PCK2510SL [NXP]
50-150 MHz 1:10 SDRAM clock driver; 50-150兆赫1:10 SDRAM时钟驱动器
| 型号： | PCK2510SL |
| 厂家： | 
NXP |
| 描述： | 50-150 MHz 1:10 SDRAM clock driver |
| 文件： | 总10页 (文件大小：80K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
PCK2510SL
50–150 MHz 1:10 SDRAM clock driver
Product specification
2000 Dec 01
ICL03 — PC Motherboard ICs; Logic Products Group
Philips
Semiconductors
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
independent of the duty cycle at CLK. All outputs can be enabled or
disabled via a single output enable input. When the G input is high,
the outputs switch in phase and frequency with CLK; when the G
input is low, the outputs are disabled to the logic-low state.
FEATURES
• Phase-Locked Loop Clock distribution for
PC100/PC133 SDRAM applications
• When outputs are disabled, the PLL and feedback output are
Unlike many products containing PLLs, the PCK2510SL does not
require external RC networks. The loop filter for the PLL is included
on-chip, minimizing component count, board space, and cost.
disabled, dropping AI to 100 µA in stand-by mode when input
CC
clock signal is present.
Because it is based on PLL circuitry, the PCK2510SL requires a
stabilization time to achieve phase lock of the feedback signal to the
reference signal. This stabilization time is required, following power
up and application of a fixed-frequency, fixed-phase signal at CLK,
and following any changes to the PLL reference. The PLL can be
• See PCK2510SA for JEDEC compliant option where PLL remains
locked when outputs are disabled.
• Spread Spectrum clock compatible
• Operating frequency 50 to 150 MHz
bypassed for test purposes by strapping AV to ground.
CC
• (t
– jitter) at 100 to133 MHz = ±50 ps
The PCK2510SL is characterized for operation from 0 °C to +70 °C.
phase error
• Jitter (peak-peak) at 100 to 133 MHz = ± 80 ps
• Jitter (cycle-cycle) at 100 to 133 MHz = 65 ps
• Pin-to-pin skew < 200 ps
PIN CONFIGURATION
CLK
1
2
24
23
22
21
20
19
18
17
16
15
14
13
AGND
• Available in plastic 24-Pin TSSOP
V
AV
V
CC
CC
3
1Y0
1Y1
• Distributes one clock input to one bank of ten outputs
CC
4
1Y9
1Y8
GND
GND
1Y7
• External Feedback (FBIN) terminal Is used to synchronize the
5
1Y2
outputs to the clock input
6
GND
GND
1Y3
• On-Chip series damping resistors
• No external RC network required
• Operates at 3.3 V
7
8
9
1Y4
1Y6
1Y5
10
11
V
CC
G
• See page 7 for Characteristic curves.
V
CC
FBOUT 12
FBIN
DESCRIPTION
SW00382
The PCK2510SL is a high-performance, low-skew, low-jitter,
phase-locked loop (PLL) clock driver. It uses a PLL to precisely
align, in both frequency and phase, the feedback (FBOUT) output to
the clock (CLK) input signal. It is specifically designed for use with
synchronous DRAMs. The PCK2510SL operates at 3.3 V V and
CC
is input compatible with both 2.5 V and 3.3 V input voltage ranges. It
also provides integrated series damping resistors that make it ideal
for driving point-to-point loads.
One bank of ten outputs provides ten low-skew, low-jitter copies of
CLK. Output signal duty cycles are adjusted to 50 percent,
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
ORDER CODE
PCK2510SLDH
DRAWING NUMBER
24-Pin Plastic TSSOP
0 °C to +70 °C
SOT355-1
2
2000 Dec 01
853–2231 25137
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
PIN DESCRIPTIONS
PIN NUMBER
1
SYMBOL
TYPE
GND
PWR
NAME, FUNCTION, and DIRECTION
AGND
Analog ground. AGND provides the ground reference for the analog circuitry.
Power supply
2, 10, 14, 22
V
CC
Clock outputs. These outputs provide low-skew copies of CLK. Output bank 1Y (0–9) is enabled
via the G input. These outputs can be disabled to a logic-low state by de-asserting the G control
input. Each output has an integrated 25 Ω series-damping resistor.
3, 4, 5, 8, 9,
15, 16, 17, 20, 21
1Y (0–9)
GND
G
OUT
GND
IN
6, 7, 18, 19
11
Ground
Output bank enable. G is the output enable for outputs 1Y (0–9). When G is LOW, outputs 1Y
(0–9) are disabled to a logic LOW state. When G is HIGH, all outputs 1Y (0–9) are enabled and
switch at the same frequency as CLK.
Feedback output. FBOUT is dedicated for external feedback. It switches at the same frequency
as CLK. When externally wired to FBIN, FBOUT completes the feedback loop of the PLL.
FBOUT has an integrated 25 Ω series-damping resistor.
12
13
23
FBOUT
FBIN
OUT
IN
Feedback input. FBIN provides the feedback signal to the internal PLL. FBIN must be
hard-wired to FBOUT to complete the PLL. The integrated PLL synchronizes CLK and FBIN so
that there is nominally zero phase error between CLK and FBIN.
Analog power supply. AV provides the power reference for the analog circuitry. In addition,
CC
AV can be used to bypass the PLL for test purposes. When AV is strapped to ground, PLL
AV
PWR
CC
CC
CC
is bypassed and CLK is buffered directly to the device outputs.
Clock input. CLK provides the clock signal to be distributed by the PCK2510SL clock driver.
CLK is used to provide the reference signal to the integrated PLL that generates the clock
output signals. CLK must have a fixed frequency and fixed phase for the PLL to obtain phase
lock. Once the circuit is powered up and a valid CLK signal is applied, a stabilization time is
required for the PLL to phase lock the feedback signal to its reference signal.
24
CLK
IN
FUNCTION TABLE
INPUTS
OUTPUTS
G
X
L
CLK
1Y (0–9)
FBOUT
L
H
H
L
L
L
H
H
H
H
3
2000 Dec 01
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
FUNCTIONAL BLOCK DIAGRAM
11
G
3
4
1Y0
1Y1
1Y2
5
8
9
1Y3
1Y4
15
16
1Y5
1Y6
17
1Y7
24
CLK
20
21
12
PLL
1Y8
13
FBIN
1Y9
23
AV
CC
FBOUT
SW00383
FRONT SIDE
A[L]VC
A[L]VC
A[L]VC
PCK2510SL
The PLL clock distribution device and A[L]VC registered drivers reduce
signal loads on the memory controller and prevent timing delays and
waveform distortions that would cause unreliable operation.
SW00441
4
2000 Dec 01
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
1, 3
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134).
LIMITS
SYMBOL
AV
PARAMETER
Supply voltage range
CONDITION
UNIT
MIN
–0.5
–0.5
–0.5
–65
MAX
Note 2
< V + 0.7
V
V
CC
CC
V
CC
I
IK
Supply voltage range
+4.6
–50
6.5
Input clamp current
V < 0
I
mA
V
V
I
Input voltage range
Note 3
I
Output clamp current
V
O
> V or V < 0
±50
mA
V
OK
CC
O
V
O
Output voltage range
Notes 3, 4
= 0 to V
CC
V
CC
+ 0.5
I
O
DC output source or sink current
Storage temperature range
Power dissipation per package
V
O
±50
mA
°C
mW
T
STG
+150
700
P
TOT
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. AV must not exceed V
.
CC
CC
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
4. This value is limited to 4.6 V maximum.
1
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
CONDITIONS
UNIT
MIN
3
MAX
V
CC
, AV
Supply voltage
3.6
V
V
CC
V
IH
HIGH level input voltage
2
V
IL
LOW level input voltage
0
0.8
V
V
I
Input voltage
0
V
CC
V
T
amb
Operating ambient temperature range in free air
0
+70
°C
NOTE:
1. Unused inputs must be held high or low to prevent them from floating.
ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range (unless otherwise noted)
TEST CONDITIONS
LIMITS
TYP
SYMBOL
PARAMETER
UNIT
AV , V (V)
OTHER
I = –18 mA
MIN
MAX
CC
CC
V
IK
Input clamp voltage
3
–1.2
V
V
I
MIN to MAX
I
= – 100 µA
V
– 0.2
OH
CC
3
I
= – 12 mA
2.1
V
OH
HIGH level output voltage
LOW level output voltage
OH
3
I
= – 6 mA
= 100 µA
= 12 mA
2.4
–
OH
MIN to MAX
I
0.2
0.8
0.55
±5
OL
3
3
I
–
V
OL
V
OL
I
OL
= 6 mA
–
I
I
Input current
3.6
V = V or GND
µA
µA
I
CC
V = V or GND;
= 0, outputs: LOW or HIGH
I
CC
1
I
Quiescent supply current
3.6
10
CC
I
O
Additional supply current per
input pin
One input at V – 0.6 V;
CC
∆I
CC
3.3 to 3.6
500
µA
other inputs at V or GND
CC
C
Input capacitance
Output capacitance
3.3
3.3
V = V or GND
2.8
5.4
pF
pF
I
I
CC
C
V = V or GND
O CC
O
NOTE:
1. For I
and I vs. Frequency, see Figures 1 and 2.
CC
CCA
5
2000 Dec 01
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
TIMING REQUIREMENTS
Over recommended ranges of supply voltage and operating free-air temperature
SYMBOL
PARAMETER
MIN
50
MAX
150
60
UNIT
MHz
%
f
Clock frequency
CLK
Input clock duty cycle
40
1
Stabilization time
1
ms
NOTE:
1. Time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal. For phase lock to be obtained,
a fixed-frequency, fixed-phase reference signal must be present at CLK. Until phase lock is obtained, the specifications for propagation
delay, skew, and jitter parameters given in the switching characteristics table are not applicable.
SWITCHING CHARACTERISTICS
Over recommended ranges of supply voltage and operating free-air temperature; C = 30 pF
L
V
, AV = 3.3 V ±0.3 V
CC
CC
FROM
(INPUT)/CONDITION
TO
(OUTPUT)
PARAMETER
UNIT
MIN
–100
–125
–50
TYP
MAX
CLKIN↑ = 100 MHz to 133 MHz
CLKIN↑ = 66 MHz
FBIN↑
FBIN↑
100
125
50
ps
ps
ps
ps
2
t
phase error
1, 3
t
– jitter
CLKIN↑ = 100 MHz to 133 MHz
Any Y or FBOUT
FBIN↑
phase error
t
Any Y or FBOUT
200
80
SK(0)
jitter
–80
(peak-peak)
CLKIN = 100 MHz to 133 MHz
Any Y or FBOUT
ps
1
jitter
|65|
(cycle-cycle)
1
Duty cycle reference
F(CLKIN > 60 MHz)
Any Y or FBOUT
Any Y or FBOUT
Any Y or FBOUT
47
2.5
2.5
53
1
%
1
t
r
V
O
V
O
= 0.4 V to 2 V
= 0.4 V to 2 V
V/ns
V/ns
1
t
f
1
NOTES:
1. These parameters are not production tested.
2. This is considered as static phase offset.
3. Phase error does not include jitter. (t
= static phase error – jitter
)
(cycle-cycle)
phase error
4. The t
specification is only valid for outputs with equal loading.
SK(0)
6
2000 Dec 01
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
CHARACTERISTIC CURVES
AV = V = 3.3 V
AV = V = 3.3 V
CC CC
CC
CC
T
= 25 °C
T
= 25 °C
amb
amb
100
90
80
70
60
50
40
30
20
10
0
8
7
6
5
4
3
2
1
0
CLOCK FREQUENCY (MHz)
CLOCK FREQUENCY (MHz)
SW00435
SW00434
Figure 1. Analog supply current vs. clock frequency
Figure 2. Supply current vs. clock frequency
AV = V = 3.3 V
AV = V = 3.3 V
CC CC
CC
CC
C
= 12 pF; T
= 25 °C
C
= 12 pF; T
= 25 °C
(LF)
amb
(LF)
amb
200
150
100
50
200
150
100
50
0
0
50
100
133
150
50
60
70
80
90
100 110
120 130 140
SW00432
CLOCK FREQUENCY (MHz)
CLOCK FREQUENCY (MHz)
SW00433
Figure 3. Peak-to-peak jitter vs. clock frequency
Figure 4. Cycle-to-cycle jitter vs. clock frequency
V
CC
= 3.3 V; C
= 30 pF; f = 100 MHz
(LF)
100
80
60
40
20
0
–20
–40
0
2
4
6
8
10
DELAY LENGTH (ns)
SW00439
Figure 5. Phase offset vs. delay length
7
2000 Dec 01
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
PARAMETER MEASUREMENT INFORMATION
3V
0V
50% V
INPUT
CC
t
pe
FROM OUTPUT
UNDER TEST
V
V
OH
OL
2 V
0.4 V
2 V
0.4 V
50% V
CC
OUTPUT
500 Ω
30 pF
t
r
t
f
LOAD CIRCUIT FOR OUTPUTS
VOLTAGE WAVEFORMS & PHASE ERROR TIMES
NOTES:
1.
C includes probe and jig capacitance.
L
2. All input pulses are supplied by generators having the following characteristics: PRR ≤ 100 MHz, Z = 50 Ω , t ≤ 1.2 ns, t ≤
O
r
f
1.2 ns.
3. The outputs are measured one at a time with one transition per measurement.
SW00384
Figure 6. Load Circuit and Voltage Waveforms
CLKIN
FBIN
t
phase error
FBOUT
ANY Y
t
SK(0)
ANY Y
ANY Y
t
SK(0)
SW00385
Figure 7. Phase Error and Skew Calculations
8
2000 Dec 01
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
9
2000 Dec 01
Philips Semiconductors
Product specification
50–150 MHz 1:10 SDRAM clock driver
PCK2510SL
Data sheet status
[1]
Data sheet
status
Product
status
Definition
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Righttomakechanges—PhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Copyright Philips Electronics North America Corporation 2000
All rights reserved. Printed in U.S.A.
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 12-00
Document order number:
9397 750 07848
Philips
Semiconductors
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