TIP105 [POINN]

PNP SILICON POWER DARLINGTONS; PNP硅功率DARLINGTONS
TIP105
型号: TIP105
厂家: POWER INNOVATIONS LTD    POWER INNOVATIONS LTD
描述:

PNP SILICON POWER DARLINGTONS
PNP硅功率DARLINGTONS

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TIP105, TIP106, TIP107  
PNP SILICON POWER DARLINGTONS  
Copyright © 1997, Power Innovations Limited, UK  
AUGUST 1978 - REVISED MARCH 1997  
Designed for Complementary Use with  
TIP100, TIP101 and TIP102  
TO-220 PACKAGE  
(TOP VIEW)  
80 W at 25°C Case Temperature  
8 A Continuous Collector Current  
1
2
3
B
C
E
Maximum V  
of 2.5 V at I = 8 A  
C
CE(sat)  
Pin 2 is in electrical contact with the mounting base.  
MDTRACA  
absolute maximum ratings at 25°C case temperature (unless otherwise noted)  
RATING  
SYMBOL  
VALUE  
UNIT  
TIP105  
TIP106  
TIP107  
TIP105  
TIP106  
TIP107  
-60  
Collector-base voltage (IE = 0)  
Collector-emitter voltage (IB = 0)  
VCBO  
-80  
V
-100  
-60  
VCEO  
-80  
V
-100  
Emitter-base voltage  
VEBO  
IC  
ICM  
IB  
-5  
V
A
Continuous collector current  
Peak collector current (see Note 1)  
Continuous base current  
-8  
-15  
A
-1  
A
Continuous device dissipation at (or below) 25°C case temperature (see Note 2)  
Continuous device dissipation at (or below) 25°C free air temperature (see Note 3)  
Unclamped inductive load energy (see Note 4)  
Ptot  
Ptot  
80  
W
W
mJ  
°C  
°C  
°C  
2
2
½LIC  
10  
Operating junction temperature range  
Tj  
Tstg  
TL  
-65 to +150  
-65 to +150  
260  
Storage temperature range  
Lead temperature 3.2 mm from case for 10 seconds  
NOTES: 1. This value applies for tp £ 0.3 ms, duty cycle £ 10%.  
2. Derate linearly to 150°C case temperature at the rate of 0.64 W/°C.  
3. Derate linearly to 150°C free air temperature at the rate of 16 mW/°C.  
4. This rating is based on the capability of the transistor to operate safely in a circuit of: L = 20 mH, IB(on) = -5 mA, RBE = 100 W,  
VBE(off) = 0, RS = 0.1 W, VCC = -20 V.  
P R O D U C T  
I N F O R M A T I O N  
Information is current as of publication date. Products conform to specifications in accordance  
with the terms of Power Innovations standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1
TIP105, TIP106, TIP107  
PNP SILICON POWER DARLINGTONS  
AUGUST 1978 - REVISED MARCH 1997  
electrical characteristics at 25°C case temperature  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
TIP105  
TIP106  
TIP107  
TIP105  
TIP106  
TIP107  
TIP105  
TIP106  
TIP107  
-60  
-80  
Collector-emitter  
V(BR)CEO  
IC  
=
-30 mA  
IB = 0  
B = 0  
V
breakdown voltage  
(see Note 5)  
-100  
VCE  
VCE  
VCE  
VCB  
VCB  
=
=
=
=
=
-30 V  
-40 V  
-50 V  
-60 V  
-80 V  
I
-50  
-50  
-50  
-50  
-50  
-50  
Collector-emitter  
cut-off current  
ICEO  
IB = 0  
IB = 0  
µA  
I
E = 0  
Collector cut-off  
current  
ICBO  
IE = 0  
IE = 0  
µA  
VCB = -100 V  
Emitter cut-off  
current  
IEBO  
hFE  
VCE(sat)  
VBE  
VEB  
=
-5 V  
IC = 0  
-8  
mA  
Forward current  
transfer ratio  
Collector-emitter  
saturation voltage  
Base-emitter  
voltage  
VCE  
VCE  
=
=
-4 V  
-4 V  
I
C = -3 A  
IC = -8 A  
C = -3 A  
1000  
200  
20000  
(see Notes 5 and 6)  
(see Notes 5 and 6)  
(see Notes 5 and 6)  
(see Notes 5 and 6)  
IB  
IB  
=
=
-6 mA  
-80 mA  
I
-2  
V
V
V
IC = -8 A  
-2.5  
VCE  
IE  
=
-4 V  
-8 A  
IC = -8 A  
-2.8  
-3.5  
Parallel diode  
forward voltage  
VEC  
=
IB = 0  
NOTES: 5. These parameters must be measured using pulse techniques, tp = 300 µs, duty cycle £ 2%.  
6. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.  
thermal characteristics  
PARAMETER  
Junction to case thermal resistance  
Junction to free air thermal resistance  
Thermal capacitance of case  
MIN  
TYP  
MAX  
UNIT  
RqJC  
RqJA  
CqC  
1.56  
62.5  
°C/W  
°C/W  
J/°C  
0.9  
resistive-load-switching characteristics at 25°C case temperature  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
td  
tr  
Delay time  
Rise time  
Storage time  
Fall time  
35  
ns  
ns  
ns  
µs  
IC = -8 A  
I
B(on) = -80 mA  
IB(off) = 80 mA  
300  
900  
1.3  
ts  
tf  
VBE(off) = 5 V  
RL = 5 W  
tp = 20 µs, dc £ 2%  
Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.  
P R O D U C T  
I N F O R M A T I O N  
2
TIP105, TIP106, TIP107  
PNP SILICON POWER DARLINGTONS  
AUGUST 1978 - REVISED MARCH 1997  
TYPICAL CHARACTERISTICS  
TYPICAL DC CURRENT GAIN  
vs  
COLLECTOR-EMITTER SATURATION VOLTAGE  
vs  
COLLECTOR CURRENT  
COLLECTOR CURRENT  
TCS135AB  
TCS135AA  
50000  
10000  
-2·0  
tp = 300 µs, duty cycle < 2%  
IB = IC / 100  
TC = -40°C  
TC = 25°C  
TC = 100°C  
-1·5  
-1·0  
1000  
TC = -40°C  
TC = 25°C  
VCE  
=
-4 V  
tp = 300 µs, duty cycle < 2%  
TC = 100°C  
100  
-0·5  
-0·5  
-0·5  
-1·0  
-10  
-1·0  
IC - Collector Current - A  
-10  
IC - Collector Current - A  
Figure 1.  
Figure 2.  
BASE-EMITTER SATURATION VOLTAGE  
vs  
COLLECTOR CURRENT  
TCS135AC  
-3·0  
-2·5  
-2·0  
-1·5  
-1·0  
-0·5  
TC = -40°C  
TC = 25°C  
TC = 100°C  
IB = IC / 100  
tp = 300 µs, duty cycle < 2%  
-0·5  
-1·0  
IC - Collector Current - A  
-10  
Figure 3.  
P R O D U C T  
I N F O R M A T I O N  
3
TIP105, TIP106, TIP107  
PNP SILICON POWER DARLINGTONS  
AUGUST 1978 - REVISED MARCH 1997  
MAXIMUM SAFE OPERATING REGIONS  
MAXIMUM FORWARD-BIAS  
SAFE OPERATING AREA  
SAS135AA  
-100  
-10  
tp = 100 µs,  
d = 0.1 = 10%  
tp = 1 ms,  
d = 0.1 = 10%  
tp = 5 ms,  
d = 0.1 = 10%  
DC Operation  
-1·0  
-0·1  
TIP105  
TIP106  
TIP107  
-1·0  
-10  
-100  
-1000  
VCE - Collector-Emitter Voltage - V  
Figure 4.  
THERMAL INFORMATION  
MAXIMUM POWER DISSIPATION  
vs  
CASE TEMPERATURE  
TIS130AA  
100  
80  
60  
40  
20  
0
0
25  
50  
75  
100  
125  
150  
TC - Case Temperature - °C  
Figure 5.  
P R O D U C T  
I N F O R M A T I O N  
4
TIP105, TIP106, TIP107  
PNP SILICON POWER DARLINGTONS  
AUGUST 1978 - REVISED MARCH 1997  
MECHANICAL DATA  
TO-220  
3-pin plastic flange-mount package  
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic  
compound. The compound will withstand soldering temperature with no deformation, and circuit performance  
characteristics will remain stable when operated in high humidity conditions. Leads require no additional  
cleaning or processing when used in soldered assembly.  
TO220  
4,70  
4,20  
10,4  
10,0  
1,32  
1,23  
3,96  
3,71  
ø
2,95  
2,54  
see Note B  
6,6  
6,0  
15,90  
14,55  
see Note C  
6,1  
3,5  
14,1  
12,7  
1,70  
1,07  
0,97  
0,61  
1
2
3
2,74  
2,34  
0,64  
0,41  
2,90  
2,40  
5,28  
4,88  
VERSION 1  
VERSION 2  
ALL LINEAR DIMENSIONS IN MILLIMETERS  
NOTES: A. The centre pin is in electrical contact with the mounting tab.  
B. Mounting tab corner profile according to package version.  
C. Typical fixing hole centre stand off height according to package version.  
Version 1, 18.0 mm. Version 2, 17.6 mm.  
MDXXBE  
P R O D U C T  
I N F O R M A T I O N  
5
TIP105, TIP106, TIP107  
PNP SILICON POWER DARLINGTONS  
AUGUST 1978 - REVISED MARCH 1997  
IMPORTANT NOTICE  
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any  
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the  
information being relied on is current.  
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI  
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except as mandated by government requirements.  
PI accepts no liability for applications assistance, customer product design, software performance, or infringement  
of patents or services described herein. Nor is any license, either express or implied, granted under any patent  
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,  
machine, or process in which such semiconductor products or services might be or are used.  
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE  
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.  
Copyright © 1997, Power Innovations Limited  
P R O D U C T  
I N F O R M A T I O N  
6

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