L-T670LGCT [PARALIGHT]
SURFACE MOUNT DEVICE LED;
| 型号： | L-T670LGCT |
| 厂家： | 
PARA LIGHT ELECTRONICS CO., LTD. |
| 描述： | SURFACE MOUNT DEVICE LED |
| 文件： | 总15页 (文件大小：314K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Release by
PARALIGHT DCC
PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan
Tel: 886-2-2225-3733
E-mail: para@para.com.tw
Fax: 886-2-2225-4800
http://www.para.com.tw
DATA SHEET
PART NO.: L-T670LGCT
REV: A / 5
CUSTOMER’S APPROVAL : _______________
DCC : ____________
PAGE 1 of 15
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
PARA-FOR-065
Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
ꢀ
Features
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Top view, Wide view angle, pure green color PLCC 2 package SMD LED .
EIA STD package, packing in 8mm tape on 7" diameter reels (ANSI/EIA-481-B-2001).
Compatible with automatic Pick & Place equipment.
Compatible with IR Reflow soldering and TTW soldering.
Pb free product and acceptable lead-free process.
Meet RoHS Green Product.
ꢀ
Application
ꢀ
ꢀ
Backlighting (Switches, keys, displays, illuminated advertising)
Emergency lighting / Signal and symbol luminaries.
ꢀ
Package Outline Dimensions
SIDE VIEW
TOP VIEW
3.50
0.15
c 0.80
2.40
3.20
-
POLARITY +
BACK VIEW
FRONT VIEW
0.75
0.75
Notes:
1. All dimensions are in millimeters.
±
2. Tolerance is
0.10mm (.004") unless otherwise noted.
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
PAGE 2 of 15
PARA-FOR-068
Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
ꢀ CHIP MATERIALS
ꢀ
ꢀ
ꢀ
Dice Material : InGaN
Light Color : Pure Green
Lens Color : Water Clear
ꢀ Absolute Maximum Ratings(Ta=25℃)
Symbol
PD
Parameter
Rating
75
Unit
mW
Power Dissipation
Peak Forward Current
IPF
100
mA
(1/10 Duty Cycle, 0.1ms Pulse Width)
Continuous Forward Current
Reverse Voltage
IF
20
5
mA
V
VR
ESD Electrostatic Discharge Threshold(HBM)Note A
1000
V
℃
℃
Topr Operating Temperature Range
-40 ~ + 85
-40 ~ + 85
Reflow Soldering:260
Tstg Storage Temperature Range
℃
(for 10seconds)
Tsld Soldering Temperature (One times MAX.)
℃
Hand Soldering:350
(for 3 seconds)
Note A :
HBM : Human Body Model. Seller gives no other assurances regarding the ability of to
withstand ESD.
ꢀ Electro-Optical Characteristics (Ta=25℃)
Parameter
Luminous Intensity
Viewing Angle
Symbol
IV
Min.
650
Typ.
1000
120
Max.
Unit
mcd
Deg
Test Condition
IF=20mA
2
θ1/2
Peak Emission
λp
520
nm
Measurement @Peak
Wavelength
Dominant Wavelength
Forward Voltage
Spectrum Radiation
Bandwidth
λ
525
3.0
nm
V
IF=20mA
D
VF
3.50
10
IF = 20mA
λ
25
nm
IF=20mA
VR = 5V
∆
Reverse Current
IR
μA
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
PAGE 3 of 15
PARA-FOR-068
Release by
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SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
Notes:
1. Luminous intensity is measured with a light sensor and filter combination that proximities
the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous
intensity.
3. Caution in ESD :
Static Electricity and surge damages the LED. It is recommended use a wrist band or
anti-electrostatic glove when handling the LED. All devices, equipment and machinery
must be properly grounded.
4. Major standard testing equipment by “Instrument System” Model : CAS140B Compact
Array Spectrometer and “KEITHLEY” Source Meter Model : 2400.
ꢀ Typical Electro-Optical Characteristics Curves
Fig.1 Relative Intensity vs. Wavelength
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DATE : 2009-10-31
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SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
ꢀ Typical Electro-Optical Characteristics Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
Fig.1 Forward Current vs.Forward Voltage
Fig.2 Luminous Intensity vs.Forward Current
1000
100
10
1
-60 -40 -20 -0 20 40 60 80 100
Ambient Temperature Ta(
℃
)
Fig.4 Luminous Intensity vs.Ambient Temperature
Fig.3Relative Luminous Intensity vs.Forward Current
0° 10° 20°
50
30°
40
30
20
40°
1.0
0.9
50°
0.8
60°
10
0
70°
80°
90°
0.7
0
20
Ambient Temperature Ta(
Fig.5 Forward Current Derating Curve
40
60
80 100
0.5 0.3 0.1 0.2 0.4 0.6
℃)
Fig.6 Relative Intensity vs.Angle
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
PAGE 5 of 15
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Release by
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SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
ꢀ
Bin Code List
Luminous Intensity(IV), Unit:mcd@20mA
Forward Voltage(VF), Unit:V@20mA
Bin Code
P20
Min
650
Max
800
Bin Code
Min
2.9
3.0
3.1
3.2
3.3
3.4
Max
3.0
3.1
3.2
3.3
3.4
3.5
14
15
16
17
18
19
P21
800
1000
1250
1550
P22
1000
1250
P23
Tolerance of each bin are±10%
Tolerance of each bin are±0.1Volt
Dominant Wavelength (Hue),Unit: nm@20mA
Bin Code
AP
Min
520
525
Max
525
530
AQ
Tolerance of each bin are±1nm
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
PAGE 6 of 15
PARA-FOR-068
Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
ꢀ Label Explanation
CUS. PART NO: To be denominated.
CUSTOMER: To be denominated.
PART NO: Refer to P15
P22--- Luminous Intensity Code
15--- Forward Voltage Code
AQ--- Dominant Wavelength
LOT NO:
E L S 7 8 0001
A
B
C
D
E
F
A---E: For series number
B---L: Local F: Foreign
C---S: PLCC SMD
D---Year
E---Month
F---SPEC.
PACKING QUANTITY OF BAG :
2000pcs for T670 series
2000pcs for T650 series
2000pcs for S020 series
DATE CODE：2007 08 29
G
H
I
G--- Year
H--- Month
I --- Day
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
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Release by
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SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
ꢀ Reel Dimensions
Notes:
1. Taping Quantity : 2000pcs
2. The tolerances unless noted is±0.1mm, Angle±0.5°, Unit: mm.
ꢀ Suggest Soldering Pad Dimensions
1.6
1.8
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
PAGE 8 of 15
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Release by
PARALIGHT DCC
SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
ꢀ Package Dimensions Of Tape And Reel
4.00±0.10
(.157±.004)
*0.23± 0.03
(.009± .001)
2.00±0.05
(.079±.002)
4.00±0.10
(.157±.004)
*2.03+0.10
(.080+.004)
Notes: All dimensions are in millimeters.
ꢀ Packaging Of Electronic Components On Continuous Tapes
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
PAGE 9 of 15
PARA-FOR-068
Release by
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SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
ꢀ
Moisture Resistant Packaging
Label
Reel
Label
Desiccant
Aluminum moistue-proof bag
5
5
2
Label
Box
435
Carton
Notes : One reel in a bag, one bag in a inner box, ten inner boxes in a carton. Unit : mm.
ꢀ Cleaning
ꢀ
ꢀ
If cleaning is required , use the following solutions for less than 1 minute and less than 40℃.
Appropriate chemicals: isopropyl alcohol. (When using other solvents, it should be confirmed
beforehand whether the solvents will dissolve the package and the resin or not.)
Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as
ultrasonic power and the assembled condition. Before cleaning, a pre-test should be
confirm whether any damage to the LEDS will occur.
ꢀ
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
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Release by
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SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
●
Suggest Sn/Pb IR Reflow Soldering Profile Condition:
●
Suggest Pb-Free IR Reflow Soldering Profile Condition:
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
PAGE 11 of 15
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SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
ꢀ CAUTIONS
1. Static Electricity:
* Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
* All devices, equipment and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts the LEDs.
* When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged
LEDs by a light-on test or a VF test at a lower current (blew 1mA is recommended).
* Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases,
the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria: (VF>2.0V,at IF=0.5m A )
2. Storage :
* Before opening the package :
The LEDs should be kept at 30°C or less and 85%RH or less. When storing the LEDs, moisture
proof packaging with absorbent material (silica gel) is recommended.
* After opening the package :
The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within
168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in
moisture proof packages, such as sealed containers with packages of moisture absorbent material
(silica gel). It is also recommended to return the LEDs to the original moisture poof bag and to
reseal the moisture proof bag again.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should e performed using the following conditions.
Baking treatment: more than 24hours at 65±5℃.
* Please avoid rapid transitions in ambient temperature in high humidity environments where
condensation may occur.
3. Soldering:
Do not apply any stress to the LED lens during soldering while the LED is at high temperature.
Recommended soldering condition.
* Reflow Soldering :
Pre-heat 120~150°C, 120sec. MAX., Peak temperature : 240°C Max. Soldering time : 10 sec Max.
* Soldering Iron : (Not recommended)
Temperature350°C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron :
20W Max. use SN60 solder of solder with silver content and don’t to touch LED lens when soldering.
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
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SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
4. Lead-Free Soldering
For Reflow Soldering :
、
1 Pre-Heat Temp: 150-180℃,120sec.Max.
、
2 Soldering Temp: Temperature Of Soldering Pot Over 240℃,40sec.Max.
、
，
3 Peak Temperature: 260℃ 10sec.
、
4 Reflow Repetition: 2 Times Max.
、
5 Suggest Solder Paste Formula : 93.3 Sn/3.1 Ag/3.1 Bi/0.5 Cu
For Soldering Iron (Not Recommended) :
、
1 Iron Tip Temp: 350℃ Max.
、
2 Soldering Iron: 30w Max.
、
3 Soldering Time: 3 Sec. Max. One Time.
5. Drive Method
Circuit model A
Circuit model B
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
6. Reliability
1、Criteria For Judging The Damage
Criteria for Judgement
MIN. Max.
Item
Symbol
Test Conditions
Forward Voltage
Reverse Current
VF
IR
IF=20mA
VR=5V
-
U.S.L.*)×1.1
U.S.L.*)×2.0
-
-
Luminous Intensity
IV
IF=20mA
L.S.L**)×0.7
*)U.S.L.: Upper Standard Level
**) L.S.L: Lower Standard Level
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
PAGE 13 of 15
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Release by
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SURFACE MOUNT DEVICE LED
Part No. : L-T670LGCT
REV: A / 5
2、Test Items And Results
Number
of
Damaged
Reference
Test Item
Test Condition
Standard
Note
Tsld=260℃,10sec.
(Pre treatment 30
℃,70%,168hrs)
Resistance to Soldering Heat
(Reflow Soldering)
JEITA
ED-4701300 301
2times
1time
0/50
0/50
JEITA
ED-4701300 303
Tsld=215℃,3sec.
(Lead Solder)
Solder ability (Reflow Soldering)
Thermal Shock
over 95%
JEITA
ED-4701300 307
-40℃ ~ 100℃
30min. 30min.
100cycles
0/50
0/50
JEITA
-40℃ ~ 25℃~100℃~25℃
Temperature Cycle
100cycles
1000hrs.
ED-4701100 105 30min. 5min. 30min. 5min
JEITA
ED-4701200-
201
High Temperature Storage
Ta=100℃
0/50
0/50
JEITA
ED-4701100 103
Temperature Humidity Storage
Low Temperature Storage
Ta=60℃,RH=90%
Ta=-40℃
1000hrs.
1000hrs.
1000hrs.
JEITA
ED-4701200 202
0/50
0/50
Steady State Operating Life
Condition
Ta=25℃,IF=20mA
Steady State Operating Life
of High Temperature
500hrs.
500hrs.
500hrs.
Ta=85℃,IF=5mA
Ta=60℃,RH=90%,IF=15mA
Ta=-30℃,IF=20mA
0/50
0/50
0/50
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
100~2000~100HzSweep
4min.200m/s2
JEITA
48min
Vibration
0/50
ED-4701400 403
3direction,4cycles
1time
1time
Substrate Bending
Stick
JEITA ED-4702
JEITA ED-4702
3mm,5±1sec
5N,10±1sec
0/50
0/50
7.Others:
The appearance and specifications of the product may be modified for improvement without notice.
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
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Part No. : L-T670LGCT
REV: A / 5
XXXX : Special specification for
ꢀ PART NO. SYSTEM :
L – T 67 0 X X T - X X X X
customer
T : Taping for 7 inch reel
TC : Taping for 13 inch reel
Lens color
C : Water Clear
W : White Diffused
T : Color Transparent
D : Color Diffused
KY : 9mil AlInGap 590nm Super Yellow
KR : 9mil AlInGap 630 nm Super Red
TE : 14mil AlInGap 624 nm Super Red
TY: 14mil AlInGap590 nm Super Yellow
LB : InGaN ITO rough 470nm Blue
LG : InGaN ITOrough520nm Green
W : InGaN + YAG White color
……
0 : Single chip
1/2 : Super thin single chip
5/6 : Dual chip
F : Three chip(Full color)
650 :
670 :
020 :
3020 1.3T TYPE
3528 1.9T TYPE
3812 0.6T TYPE
C : PCB Top View Type
T :PLCC Top View Type
S : Side View Type
DRAWING NO. : DS-7A-07-0005
DATE : 2009-10-31
PAGE 15 of 15
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