JANTX2N1772A [POWEREX]

Silicon Controlled Rectifier, 4700mA I(T), 100V V(DRM);
JANTX2N1772A
型号: JANTX2N1772A
厂家: POWEREX POWER SEMICONDUCTORS    POWEREX POWER SEMICONDUCTORS
描述:

Silicon Controlled Rectifier, 4700mA I(T), 100V V(DRM)

文件: 总11页 (文件大小:47K)
中文:  中文翻译
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The documentation process conversion  
measures necessary to comply with this  
revision shall be completed by 17 January 1999  
INCH-POUND  
MIL-PRF-19500/168E  
17 October 1998  
SUPERSEDING  
MIL-PRF-19500/168D  
15 October 1997  
PERFORMANCE SPECIFICATION SHEET  
SEMICONDUCTOR DEVICE, THYRISTORS (CONTROLLED RECTIFIERS), SILICON  
TYPES 2N1771A, 2N1772A, 2N1774A, 2N1776A, 2N1777A, JAN, JANTX, AND JANTXV  
This specification is approved for use by all Depart-  
ments and Agencies of the Department of Defense.  
1. SCOPE  
1.1 Scope. This specification covers the performance requirements for PNPN, silicon power, reverse-blocking triode thyristors. Three  
levels of product assurance are provided for each device type as specified in MIL-PRF-19500.  
1.2 Physical dimensions. See figure 1 (similar to TO-64).  
1.3 Maximum ratings.  
I
1/  
O
Limits  
I
2/  
V
T
T
d /d 3/  
v t  
(repetitive)  
TSM  
GM  
op  
C
STG  
T
= +105 C  
°
C
(180 condition angle)  
°
A
A
V(pk)  
10  
C
°
v/ s  
m
°
Min  
-65  
+150  
-65  
+150  
5
Max  
4.7  
60  
1/ This average forward current is for a maximum case temperature of +105 C, and 180 electrical degrees of conduction.  
°
2/ Surge rating is non-recurrent and applies only with device in the ‘on’ conducting state. The peak rate of surge current must  
not exceed 40 amperes/microsecond during the first 10 s after switching from the “off” (blocking) state to the “on”  
m
(conducting) state. This time is measured from the point where the thyristor voltage has decayed to 90 percent of its initial  
blocking value.  
3/ T = -65 to +150 C.  
°
°
C
1.4 Primary electrical characteristics.  
1.4.1 Primary electrical characteristics (common to all types).  
Limits  
V
TM  
I
H
V
GT  
1/  
I
1/  
t
off  
1/  
t
on  
GT  
V
mA dc  
25  
V dc  
mA dc  
30  
s
s
m
m
Min  
Max  
0.2  
2.0  
1.85  
30  
5
1/ T = -65 to +150 C.  
°
°
C
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this  
document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAT, 3990 East Broad Street,  
Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the  
end of this document or by letter.  
AMSC N/A  
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.  
FSC 5961  
MIL-PRF-19500/168E  
1.4.2 Individual ratings.  
Types  
V
RRM  
V
DRM  
V
SRM  
V(pk) 1/  
50  
100  
200  
300  
V(pk)  
50  
100  
200  
300  
400  
V(pk) 2/  
75  
150  
300  
400  
2N1771A  
2N1772A  
2N1774A  
2N1776A  
2N1777A  
400  
500  
1/ Values apply for zero or negative gate voltage V  
GK  
2/ Peak reverse voltage, nonrepetitive, t = 5.0 ms maximum.  
.
2. APPLICABLE DOCUMENTS  
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include  
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has  
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements  
documents cited in sections 3 and 4 of this specification, whether or not they are listed.  
2.2 Government documents.  
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document  
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department  
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).  
SPECIFICATION  
MILITARY  
MIL-PRF-19500  
STANDARD  
MILITARY  
-
Semiconductor Devices, General Specification for.  
MIL-STD-129  
MIL-STD-750  
-
-
Military Marking.  
Test Methods for Semiconductor Devices.  
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization  
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)  
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for  
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,  
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.  
3. REQUIREMENTS  
3.1 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing  
on the applicable qualified products list before contract award (see 4.2 and 6.3).  
3.2 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified herein.  
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in  
MIL-PRF-19500.  
2
MIL-PRF-19500/168E  
Dimensions  
Ltr  
Inches  
Millimeters  
Notes  
3
Min  
.080  
.300  
.040  
Max  
Min  
2.03  
7.62  
1.02  
Max  
3.45  
B
CH  
DT  
e
.136  
.400  
.075  
10.16  
1.91  
.013  
.060  
- - -  
- - -  
0.33  
1.52  
- - -  
- - -  
8
6
e
1
HF  
HT  
.424  
.060  
.700  
.437  
.175  
.855  
10.77  
1.52  
11.10  
4.45  
9
2
OAH  
OD  
17.78  
21.72  
.400  
- - -  
- - -  
10.16  
- - -  
- - -  
4
2
.424  
10.77  
OD  
1
SD  
SL  
.1658  
.400  
- - -  
.1697  
.453  
.078  
.189  
4.212  
10.16  
- - -  
4.310  
11.51  
1.98  
7
SU  
UD  
.163  
4.14  
4.80  
NOTES:  
1. Metric equivalents are given for general information only.  
2. Device contour except on hex head and noted terminal dimensions is optional within zone defined by OD and OAH, OD  
1
1
not to exceed actual HF.  
3. Contour and angular orientation of terminals 1 and 2 with respect to hex portion and to each other are optional.  
4. Chamfer or undercut on one or both ends of the hexagonal portion are optional.  
5. Square or radius on end of terminal is optional.  
6. Minimum difference in terminal lengths to establish datum line for numbering terminals.  
7. Pitch diameter - thread 10-32 NF-2A (coated). Reference Handbook H28.  
8. Minimum spacing between terminals.  
9. Minimum diameter of seating plane.  
FIGURE 1. Physical dimensions of thyristor types 2N1771A, 2N1772A, 2N1774A, 2N1776A, and 2N1777A.  
3
MIL-PRF-19500/168E  
3.4 Interface requirements and physical dimensions. The interface requirements and physical dimensions for the purpose of  
interchangeability shall be as specified on figure 1 herein  
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-STD-750, MIL-PRF-19500, and herein. Where a choice of  
lead finish is desired, it shall be specified in the acquisition document (see 6.2).  
3.4.2 Construction. These devices shall be constructed in a manner and using materials which enable the devices to meet the  
applicable requirements of MIL-PRF-19500 and this document.  
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500.  
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as  
specified in 1.3, 1.4, and table I herein.  
3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and 4.4.3.  
4. VERIFICATION  
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:  
a. Qualification inspection (see 4.2).  
b. Screening (see 4.3)  
c. Conformance inspection (see 4.4).  
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.  
4.3 Screening (JANTX level only). Screening shall be in accordance with MIL-PRF-19500 (Appendix E, table IV), and as specified  
herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein  
shall not be acceptable.  
Screen (see table IV,  
appendix E, of  
MIL-PRF-19500)  
Measurement  
JANTX level  
3a  
7
Condition F, 10 cycles  
Condition C or D for gross leaks  
Not required  
10  
11  
I
, I  
V
, V  
RRM DRM GT TM  
12d  
13  
Condition A, T = +145 C minimum ;  
°
C
V , V = rated (see 1.4.1).  
RRM DRM  
Subgroup 2 of table I herein,  
= 100 percent of initial value or  
I
D
RRM1  
+1.0 mA(pk), whichever is greater.  
= 100 percent of initial value or  
I
D
DRM1  
+1.0 mA(pk), whichever is greater.  
4
MIL-PRF-19500/168E  
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.  
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table V of MIL-PRF-19500 and  
table I herein.  
4.4.2 Group B inspection (JANTX and JANTXV) . Group B inspection shall be conducted in accordance with the conditions specified  
for subgroup testing in appendix E, table VIb (JANTX and JANTXV) of MIL-PRF-19500, and as follows. Electrical measurements (end-  
points) and delta requirements shall be in accordance with the applicable steps and footnotes of table II herein.  
4.4.2.1 Group B inspection, appendix E, table VIb of MIL-PRF-19500.  
Subgroup  
B2  
Method  
1051  
Condition  
Test condition F, 15 cycles.  
Condition C or D for gross leaks.  
B2  
1071  
B2  
4066  
I = 60 A(pk) (0.5 sine wave); 10 surges 1 per minute; I = 4.7 A at rated  
TSM O  
V
RRM  
; T = +65 C; f = 60 Hz; surge duration = 7 ms, minimum.  
°
C
B3  
B5  
1026  
T
= +118 C, 5 C, 50 min “on”, I = 1.25 A, T uncontrolled,  
°
± °  
C
O
C
10 minutes “off”.  
Not applicable.  
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in  
appendix E, table VII of MIL-PRF-19500 and as follows. Electrical measurements (end-points) and delta requirements shall be in  
accordance with the applicable steps and footnotes of table II herein.  
4.4.3.1 Group C inspection, appendix E, table VII of MIL-PRF-19500  
Subgroup  
C2  
Method  
2036  
Condition  
Test condition A, weight 10 pounds, application time = 15 seconds.  
Condition C or D for gross leaks.  
C2  
1071  
C3  
Not applicable.  
C6  
1026  
T = +118 C, 5 C, 50 min “on”, I = 1.25 A, T uncontrolled, 10 minutes “off”.  
° ± °  
C O C  
.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.  
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of MIL-STD-750.  
5
MIL-PRF-19500/168E  
TABLE I. Group A inspection.  
Inspection 1/  
Subgroup 1  
MIL-STD-750  
Conditions  
Symbol  
Limits  
Unit  
Method  
2071  
Min  
Max  
Visual and mechanical  
examination  
Subgroup 2  
Reverse blocking current  
4211  
4206  
4221  
AC method, bias condition D;  
1
1
mA(pk)  
mA(pk)  
I
I
RRM1  
f = 60 Hz; V  
RRM  
= rated (see 1.4.2)  
Forward blocking current  
AC method, bias condition D;  
f = 60 Hz, V = rated (see 1.4.2)  
DRM1  
DRM  
Gate trigger voltage  
and current  
2
V dc  
V = V = 6 V dc; T = + 25 C  
V
I
°
2
D
C
GT1  
R = 20 maximum  
W
GT1  
e
15  
mA dc  
R = 50  
L
W
W
W
2N1771A, 2N1772A,  
2N1774A, 2N1776A,  
2N1777A  
R = 50  
L
R = 50  
L
Forward “on” voltage  
4226  
4201  
1.85  
25  
V(pk)  
I
= 14.8 A(pk) (pulse); pulse  
V
TM  
TM  
width = 8.5 ms; maximum;  
duty cycle = 2 percent maximum  
Holding current  
mA dc  
I
H
Bias condition D; R = 50  
W
2
V
AA  
= 24 V dc maximum;  
I
= 1 A dc; I = 100 mA dc;  
F1  
F2  
trigger voltage source = 6 V dc;  
trigger PW = 25 s (minimum);  
m
Reverse gate current  
4219  
250  
mA dc  
V
G
= 10 V dc  
I
G
Subgroup 3  
High temperature operation:  
T
= +145 C  
°
C
Reverse blocking current  
Forward blocking current  
4211  
4206  
4221  
AC method, bias condition D;  
f = 60 Hz; V = rated (see 1.4.1).  
2
2
2
2
I
I
RRM2  
RRM  
AC method, bias condition D;  
f = 60 Hz; V = rated (see 1.4.1).  
DRM2  
DRM  
Gate trigger voltage  
and current  
2
V dc  
V = V = 6 V dc; T = + 125 C  
V
°
2
D
C
GT2  
R = 20 maximum,  
W
e
15  
mA dc  
I
GT2  
R = 140 , 650  
W
W
L
See footnote at end of table.  
6
MIL-PRF-19500/168E  
TABLE I. Group A inspection - Continued.  
Inspection 1/  
MIL-STD-750  
Conditions  
Symbol  
Limits  
Unit  
Method  
Min  
Max  
Subgroup 3 - Continued  
Low temperature operation:  
T
= -65 C  
°
C
Reverse blocking current  
Forward blocking current  
4211  
4206  
4221  
AC method, bias condition D;  
f = 60 Hz, V = rated (see 1.4.1)  
1
1
mA(pk)  
mA(pk)  
I
I
RRM3  
RRM  
AC method, bias condition D;  
f = 60 Hz; V = rated (see 1.4.1)  
DRM3  
DRM  
Gate trigger voltage and  
current  
2
V dc  
V = V = 6 V dc; R = 20  
V
W
2
D
e
GT1  
maximum  
I
GT2  
30  
mA dc  
2N1771A, 2N1772A  
2N1774A, 2N1776A,  
2N1777A  
R = 140  
L
W
W
W
R = 650  
L
R = 650  
L
Subgroups 4 and 5  
Not applicable  
Subgroup 6  
Exponential rate of  
voltage rise  
4231  
5
V/ s  
m
Bias condition D; T = +150 C  
repetition rate = 60 pps  
°
d
v
/ d  
t
C
test duration = 15 s; C = 10 F;  
m
50  
R
400  
£ W  
£
L
2N1771A  
2N1772A  
2N1774A  
2N1776A  
2N1777A  
47  
95  
V dc  
V dc  
V dc  
V dc  
V dc  
V
A
V
A
V
A
V
A
V
A
= 50 V dc  
V
D
= 100 V dc  
= 200 V dc  
= 300 V dc  
= 400 V dc  
190  
285  
380  
See footnote at end of table.  
7
MIL-PRF-19500/168E  
TABLE I. Group A inspection - Continued.  
Inspection 1/  
Subgroup 7  
MIL-STD-750  
Conditions  
Symbol  
Limits  
Unit  
Method  
4224  
Min  
Max  
Circuit commutated  
turn-off time  
T
t
= +145 C; I  
= 5 A pk;  
t
off  
°
C
TM  
= 100 s; d /d = 5 A/ s minimum;  
m
m
on  
i t  
reverse voltage at t = 2 V minimum;  
1
repetition rate = 1 Hz; d /d = 5 V/ s;  
m
v
t
gate bias conditions: gate source  
voltage = 0 V; gate source  
resistance = 100  
W
2N1771A  
2N1772A  
2N1774A  
2N1776A  
2N1777A  
30  
s
m
V
V
= V  
= 50 V(pk);  
= 50 V maximum  
DM  
DRM  
RRM  
V
V
= V  
= 100 V(pk);  
= 100 V maximum  
DM  
DRM  
30  
30  
s
m
RRM  
s
m
V
V
= V  
= 200 V(pk);  
= 200 V maximum  
DM  
DRM  
RRM  
30  
30  
s
m
V
V
= V  
= 300 V(pk);  
= 300 V maximum  
DM  
DRM  
RRM  
s
m
V
V
= V  
= 400 V(pk);  
= 400 V maximum  
DM  
DRM  
RRM  
Gate controlled  
turn-on time  
4223  
5
s
m
I
= 5 A dc; V  
= 10 V dc;  
t
on  
TM  
GG  
R = 50 ; t = 15 s;  
5
± m  
W
e
P1  
2 A/ s d /d 200 A/ s.  
m £  
£
t
m
i
2N1771A  
2N1772A  
2N1774A  
2N1776A  
2N1777A  
V
A
V
A
V
A
V
A
V
A
= V  
= V  
= V  
= V  
= V  
= 50 V(pk)  
= 100 V(pk)  
= 200 V(pk)  
= 300 V(pk)  
= 400 V(pk)  
DRM  
DRM  
DRM  
DRM  
DRM  
1/ For sampling plan, see MIL-PRF-19500.  
8
MIL-PRF-19500/168E  
TABLE II. Groups A, B, and C electrical end-point inspection measurements. 1/ 2/  
Step  
Inspection  
MIL-STD-750  
Conditions  
Symbol  
Limits  
Min Max  
Unit  
Method  
4211  
1.  
2.  
3.  
Reverse blocking  
cutoff current  
AC method, bias condition D;  
f = 60 Hz; V = rated (see 1.4.1).  
1
1
2
mA(pk)  
mA(pk)  
mA(pk)  
I
I
I
RRM1  
DRM1  
RRM2  
RRM  
Forward blocking  
current  
4206  
4211  
AC method, bias condition D;  
f = 60 Hz; V = rated (see 1.4.1).  
DRM  
Reverse blocking  
cutoff current  
AC method, bias condition D;  
T
= +125 C; f = 60 Hz;  
°
C
V
RRM  
= rated (see 1.4.1)  
4.  
Forward blocking  
current  
4206  
AC method; bias condition D;  
2
2
mA(pk)  
I
DRM2  
T
= +125 C; f = 60 Hz;  
°
C
V
DRM  
= rated (see 1.4.1)  
5.  
6.  
Gate trigger voltage  
and current  
4221  
4226  
V dc  
V
V = V = 6 V dc;  
GT1  
2
D
R = 50 ; R = 20 maximum  
W
W
L
e
15  
mA dc  
V(pk)  
I
GT1  
Forward “on” voltage  
transfer ratio  
1.85  
I
= 14.8 A(pk) (pulse);  
V
TM  
TM  
pulse width = 8.5 ms maximum;  
duty cycle = 2 percent maximum  
1/ The electrical measurements for appendix E, table VIb (JAN and JANTX) of MIL-PRF-19500 are as follows:  
Subgroups 2, 3, and 6, see table II herein, steps 1, 2, 3, 4, 5, and 6.  
2/ The electrical measurements for appendix E, table VII of MIL-PRF-19500 are as follows:  
Subgroups 2, 3, and 6, see table II herein, steps 1, 2, 3, 4, 5, and 6.  
9
MIL-PRF-19500/168E  
5. PACKAGING  
5.1 Packaging. Packaging shall prevent mechanical damage of the devices during shipping and handling and shall not be detrimental  
to the device. When actual packaging of material is to be performed by DoD personnel, these personnel need to contact the responsible  
packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points'  
packaging activity within the Military Department or Defense Agency, or within the Military Departments' System Command. Packaging  
data retrieval is available from the managing Military Departments' or Defense Agency's automated packaging files, CD-ROM products, or  
by contacting the responsible packaging activity.  
5.2 Marking. Unless otherwise specified (see 6.2), marking shall be in accordance with MIL-PRF-19500.  
6. NOTES  
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)  
6.1 Notes. The notes specified in MIL-PRF-19500 are applicable to this specification.  
6.2 Acquisition requirements. See MIL- PRF-19500.  
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of  
award of contract, qualified for inclusion in Qualified Products List QPL No.19500 whether or not such products have actually been so  
listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the  
products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded  
contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be  
obtained from Defense Supply Center Columbus, ATTN: DSCC-VQE, 3990 East Broad Street, Columbus, OH 43216-5000.  
6.4 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous  
issue due to the extent of the changes.  
Custodians:  
Army - CR  
Navy - EC  
Preparing activity:  
DLA - CC  
Air Force - 17  
(Project 5961- 1967)  
Review activities:  
Army - AV, MI  
Air Force - 19, 85, 99  
10  
STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL  
INSTRUCTIONS  
1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision  
letter should be given.  
2. The submitter of this form must complete blocks 4, 5, 6, and 7.  
3. The preparing activity must provide a reply within 30 days from receipt of the form.  
NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of  
requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to  
waive any portion of the referenced document(s) or to amend contractual requirements.  
I RECOMMEND A CHANGE:  
1. DOCUMENT NUMBER  
MIL-PRF-19500/168E  
2. DOCUMENT DATE (YYMMDD)  
981017  
3. DOCUMENT TITLE  
SEMICONDUCTOR DEVICE, THYRISTORS (CONTROLLED RECTIFIERS), SILICON, TYPES 2N1771A, 2N1772A, 2N1774A,  
2N1776A, 2N1777A, JAN, AND JANTX  
4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.)  
5. REASON FOR RECOMMENDATION  
6. SUBMITTER  
a. NAME (Last, First, Middle initial)  
b. ORGANIZATION  
d. TELEPHONE (Include Area Code)  
c. ADDRESS (Include Zip Code)  
Commercial  
DSN  
7. DATE SUBMITTED  
(YYMMDD)  
FAX  
EMAIL  
8. PREPARING ACTIVITY  
b. TELEPHONE  
Commercial  
a. Point of contact: Alan Barone  
DSN  
FAX  
EMAIL  
614-692-0510  
850-0510  
614-692-6939  
alan_barone@dscc.dla.mil  
c. Defense Supply Center Columbus, ATTN:  
DSCC-VAT, 3990 East Broad Street,  
Columbus, OH 43216-5000  
IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT:  
Defense Quality and Standardization Office  
5203 Leesburg Pike, Suite 1403, Falls Church, VA 22041-3466  
Telephone (703) 756-2340 DSN 289-2340  
DD Form 1426, OCT 89  
Previous editions are obsolete  
198/290  

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