EPF8082S [PCA]
10/100 Base-X Module for Level One LXT 974 Multi-Port Applications; 对于第一级LXT 974多端口应用的10/100 Base -X模块
| 型号： | EPF8082S |
| 厂家： | 
PCA ELECTRONICS INC. |
| 描述： | 10/100 Base-X Module for Level One LXT 974 Multi-Port Applications |
| 文件： | 总1页 (文件大小：48K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
10/100 Base-X Module for
Level One LXT 974
Multi-Port Applications
E L E C T R O N I C S I N C .
EPF8082S
• Robust design allows for toughest soldering processes •
• Guaranteed to operate with 8 mA DC bias at 70°C •
• Complies with or exceeds IEEE 802.3, 10 BT/100 BX Standards •
Electrical Parameters @ 25° C
OCL
@ 70°C
Insertion Loss
Return Loss
(dB Min.)
Crosstalk
(dB Min.)
(dB Max.)
0.1-80
MHz
100
MHz
150
MHz
1-30
MHz
60
MHz
100
MHz
100 KHz, 0.1 Vrms
8 mA DC Bias
0.1-100
MHz
Media Side
Xmit
-1
Xmit
-1
Rcv
-1
Xmit
-3
Rcv
-3
Xmit
-18
Rcv
-18
Xmit
-12
Rcv
-12
Xmit
-10
Rcv
-10
Rcv
-1
-35
350µH
•
Isolation : 1500 Vrms
•
Impedance : 100 Ω
•
Rise Time : 3.0 nS Max.
Schematic
Receive Channel
Transmit Channel
1:1
2 :1
1, 6, 11, 16
40, 35, 30, 25
39, 34, 29, 24
3, 8, 13, 18
38, 33, 28, 23
37, 32, 27, 22
36, 31, 26, 21
4, 9, 14, 19
2, 7, 12, 17
5, 10, 15, 20
Chip
Side
Media
Side
Chip
Side
Media
Side
Package
Dimensions
A
(Millimeters)
Max. Nom.
(Inches)
Max. Nom. Min.
1.110 1.130
Dim.
Min.
J
N
A
B
C
D
E
F
G
H
I
28.19 28.70
11.94 12.45
5.97 6.48
.470
.235
.950
.008
.050
.580
.016
.008
.085
0°
.490
.255
Typ.
.012
Typ.
.600
.022
.012
Typ.
8°
40
Solder Pad Layout
21
20
PCA
EPF8082S
Date Code
P
24.13 Typ.
B
Q
.203
1.27
.305
Typ.
1
14.73 15.24
.406
.203
2.16
0°
.559
.305
Typ.
8°
M
D
J
K
L
.025
.045
.635
1.14
M
N
P
Q
.030
.050
.090
.670
.762
1.27
I
K
C
2.29
17.02
E
H
L
F
G
CSF8082S Rev. - 10/9/97
PCA ELECTRONICS, INC.
16799 SCHOENBORN ST.
NORTH HILLS, CA 91343
TEL: (818) 892-0761
FAX: (818) 894-5791
http://www.pca.com
Product performance is limited to specified parameters. Data is subject to change without prior notice.
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