test Time= 1000HRS (-24HRS, 72HRS)
MIL-STD-883D: 1008 (1991)
JIS C 7021:B-10 (1982)
Low Temperature
Storage
Ta= -55±5℃
*Test Time=1000HRS (-24HRS, 72H RS)
JIS C 7021:B-12 (1982)
MIL-STD-202F: 107D (1980)
MIL-STD-750D: 1051(1995)
MIL-STD-883D: 1010 (1991)
JIS C 7021: A-4 (1982)
Temperature
Cycling
105±5℃
10mins
-55±5℃
10mins
100 Cycles
100 Cycles
IR-Reflow In-Board, 2 Times
105±5℃
10mins
MIL-STD-202F: 107D(1980)
MIL-STD-750D: 1051(1995)
MIL-STD-883D: 1011(1991)
Thermal
Shock
-55℃±5℃
10mins
Environmental
Test
MIL-STD-202F: 210A(1980)
MIL-STD-750D: 2031(1995)
JIS C 7021: A-1 (1982)
Solder
Resistance
Tsol= 260 ± 5℃
Dwell Time= 10 ± 1sec
MIL-STD-202F: 208D(1980)
MIL-STD-750D: 2026(1995)
MIL-STD-883D: 2003(1991)
IEC 68 Part 2-20
Tsol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Solder ability
Coverage ≧95% of the dipped surface
JIS C 7021: A-2 (1982)
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
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DATE: 2009-06-30
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