935153030112
更新时间：2024-09-18 19:12:23
品牌：NXP
描述：IC VERTICAL DEFLECTION IC, PSIP9, POWER, PLASTIC, SOT-131-2, SIP-9, Deflection IC
概述
规格参数
数据手册935153030112 概述
IC VERTICAL DEFLECTION IC, PSIP9, POWER, PLASTIC, SOT-131-2, SIP-9, Deflection IC 偏转集成电路
935153030112 规格参数
| 是否Rohs认证： | 符合 | 生命周期： | Obsolete |
| 零件包装代码： | SIP | 包装说明： | POWER, PLASTIC, SOT-131-2, SIP-9 |
| 针数： | 9 | Reach Compliance Code： | unknown |
| 风险等级： | 5.83 | 消隐输出： | NO |
| 商用集成电路类型： | VERTICAL DEFLECTION IC | JESD-30 代码： | R-PSIP-T9 |
| 长度： | 23.8 mm | 功能数量： | 1 |
| 端子数量： | 9 | 封装主体材料： | PLASTIC/EPOXY |
| 封装代码： | SIP | 封装形状： | RECTANGULAR |
| 封装形式： | IN-LINE | 峰值回流温度（摄氏度）： | 245 |
| 认证状态： | Not Qualified | 座面最大高度： | 14.2 mm |
| 最大供电电压 (Vsup)： | 60 V | 最小供电电压 (Vsup)： | 10 V |
| 表面贴装： | NO | 端子形式： | THROUGH-HOLE |
| 端子节距： | 2.54 mm | 端子位置： | SINGLE |
| 处于峰值回流温度下的最长时间： | 40 | 宽度： | 4.4 mm |
| Base Number Matches： | 1 |
935153030112 数据手册
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DATA SHEET
TDA3653B
TDA3653C
Vertical deflection and guard circuit
(90˚)
March 1991
Product specification
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Vertical deflection and guard circuit
(90˚)
TDA3653B
TDA3653C
GENERAL DESCRIPTION
The TDA3653B/C is a vertical deflection output circuit for drive of various deflection systems with currents up to
1.5 A peak-to-peak.
Features
• Driver
• Output stage
• Thermal protection and output stage protection
• Flyback generator
• Voltage stabilizer
• Guard circuit
QUICK REFERENCE DATA
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply (note 1)
Supply voltage range
pin 9
pin 6
VP = V9-4
10
−
−
40
V
V
V6-4
−
60
Output (pin 5)
Peak output voltage during flyback
Output current
V5-4M
I5(p-p)
Tj
−
−
−
60
V
A
1.2
1.5
Operating junction temperature range
Thermal resistance junction to mounting base
(SOT110B)
−25
−
+150
°C
Rth j-mb
Rth j-mb
−
−
10
−
−
K/W
K/W
(SOT131)
3.5
Note to the quick reference data
1. The maximum supply voltage should be chosen such that during flyback the voltage at pin 5 does not exceed 60 V.
PACKAGE OUTLINES
TDA3653B: 9-lead SIL; plastic (SOT110B); SOT110-1; 1996 November 25.
TDA3653C: 9-lead SIL; plastic power (SOT131); SOT131-2 November 25.
March 1991
2
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
Fig.1 Block diagram.
March 1991
3
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
FUNCTIONAL DESCRIPTION
Output stage and protection circuit
Pin 5 is the output pin. The supply for the output stage is fed to pin 6 and the output stage ground is connected to pin 4.
The output transistors of the class-B output stage can each deliver 0.75 A maximum.
The maximum voltage for pin 5 and 6 is 60 V.
The output power transistors are protected such that their operation remains within the SOAR area. This is achieved by
the co-operation of the thermal protection circuit, the current-voltage detector, the short-circuit protection and the special
measures in the internal circuit layout.
Driver and switching circuit
Pin 1 is the input for the driver of the output stage. The signal at pin 1 is also applied via external resistors to pin 3 which
is the input of a switching circuit. When the flyback starts, this switching circuit rapidly turns off the lower output stage
and so limits the turn-off dissipation. It also allows a quick start of the flyback generator.
External connection of pin 1 to pin 3 allows for applications in which the pins are driven separately.
Flyback generator
During scan the capacitor connected between pins 6 and 8 is charged to a level which is dependent on the value of the
resistor at pin 8 (see Fig.1).
When the flyback starts and the voltage at the output pin (pin 5) exceeds the supply voltage, the flyback generator is
activated.
The supply voltage is then connected in series, via pin 8, with the voltage across the capacitor during the flyback period.
This implies that during scan the supply voltage can be reduced to the required scan voltage plus saturation voltage of
the output transistors.
The amplitude of the flyback voltage can be chosen by changing the value of the external resistor at pin 8.
It should be noted that the application is chosen such that the lowest voltage at pin 8 is > 2.5 V, during normal operation.
Guard circuit
When there is no deflection current and the flyback generator is not activated, the voltage at pin 8 reduces to less than
1.8 V. The guard circuit will then produce a DC voltage at pin 7, which can be used to blank the picture tube and thus
prevent screen damage.
Voltage stabilizer
The internal voltage stabilizer provides a stabilized supply of 6 V to drive the output stage, which prevents the drive
current of the output stage being affected by supply voltage variations.
March 1991
4
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134);
pins 4 and 2 externally connected to ground.
PARAMETER
Supply voltage (pin 9)
SYMBOL
VP = V9-4
MIN.
MAX.
UNIT
−
−
−
−
−
40
60
60
VP
5.8
V
V
V
V
V
Supply voltage output stage (pin 6)
Output voltage (pin 5)
Input voltage (pins 1 and 3)
External voltage at pin 7
Peak output current (pin 5)
repetitive
V6-4
V5-4
V1; 3-2
V7-2
± I5RM
± I5SM
−
−
0.75
1.5
A
A(1)
non-repetitive
Peak output current (pin 8)
repetitive
I8RM
± I8SM
Ptot
0.85
0.75
1.5
A
A(1)
non-repetitive
−
Total power dissipation
Storage temperature range
Operating ambient temperature range
Operating junction temperature range
see Fig.2
+150
see Fig.2
+150
Tstg
Tamb
Tj
−55
−25
°C
°C
Note
1. Non-repetitive duty factor maximum 3.3%.
Fig.3 Quiescent current I4 as a function of supply
voltage VP.
Fig.2 Power derating curves (for SOT110B).
March 1991
5
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
CHARACTERISTICS
VP = V9-4 = 26 V; Tamb = 25 °C; pins 2 and 4 externally connected to ground; unless otherwise specified
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply
Supply voltage (pin 9)
Supply voltage (pin 6)
Total supply current
(pin 6 and pin 9)
note 1
note 1
VP = V9-4
10
−
−
40
V
V
V6-4
−
60
note 2
IP = I6 + I9
34
25
50
40
85
65
mA
mA
Quiescent current (pin 4)
Variation of quiescent current
with temperature
see Fig.3
I4
∆I4
−
−0.04
−
mA/K
Output current
Output current (pin 5)
(peak-to-peak value)
Output current flyback generator
(pin 8)
I5(p-p)
−
−
−
1.2
0.7
0.6
1.5
A
A
A
−I8
0.85
0.75
Output current flyback generator
(pin 8)
I8
Output voltage
Peak voltage during flyback
Saturation voltage to supply
at −I5 = 0.75 A
V5-4M
−
−
60
V
V6-5sat
V5-6sat
V6-5sat
V5-6sat
−
−
−
−
2.5
2.5
2.2
2.3
3.0
3.0
2.7
2.8
V
V
V
V
at I5 = 0.75 A
note 3
note 3
at −I5 = 0.60 A
at I5 = 0.60 A
Saturation voltage to ground
at I5 = 0.75 A
V5-4sat
V5-4sat
−
−
2.3
2.1
2.7
2.4
V
V
at I5 = 0.60 A
Flyback generator
Saturation voltage
at −I8 = 0.85 A
V9-8sat
V8-9sat
V9-8sat
V8-9sat
V5-9
−
1.6
2.3
1.4
2.2
−
2.1
2.8
1.9
2.7
−
V
at I8 = 0.75 A
note 3
note 3
−
V
at −I8 = 0.70 A
−
V
at I8 = 0.60 A
−
V
Flyback generator active if:
Leakage current at pin 8
4.0
−
V
−I8
5.0
100
µA
Input
Input current (pin 1)
I5 = 0.75 A
I5 = 0.75 A
I1
−
−
0.33
1.5
0.55
2.4
mA
V
Input voltage during scan (pin 1)
Input voltage during scan (pin 3)
pins 1 and 3 not connected
V1-2
V3-2
0.8
−
VP
V
March 1991
6
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
PARAMETER
Input current during scan (pin 3)
pins 1 and 3 not connected
pins 1 and 3 connected
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
I3
0.03
−
−
−
mA
I3
−
0.21
6.7
mA
kΩ
Input resistance (pin 3)
R3
3.9
−
5.3
−
Input voltage during flyback (pin 1)
Input voltage during flyback (pin 3)
V1-2
V3-2
250
250
mV
mV
−
−
Guard circuit
Output voltage (pin 7)
loaded with 100 kΩ
note 4
note 5
V7-2
V7-2
Ri7
4.4
5.1
5.8
5.3
1.7
V
loaded with 0.5 mA
3.6
4.4
V
Internal series resistance of pin 7
Guard circuit active if
0.95
1.35
kΩ
V8-2 is lower than
V8-2
−
−
1.8
V
General data
Thermal protection becomes active
if junction temperature exceeds
Thermal resistance junction
to mounting base
Tj
158
175
192
°C
Rth j-mb
−
−
−
10
42
40
12
−
K/W
dB
Open loop gain at 1 kHz
note 6
note 7
GoI
f
Frequency response (−3 dB)
−
kHz
Notes to the characteristics
1. The maximum supply voltage should be chosen such that during flyback the voltage at pin 5 does not exceed 60 V.
2. When V5-4 = 13 V and no load at pin 5.
3. Duty factor maximum 3.3%.
4. Guard circuit is active.
5. During normal operation the voltage V8-2 may not be lower than 2.5 V.
6. Rload = 8 Ω; Iload(rms) = 125 mA.
7. With 220 pF between pins 1 and 5.
March 1991
7
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
APPLICATION INFORMATION
Note to deflection coils AT1236/20: L = 29 mH, R = 13.6 Ω; deflection current without overscan is 0.82 A peak-to-peak and EHT voltage is 25 kV.
Fig.4 Typical application circuit diagram of the TDA3653B/C (vertical output), when used in combination with
the TDA2578A (see Fig.5).
March 1991
8
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
Fig.5 Typical application circuit diagram; for combination of the TDA2578A with the TDA3653B/C (see Fig.4).
March 1991
9
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
March 1991
10
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
PACKAGE OUTLINES
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
March 1991
11
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
SIL9P: plastic single in-line power package; 9 leads
SOT131-2
non-concave
x
D
h
D
E
h
view B: mounting base side
d
A
2
B
E
j
A
1
b
L
c
1
9
e
Q
w
M
Z
b
p
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
max.
b
max.
1
(1)
(1)
(1)
UNIT
A
b
c
D
d
D
E
e
E
h
j
L
Q
w
x
Z
2
p
h
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
12.2
11.8
3.4
3.1
17.2
16.5
2.00
1.45
2.1
1.8
6
mm
2.0
1.1
10
2.54
0.25
0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-03-11
SOT131-2
March 1991
12
Philips Semiconductors
Product specification
TDA3653B
TDA3653C
Vertical deflection and guard circuit (90˚)
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 1991
13
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The TDA3653B/C is a vertical deflection output circuit for drive of various deflection systems with currents up to 1.5 A peak-to-peak.
Communications
PC/PC-peripherals
Features
Cross reference
Models
l Driver
Packages
l Output stage
Application notes
Selection guides
Other technical documentation
End of Life information
Datahandbook system
l Thermal protection and output stage protection
l Flyback generator
l Voltage stabilizer
l Guard circuit
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TDA3653B; TDA3653C Vertical deflection and guard circuit
(90°)
01-Mar-91
Product
Specification
13
118
TDA3653B;
TDA3653C
TDA3653B;
TDA3653C
Products, packages, availability and ordering
North American
Partnumber
Order code
(12nc)
Partnumber
marking/packing
package device status buy online
SOT110 Full production
Standard Marking * Bulk
Pack
TDA3653B/N2
TDA3653BU
9350 843 50112
9351 530 30112
9351 530 40112
Standard Marking * Bulk
Pack
TDA3653C/N2 TDA3653CU
TDA3653CQ/N2
SOT131 Full production
Standard Marking * Bulk
Pack
SOT157 Full production
-
Please read information about some discontinued variants of this product.
Find similar products:
TDA3653B; TDA3653C links to the similar products page containing an overview of products that are similar in function or related to
the part number(s) as listed on this page. The similar products page includes products from the same catalog tree(s) , relevant selection
guides and products from the same functional category.
Copyright © 2000
Royal Philips Electronics
All rights reserved.
Terms and conditions.
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