BU4525DX [NXP]

Silicon Diffused Power Transistor; 硅扩散型功率晶体管
BU4525DX
型号: BU4525DX
厂家: NXP    NXP
描述:

Silicon Diffused Power Transistor
硅扩散型功率晶体管

晶体 晶体管 功率双极晶体管 开关 局域网
文件: 总4页 (文件大小:25K)
中文:  中文翻译
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Philips Semiconductors  
Objective specification  
Silicon Diffused Power Transistor  
BU4525DX  
GENERAL DESCRIPTION  
Enhanced performance, new generation, high-voltage, high-speed switching npn transistor in a plastic full-pack  
envelope with an integrated damper diode intended for use in horizontal deflection circuits of colour television  
receivers and p.c monitors. Features exceptional tolerance to base drive and collector current load variations  
resulting in a very low worst case dissipation.  
QUICK REFERENCE DATA  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
VCESM  
VCEO  
IC  
Collector-emitter voltage peak value  
VBE = 0 V  
-
1500  
800  
12  
V
V
Collector-emitter voltage (open base)  
Collector current (DC)  
-
-
-
A
ICM  
Collector current peak value  
Total power dissipation  
Collector-emitter saturation voltage  
Collector saturation current  
30  
A
Ptot  
VCEsat  
ICsat  
Ths 25 ˚C  
-
45  
W
V
IC = 9.0 A; IB = 2.25 A  
f = 16 kHz  
-
3.0  
-
9.0  
t.b.f  
-
A
f = 70 kHz  
IF = 9.0 A  
-
A
VF  
tf  
Diode forward voltage  
Fall time  
2.2  
0.55  
t.b.f  
V
ICsat = 9.0 A;f = 16 kHz  
f = 70 kHz  
0.4  
t.b.f  
µs  
µs  
PINNING - SOT399  
PIN CONFIGURATION  
SYMBOL  
PIN  
1
DESCRIPTION  
case  
c
base  
2
collector  
emitter  
b
3
Rbe  
case isolated  
1
2 3  
e
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN. MAX. UNIT  
VCESM  
VCEO  
IC  
Collector-emitter voltage peak value  
VBE = 0 V  
-
1500  
800  
12  
V
V
Collector-emitter voltage (open base)  
Collector current (DC)  
-
-
A
ICM  
IB  
Collector current peak value  
Base current (DC)  
-
30  
A
-
8
A
IBM  
Base current peak value  
Reverse base current peak value 1  
Total power dissipation  
-
12  
A
-IBM  
Ptot  
Tstg  
Tj  
-
-
7
A
Ths 25 ˚C  
45  
W
˚C  
˚C  
Storage temperature  
Junction temperature  
-55  
-
150  
150  
1 Turn-off current.  
July 1998  
1
Rev 1.000  
Philips Semiconductors  
Objective specification  
Silicon Diffused Power Transistor  
BU4525DX  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
Rth j-hs  
Rth j-a  
Junction to heatsink  
Junction to ambient  
with heatsink compound  
in free air  
-
2.8  
-
K/W  
K/W  
35  
ISOLATION LIMITING VALUE & CHARACTERISTIC  
Ths = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Visol  
Cisol  
Repetitive peak voltage from all R.H. 65 % ; clean and dustfree  
-
-
2500  
V
three terminals to external  
heatsink  
Capacitance from T2 to external f = 1 MHz  
heatsink  
-
22  
-
pF  
STATIC CHARACTERISTICS  
Ths = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
ICES  
ICES  
Collector cut-off current 2  
VBE = 0 V; VCE = VCESMmax  
VBE = 0 V; VCE = VCESMmax  
Tj = 125 ˚C  
-
-
-
-
1.0  
2.0  
mA  
mA  
;
BVEBO  
Rbe  
VCEOsust  
Emitter-base breakdown voltage  
Base-emitter resistance  
IB = 600 mA  
7.5  
-
800  
13.5  
50  
-
-
-
-
V
V
VEB = 7.5 V  
Collector-emitter sustaining voltage IB = 0 A; IC = 100 mA;  
L = 25 mH  
VCEsat  
VBEsat  
hFE  
hFE  
VF  
Collector-emitter saturation voltage IC = 9.0 A;IB = 2.25A  
-
0.96  
-
4.2  
-
-
3.0  
1.06  
-
7.6  
2.2  
V
V
Base-emitter saturation voltage  
DC current gain  
IC = 9.0 A;IB = 2.25A  
IC = 1.0 A; VCE = 5 V  
IC = 9.0 A; VCE = 5 V  
IF = 9 A  
1.01  
t.b.f  
5.8  
-
Diode forward voltage  
V
DYNAMIC CHARACTERISTICS  
Ths = 25 ˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
TYP. MAX. UNIT  
Cc  
Collector capacitance  
IE = 0 A; VCB = 10 V; f = 1 MHz  
145  
-
pF  
Switching times (16 kHz line  
deflection circuit)  
ICsat = 9.0 A;IB1 = 1.8 A  
(IB2 = -4.5 A)  
ts  
tf  
Turn-off storage time  
Turn-off fall time  
3.7  
0.4  
4.5  
0.55  
µs  
µs  
Switching times (70 kHz line  
deflection circuit)  
ICsat = t.b.f  
ts  
tf  
Turn-off storage time  
Turn-off fall time  
t.b.f  
t.b.f  
t,b,f  
t.b.f  
µs  
µs  
2 Measured with half sine-wave voltage (curve tracer).  
July 1998  
2
Rev 1.000  
Philips Semiconductors  
Objective specification  
Silicon Diffused Power Transistor  
BU4525DX  
MECHANICAL DATA  
Dimensions in mm  
5.8 max  
3.0  
16.0 max  
Net Mass: 5.88 g  
0.7  
4.5  
3.3  
10.0  
27  
max  
25  
25.1  
25.7  
22.5  
max  
5.1  
2.2 max  
4.5  
18.1  
min  
1.1  
0.4 M  
2
3.3  
0.95 max  
5.45 5.45  
Fig.1. SOT399; The seating plane is electrically isolated from all terminals.  
Notes  
1. Refer to mounting instructions for F-pack envelopes.  
2. Epoxy meets UL94 V0 at 1/8".  
July 1998  
3
Rev 1.000  
Philips Semiconductors  
Objective specification  
Silicon Diffused Power Transistor  
BU4525DX  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 1998  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
July 1998  
4
Rev 1.000  

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