L-S115GECT [PARALIGHT]
SURFACE MOUNT DEVICE LED;
| 型号： | L-S115GECT |
| 厂家： | 
PARA LIGHT ELECTRONICS CO., LTD. |
| 描述： | SURFACE MOUNT DEVICE LED |
| 文件： | 总15页 (文件大小：264K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Release by
PARALIGHT DCC
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan, R.O.C.
Tel: 886-2-2225-3733
E-mail: para@para.com.tw
Fax: 886-2-2225-4800
http://www.para.com.tw
DATA SHEET
PART NO.: L-S115GECT
REV: A / 0
CUSTOMER’S APPROVAL : _______________
DCC : ____________
DRAWING NO. : DS-78-08-0003
DATE : 2008-02-21 PAGE 1 of 15
PARA-FOR-065
Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-S115GECT
REV:A / 0
z PACKAGE OUTLINE DIMENSIONS
C1
C2
b chip
C1
C1
C2
C2
a chip
a+
a+
a+
Notes:
1. a chip: Green; b chip: Orange .
2. All dimensions are in millimeters.
±
3. Tolerance is
0.1mm (.004") unless otherwise noted.
z Features
½
½
½
½
½
½
½
½
Dual color, common anode, side view Chip LED.
Package in 8mm tape on 7" diameter reels.
Compatible with automatic Pick & Place equipment.
Compatible with Reflow soldering and Wave soldering processes.
EIA STD package.
I.C. compatible.
Pb free product.
Meet RoHS Green Product.
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SURFACE MOUNT DEVICE LED
Part No. : L-S115GECT
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z Chip Materials
chip
Light Color
G: Green
Dice Material
GaP
Lens Color
Water Clear
a
b
E: Orange
GaAsP
z Absolute Maximum Ratings(Ta=25℃)
Rating
Symbol
PD
Parameter
Unit
mW
mA
mA
Green
100
Orange
Power Dissipation
100
Peak Forward Current
IPF
120
120
(1/10 Duty Cycle, 0.1ms Pulse Width)
Continuous Forward Current
IF
-
25
0.25
5
25
0.25
5
℃
℃
De-rating Linear From 25
mA/
V
VR
ESD
Topr
Tstg
-
Reverse Voltage
Electrostatic Discharge Threshold(HBM)Note A
Operating Temperature Range
2000
V
℃
℃
℃
℃
-40 ~ +85
-40 ~ +85
Storage Temperature Range
Wave Soldering Condition (Two times Max.)
260 (for 5 seconds)
-
Infrared Soldering Condition (Two times MAX.) 240 (for 5 seconds)
Note A:
HBM: Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD
z Electro-Optical Characteristics(Ta=25℃)
Parameter
Symbol
Green
4.0
Orange
2.5
Unit
mcd
deg
nm
Test Condition
IF=20mA
Min.
Typ.
Typ.
Luminous Intensity
IV
12.5
8.3
θ
2 1/2
Viewing Angle
130
Note 2
Measurement
@Peak
λ
Peak Wavelength
Dominant Wavelength
Typ.
Typ.
p
d
568
630
λ
570
30
620
24
nm
nm
IF=20mA
Δλ
Spectral Line Half-Width Typ.
Typ.
Forward Voltage
2.1
2.6
2.1
2.6
VF
V
IF =20mA
VR = 5V
Max.
μ
A
Reverse Current
Max.
IR
100
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z Bin Code List
Luminous Intensity(IV), Unit:mcd@20mA
Green(a chip)
Orange(b chip)
Bin Code
Min
4.5
Max
7.1
Bin Code
Min
2.8
Max
J
H
J
4.5
7.1
K
L
7.1
11.2
18.0
28.0
4.5
11.2
18.0
K
L
7.1
11.2
18.0
M
11.2
Tolerance of each bin are±15%
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that
proximities the CIE eye-response curve.
θ
2.
1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
λ
3. The dominant wavelength d is derived from the CIE chromaticity diagram and
represents the single wavelength which defines the color of the device.
4. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
5. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
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Part No. : L-S115GECT
z Green Typical Electro-Optical Characteristics Curves
(25℃Ambient Temperature Unless Otherwise Noted)
25
20
15
10
50
40
30
20
10
0
5
0
1.6
1.8 2.0 2.2 2.4
Forward Voltage(V)
2.6
0
10
20
30
40
50
Forward Current(mA)
Fig.2 Forward Current vs.Forward Voltage
Fig.3 Luminous Intensity vs.Forward Current
1000
2.5
2
100
10
1.5
1
0.5
0
1
-60 -40 -20 -0 20 40 60 80 100
0
10
20
30
40
50
Ambient Temperature Ta(℃)
Forward Current(mA)
Fig.5 Luminous Intensity vs.Ambient Temperature
Fig.4 Relative Luminous Intensity vs.Forward Current
0° 10° 20°
50
40
30°
30
25
20
40°
1.0
0.9
0.8
50°
60°
10
0
70°
80°
90°
0.7
0
20
40
60
80 100
0.5 0.3 0.1 0.2 0.4 0.6
Ambient Temperature Ta(℃)
Fig.6 Forward Current Derating Curve
Fig.7 Relative Intensity vs.Angle
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z Orange Typical Electro-Optical Characteristics Curves
(25℃Ambient Temperature Unless Otherwise Noted)
Fig.2 Forward Current vs.Forward Voltage
Fig.3 Luminous Intensity vs.Forward Current
1000
100
10
1
-60 -40 -20 -0 20 40 60 80 100
Ambient Temperature Ta(℃)
Fig.5 Luminous Intensity vs Ambient Temperature
Fig.4 Relative Luminous Intensity vs.Forward Current
0° 10° 20°
50
40
30°
30
25
20
40°
1.0
0.9
50°
0.8
60°
10
0
70°
80°
90°
0.7
0
20
40
60
80 100
0.5 0.3 0.1 0.2 0.4 0.6
Ambient Temperature Ta(℃)
Fig.7 Relative Intensity vs.Angle
Fig.6 Forward Current Derating Curve
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z Label Explanation
CUS. PART NO: To be denominated.
CUSTOMER: To be denominated.
PART NO: Refer to P15
IV --- Luminous Intensity Code
VF --- Forward Voltage Code
WD --- Dominant Wavelength Code
LOT NO:
E
L
S 6 8 0001
A
B
C
D
E
F
A---E: For series number
B---L: Local
C---S:SMD
D---Year
F: Foreign
E---Month
F---SPEC.
PACKING QUANTITY OF BAG :
3000pcs for 150、170、110、155、115 series
4000pcs for 191 series
5000pcs for 192 series
DATE CODE：2006 06 08
G
H
I
G--- Year
H--- Month
I --- Day
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Release by
e
e
s
A
R
A
L
G
H
T
D
C
C
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-S115GECT
REV:A / 0
z Typical Electro-Optical Characteristics Curves
Fig.1 Green Relative Intensity vs. Wavelength
Fig.1 Orange Relative Intensity vs. Wavelength
z Reel Dimensions
Notes:
1. Taping Quantity : 3000pcs.
2. The tolerances unless mentioned is±0.1mm, Angle±0.5°, Unit : mm.
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z Package Dimensions Of Tape And Reel
Progressive direction
Polarity
Notes : All dimensions are in millimeters.
Moisture Resistant Packaging
Label
Reel
Label
Desiccant
Aluminum moistue-proof bag
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
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z Cleaning
½
½
½
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the
oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should
be enforced at proper output after confirming there is no problem.
z Suggest Soldering Pad Dimensions
0.90
0.10
C1
C2
a+
0.80
Direction of PWB camber
and go to reflow furnace
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● Suggest Sn/Pb IR Reflow Soldering Profile Condition:
● Suggest Pb-Free IR Reflow Soldering Profile Condition:
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z CAUTIONS
1.Application Limitation :
The LED’s described here are intended to be used for ordinary electronic equipment (such as office
equipment, communication equipment and household application).Consult PARA’s sales in advance
for information on application in which exceptional quality and reliability are required, particularly
when the failure or malfunction of the LED’s may directly jeopardize life or health (such as airplanes,
automobiles, traffic control equipment, life support system and safety devices).
2.Storage :
Before opening the package :
The LEDs should be kept at 5°C to 30°C or less and 85%RH or less. The LEDs should be used
within a year.
After opening the package :
The LEDs should be kept at 5°C to 30°C or less and 70%RH or less. The LEDs should be soldered
within 168 hours(7 days) after opening the package.
Please avoid rapid transitions in ambient temperature in high humidity environments where condensation
may occur.
3.Soldering(Standard Process) :
Do not apply any stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering condition.
Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
Soldering Iron : (Not recommended)
Temperature 300°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
Wave soldering :
Pre-heat 100°C Max, Pre-heat time 60s Max, Solder wave 260°C Max, Soldering time 5 sec. Max.
preformed consecutively cooling process is required between 1st and 2nd soldering processes.
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4. Lead-Free Soldering
For Reflow Soldering :
1、Pre-Heat Temp : 150-180℃,120sec.Max.
2、Soldering Temp : Temperature Of Soldering Pot Over 230℃,40sec.Max.
3、Peak Temperature : 260℃，5sec.
4、Reflow Repetition : 2 Times Max.
5、Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /0.5 Cu
For Soldering Iron (Not Recommended) :
1、Iron Tip Temp : 350℃ Max.
2、Soldering Iron : 30w Max.
3、Soldering Time : 3 Sec. Max. One Time.
For Dip Soldering :
1、Pre-Heat Temp : 150℃ Max. 120 Sec. Max.
2、Bath Temp : 265℃ Max.
3、Dip Time : 5 Sec. Max.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
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6.Reliability Test
Classification
Test Item
Test Condition
Reference Standard
Ta= Under Room Temperature As Per Data
Sheet Maximum Rating
*Test Time= 1000HRS
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
Operation Life
(-24HRS,+72HRS)*@20mA.
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90～95%
*Test Time= 1000HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
Endurance Test
High Temperature
Storage
Ta= 105±5℃
Test Time= 1000HRS (-24HRS,72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Low Temperature
Storage
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,72H RS)
JIS C 7021:B-12 (1982)
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
Temperature
Cycling
105±5℃
10mins
-55±5℃
10mins
100 Cycles
100 Cycles
IR-Reflow In-Board, 2 Times
105±5℃
10mins
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Thermal
Shock
-55℃±5℃
10mins
Environmental
Test
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
Solder
Resistance
Tsol= 260 ± 5℃
Dwell Time= 10 ± 1sec
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
Tsol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Solder ability
Coverage ≧95% of the dipped surface
JIS C 7021:A-2(1982)
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
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XXXX : Special specification for
customer
z PART NO. SYSTEM :
S 115X1X2 X X - X X X X
L –
T : Taping for 7 inch reel
TC : Taping for 13 inch reel
TH : IV half binning
TP : Wavelength binning
Lens color
C : Water Clear
W : White Diffused
T : Color Transparent
D : Color Diffused
G : Gap 570nm Green
Y : GaAsp 585 nm Yellow
E : GaAsp 620 nm Orange
SR : GaAlAs 634 nm Red
KG : AlInGap 570nm Super Green
KY : AlInGap 590nm Super Yellow
KF : AlInGap 605nm Super Amber
KR : AlInGap 630 nm Super Red
KD : AlInGap 639 nm Deep Red
LB : InGaN 470nm Blue
0 : Single chip
1 / 2 : Super thin single chip
5 / 6 : Dual chip
F : Three chip(Full color)
150 : 1206 1.1T Type
155 : 1210 1.1T Type
170 : 0805 0.8T Type
191 : 0603 0.6T Type
192 : 0603 0.4T Type
195 : 0603 0.6T Type
110 : 1206 1.0T Type
115 : 1206 1.0T Type
C : Top View Type
S : Side View Type
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