74HC423DB [NXP]

Dual retriggerable monostable multivibrator with reset; 双可再触发单稳多谐振荡器与重置
74HC423DB
型号: 74HC423DB
厂家: NXP    NXP
描述:

Dual retriggerable monostable multivibrator with reset
双可再触发单稳多谐振荡器与重置

振荡器
文件: 总14页 (文件大小:107K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
DATA SHEET  
For a complete data sheet, please also download:  
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications  
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information  
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines  
74HC/HCT423  
Dual retriggerable monostable  
multivibrator with reset  
1998 Jul 08  
Product specification  
Supersedes data of December 1990  
File under Integrated Circuits, IC06  
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
(CEXT). The external resistor and capacitor are normally  
connected as shown in Fig.6.  
FEATURES  
DC triggered from active HIGH or active LOW inputs  
Once triggered, the basic output pulse width may be  
extended by retriggering the gated active LOW-going edge  
input (nA) or the active HIGH-going edge input (nB). By  
repeating this process, the output pulse period  
Retriggerable for very long pulses up to 100% duty  
factor  
Direct reset terminates output pulse  
Schmitt-trigger action on all inputs except for the reset  
input  
(nQ = HIGH, nQ = LOW) can be made as long as desired.  
When nRD is LOW, it forces the nQ output LOW, the  
nQ output HIGH and also inhibits the triggering.  
Output capability: standard (except for nREXT/CEXT  
ICC category: MSI  
)
Figures 7 and 8 illustrate pulse control by reset. The basic  
output pulse width is essentially determined by the values  
of the external timing components REXT and CEXT  
.
GENERAL DESCRIPTION  
For pulse widths, when CEXT < 10 000 pF, see Fig.9.  
When CEXT > 10 000 pF, the typical output pulse width is  
defined as:  
tW = 0.45 × REXT × CEXT (typ.),  
where, tW = pulse width in ns;  
The 74HC/HCT423 are high-speed Si-gate CMOS devices  
and are pin compatible with low power Schottky TTL  
(LSTTL). They are specified in compliance with JEDEC  
standard no. 7A.  
R
EXT = external resistor in k;  
The 74HC/HCT423 are dual retriggerable monostable  
multivibrators with output pulse width control by two  
methods. The basic pulse time is programmed by  
selection of an external resistor (REXT) and capacitor  
CEXT = external capacitor in pF.  
Schmitt-trigger action in the nA and nB inputs, makes the  
circuit highly tolerant to slower input rise and fall times.  
The “423” is identical to the “123” but cannot be triggered  
via the reset input.  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns  
TYPICAL  
SYMBOL  
PARAMETER  
propagation delay  
CONDITIONS  
UNIT  
HC  
HCT  
t
PHL/ tPLH  
CL = 15 pF; VCC = 5 V;  
REXT = 5 k; CEXT = 0 pF  
nA, nB to nQ, nQ  
nRD to nQ, nQ  
25  
20  
3.5  
75  
26  
22  
ns  
ns  
pF  
ns  
CI  
tW  
input capacitance  
3.5  
75  
minimum output pulse width nQ, nQ notes 1 and 2  
Notes  
1. CPD is used to determine the dynamic power dissipation (PD in µW):  
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) + 0.75 × CEXT × VCC2 × fo + D × 16 × VCC where:  
fi = input frequency in MHz  
fo = output frequency in MHz  
D = duty factor in %  
(CL × VCC2 × fo) = sum of outputs  
CL = output load capacitance in pF  
VCC = supply voltage in V  
CEXT = timing capacitance in pF  
2. For HC the condition is VI = GND to VCC  
For HCT the condition is VI = GND to VCC 1.5 V  
1998 Jul 08  
2
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
74HC423N;  
74HCT423N  
DIP16  
SO16  
plastic dual in-line package; 16 leads (300 mil); long body  
SOT38-1  
74HC423D;  
74HCT423D  
plastic small outline package; 16 leads; body width 3.9 mm;  
low stand-off height  
SOT109-1  
PIN DESCRIPTION  
PIN NO.  
SYMBOL  
1A, 2A  
NAME AND FUNCTION  
1, 9  
2, 10  
3, 11  
4, 12  
7
trigger inputs (negative-edge triggered)  
trigger inputs (positive-edge triggered)  
direct reset action (active LOW)  
outputs (active LOW)  
1B, 2B  
1RD, 2RD  
1Q, 2Q  
2REXT/CEXT  
GND  
external resistor/capacitor connection  
ground (0 V)  
8
13, 5  
14, 6  
15  
1Q, 2Q  
outputs (active HIGH)  
1CEXT, 2CEXT  
1REXT/CEXT  
VCC  
external capacitor connection  
external resistor/capacitor connection  
positive supply voltage  
16  
Fig.1 Pin configuration.  
Fig.2  
Fig.3 IEC logic symbol.  
1998 Jul 08  
3
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
Fig.4 Functional diagram.  
FUNCTION TABLE  
nRD  
INPUTS  
nA  
OUTPUTS  
nB  
nQ  
nQ  
L
X
X
H
H
X
H
X
L
X
X
L
L
H
L(2)  
L(2)  
H(2)  
H(2)  
H
Notes  
1. H = HIGH voltage level  
L = LOW voltage level  
X = don’t care  
= LOW-to-HIGH transition  
= HIGH-to-LOW transition  
= one HIGH level output pulse  
= one LOW level output pulse  
2. If the monostable was triggered before this condition was established, the pulse will continue as programmed.  
1998 Jul 08  
4
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
It is recommended to ground pins 6 (2CEXT) and 14  
(1CEXT) externally to pin 8 (GND).  
Fig.5 Logic diagram.  
Fig.6 Timing component connections.  
1998 Jul 08  
5
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
DC CHARACTERISTICS FOR 74HC  
For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”.  
Output capability: standard (except for nREXT /CEXT  
ICC category: MSI  
)
AC CHARACTERISTICS FOR 74HC  
GND = 0 V; tr = tf = 6 ns; CL = 50 pF  
Tamb (°C)  
TEST CONDITIONS  
VCC WAVEFORMS/  
74HC  
SYMBOL  
PARAMETER  
UNIT  
ns  
+25  
40 to +85 40 to +125  
(V)  
NOTES  
min. typ. max min max min. max.  
t
t
t
PHL/ tPLH propagation delay  
80  
29  
23  
66  
24  
19  
19  
7
255  
51  
320  
64  
385  
77  
2.0 CEXT = 0 pF;  
nA, nB to nQ, nQ  
REXT = 5 kΩ  
4.5  
43  
54  
65  
6.0  
PHL/ tPLH propagation delay  
nRD to nQ, nQ  
215  
43  
270  
54  
325  
65  
ns  
2.0 CEXT = 0 pF;  
REXT = 5 kΩ  
4.5  
37  
46  
55  
6.0  
2.0  
4.5  
6.0  
THL/ tTLH output transition time  
75  
95  
110  
22  
ns  
15  
19  
6
13  
16  
19  
tW  
tW  
tW  
trigger pulse width  
nA = LOW  
100 11  
125  
25  
150  
30  
ns  
ns  
ns  
2.0 Fig.7  
4.5  
20  
17  
4
3
21  
26  
6.0  
trigger pulse width  
nB = HIGH  
100 17  
125  
25  
150  
30  
2.0 Fig.7  
4.5  
20  
17  
6
5
21  
26  
6.0  
reset pulse width  
nRD = LOW  
100 14  
125  
25  
150  
30  
2.0 Fig.8  
4.5  
20  
17  
5
4
21  
26  
6.0  
tW  
output pulse width  
nQ = HIGH  
450  
µs  
5.0 CEXT = 100 nF;  
REXT = 10 k;  
nQ = LOW  
Figs 7 and 8  
tW  
output pulse width  
nQ = HIGH  
nQ = LOW  
75  
ns  
5.0  
CEXT = 0 pF;  
REXT = 5 k;  
note 1;  
Figs 7 and 8  
trt  
retrigger time  
nA, nB  
110  
ns  
5.0 CEXT = 0 pF;  
REXT = 5 k;  
note 2; Fig. 7  
REXT  
CEXT  
external timing resistor  
10  
2
1000 −  
kΩ  
2.0 Fig.9  
5.0  
1000  
external timing capacitor no limits  
pF  
5.0 Fig.9; note 3  
1998 Jul 08  
6
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
DC CHARACTERISTICS FOR 74HCT  
For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”.  
Output capability: standard (except for nREXT/CEXT  
ICC category: MSI  
)
Note to HCT types  
The value of additional quiescent supply current (ICC) for a unit load of 1 is given in the family specifications.  
To determine ICC per input, multiply this value by the unit load coefficient shown in the table below.  
INPUT  
UNIT LOAD COEFFICIENT  
nA, nB  
nRD  
0.35  
0.50  
AC CHARACTERISTICS FOR 74HCT  
GND = 0 V; tr = tf = 6 ns; CL = 50 pF  
Tamb (°C)  
TEST CONDITIONS  
VCC WAVEFORMS/  
74HCT  
SYMBOL PARAMETER  
UNIT  
+25  
40 to +85 40 to +125  
(V)  
NOTES  
min. typ. max. min. max. min. max.  
t
PHL/ tPLH propagation delay  
30  
26  
7
51  
48  
15  
64  
60  
19  
77  
72  
22  
ns  
4.5 CEXT = 0 pF;  
nA, nB to nQ, nQ  
REXT = 5 kΩ  
tPHL/ tPLH propagation delay  
nRD to nQ, nQ  
ns  
ns  
ns  
ns  
ns  
µs  
4.5 CEXT = 0 pF;  
REXT = 5 kΩ  
t
THL/ tTLH output transition time  
4.5  
tW  
tW  
tW  
tW  
trigger pulse width  
nA = LOW  
20  
20  
20  
5
25  
25  
25  
30  
30  
30  
4.5 Fig.7  
4.5 Fig.7  
4.5 Fig.8  
trigger pulse width  
nB = HIGH  
5
reset pulse width  
nRD = LOW  
7
output pulse width  
nQ = HIGH  
450  
5.0 CEXT = 100 nF;  
REXT = 10 k;  
nQ = LOW  
Figs 7 and 8  
tW  
output pulse width  
nQ = HIGH  
nQ = LOW  
75  
ns  
ns  
5.0 CEXT = 0 pF;  
REXT = 5 k;  
note 1; Figs 7 and  
8
trt  
retrigger time  
nA, nB  
110  
5.0 CEXT = 0 pF;  
REXT = 5 k;  
note 2; Fig.7  
REXT  
CEXT  
external timing resistor  
2
1000  
kΩ  
5.0 Fig.9  
external timing  
capacitor  
no limits  
pF  
5.0 Fig.9; note 3  
1998 Jul 08  
7
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
Notes  
1. For other REXT and CEXT combinations see Fig.9.  
If CEXT > 10 pF, the next formula is valid:  
tW = K × REXT × CEXT (typ.)  
where: tW  
REXT = external resistor in k; CEXT = external capacitor in pF;  
= constant = 0.45 for VCC = 5.0 V and 0.55 for VCC = 2.0 V.  
The inherent test jig and pin capacitance at pins 15 and 7 (nREXT/CEXT) is approximately 7 pF.  
2. The time to retrigger the monostable multivibrator depends on the values of REXT and CEXT  
= output pulse width in ns;  
K
.
The output pulse width will only be extended when the time between the active-going edges of the trigger input pulses  
meets the minimum retrigger time.  
If CEXT > 10 pF, the next formula (at VCC = 5.0 V) for the set-up time of a retrigger pulse is valid:  
trt = 30 + 0.19 × REXT × CEXT0.9 + 13 × REXT1.05 (typ.)  
where, trt  
= retrigger time in ns;  
CEXT = external capacitor in pF;  
REXT = external resistor in k.  
The inherent test jig and pin capacitance at pins 15 and 7 (nREXT/CEXT) is 7 pF.  
3. When the device is powered-up, initiate the device via a reset pulse, when CEXT < 50 pF.  
AC WAVEFORMS  
Fig.7 Output pulse control using retrigger pulse; nRD = HIGH.  
Fig.8 Output pulse control using reset input nRD; nA = LOW.  
1998 Jul 08  
8
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
Fig.9 Typical output pulse width as a function of the external capacitor values at VCC = 5.0 V and Tamb = 25 °C.  
Fig.10 Typical ‘K’ factor; external capacitance = 10 nF, external resistance = 10 kto 100 kand Tamb = 25 °C.  
1998 Jul 08  
9
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
APPLICATION INFORMATION  
Power-up considerations  
When the monostable is powered-up it may produce an output pulse, with a pulse width defined by the values of RX and  
CX, this output pulse can be eliminated using the circuit shown in Fig.11.  
Fig.11 Power-up output pulse elimination circuit.  
Power-down considerations  
A large capacitor (CX) may cause problems when powering-down the monostable due to the energy stored in this  
capacitor. When a system containing this device is powered-down or a rapid decrease of VCC to zero occurs, the  
monostable may substain damage, due to the capacitor discharging through the input protection diodes. To avoid this  
possibility, use a damping diode (DX) preferably a germanium or Schottky-type diode able to withstand large current  
surges and connect as shown in Fig.12.  
Fig.12 Power-down protection circuit.  
1998 Jul 08  
10  
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
PACKAGE OUTLINES  
DIP16: plastic dual in-line package; 16 leads (300 mil); long body  
SOT38-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
16  
9
M
H
pin 1 index  
E
1
8
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
2
(1)  
(1)  
Z
1
w
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.  
max.  
min.  
max.  
1.40  
1.14  
0.53  
0.38  
0.32  
0.23  
21.8  
21.4  
6.48  
6.20  
3.9  
3.4  
8.25  
7.80  
9.5  
8.3  
4.7  
0.51  
3.7  
2.54  
0.10  
7.62  
0.30  
0.254  
0.01  
2.2  
0.021  
0.015  
0.013  
0.009  
0.86  
0.84  
0.32  
0.31  
0.055  
0.045  
0.26  
0.24  
0.15  
0.13  
0.37  
0.33  
inches  
0.19  
0.020  
0.15  
0.087  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-10-02  
95-01-19  
SOT38-1  
050G09  
MO-001AE  
1998 Jul 08  
11  
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
D
E
A
X
c
y
H
v
M
A
E
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
e
w
M
detail X  
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
10.0  
9.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.050  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.39  
0.014 0.0075 0.38  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.020  
0.028  
0.012  
inches  
0.069  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-01-23  
97-05-22  
SOT109-1  
076E07S  
MS-012AC  
1998 Jul 08  
12  
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
Several techniques exist for reflowing; for example,  
SOLDERING  
Introduction  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
WAVE SOLDERING  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “Data Handbook IC26; Integrated Circuit Packages”  
(order code 9398 652 90011).  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
DIP  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
SOLDERING BY DIPPING OR BY WAVE  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
The package footprint must incorporate solder thieves at  
the downstream end.  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
REPAIRING SOLDERED JOINTS  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
REPAIRING SOLDERED JOINTS  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
SO  
REFLOW SOLDERING  
Reflow soldering techniques are suitable for all SO  
packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
1998 Jul 08  
13  
Philips Semiconductors  
Product specification  
Dual retriggerable monostable  
multivibrator with reset  
74HC/HCT423  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1998 Jul 08  
14  

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74HC42D

BCD to decimal decoder (1-of-10)Production
NEXPERIA

74HC42D,652

74HC(T)42 - BCD to decimal decoder (1-of-10) SOP 16-Pin
NXP

74HC42D-T

BCD-To-Decimal Decoder
ETC

74HC42DB

BCD to decimal decoder 1-of-10
NXP

74HC42N

BCD to decimal decoder 1-of-10
NXP

74HC42PW

BCD to decimal decoder 1-of-10
NXP

74HC42PW-T

IC HC/UH SERIES, DECIMAL DECODER/DRIVER, INVERTED OUTPUT, PDSO16, Decoder/Driver
NXP