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元器件品牌
510-83-179-18-112101
[PREDIP]
PGA / BGA / PLCC SOCKETS;
元器件型号：
510-83-179-18-112101
生产厂家：
PRECID-DIP DURTAL SA
描述和应用：
PGA / BGA / PLCC SOCKETS
PDF文件：
总4页 (文件大小：23K)
下载文档：
下载PDF数据表文档文件
型号参数：510-83-179-18-112101参数
查看货源
510-83-257-19-081101
PGA / BGA / PLCC SOCKETS
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PREDIP
510-87-179-18-112101
PGA / BGA / PLCC SOCKETS
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2
PREDIP
51089-1005
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 10 Circuits
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27
MOLEX
51089-1205
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 12Circuits
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16
MOLEX
51089-1405
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 14Circuits
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15
MOLEX
51089-1605
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 16Circuits
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20
MOLEX
51089-1805
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 18Circuits
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17
MOLEX
51089-2005
Assembly Item,
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0
MOLEX
51089-2205
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 22 Circuits
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11
MOLEX
51089-2405
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 24Circuits
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19
MOLEX
51089-2405
Assembly Item,
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0
MOLEX
51089-2605
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 26Circuits
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13
MOLEX
51089-2805
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 28Circuits
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19
MOLEX
51089-3005
2.00mm (.079") Pitch Mi II™ System Wire-to-Board Crimp Housing, Dual Row, 30Circuits
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20
MOLEX
51089-3005
Assembly Item,
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on line
156
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0
MOLEX
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