PR5301-TM [PREMA]

Sensor IC for Incremental Optical Encoders for resolutions of 50, 150 or 300 lpi;
PR5301-TM
型号: PR5301-TM
厂家: Prema    Prema
描述:

Sensor IC for Incremental Optical Encoders for resolutions of 50, 150 or 300 lpi

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Encoder IC PR5301-XX  
Sensor IC for Incremental Optical Encoders  
for resolutions of 50, 150 or 300 lpi  
FEATURES  
PR5301 is a sensor IC with A and B channel  
digital output.  
fixed resolutions of 50, 150 or 300 lpi  
small DFN package  
A and B channel digital output  
photodiodes with antireflective coating  
high sensitivity for low LED current  
best for red or near-infrared light  
It comes in a small DFN package for easy use in  
linear or rotary encoders.  
PR5301-050 for 50 lpi resolution  
PR5301-150 for 150 lpi resolution  
PR5301-300 for 300 lpi resolution  
BLOCK DIAGRAM  
PACKAGES  
The PR5301 is offered as bare die or in a tiny optical DFN package.  
a) IC as bare die – PR5301-XX-BD  
b) In optical DFN package - PR5301-XX-TM  
Encoder ICs can be delivered as bare dies  
(2,225 µm x 910 µm) on tested and inked  
wafers, or singulated dies on adhesive film  
PR5301-300-TM in ODFN-4L 1.8x2.9 package.  
© PREMA Semiconductor GmbH 2016 I rev. 4416 -- PRELIMINARY DATASHEET --  
Page 1/4  
Encoder IC PR5301-XX  
Electrical Characteristics  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Min  
-0.3  
-0.3  
Typ  
Max Units  
VCC (supply voltage)  
VPIN (voltage @ other pins)  
Operating Temperature  
14  
V
V
VCC+0.3  
PR5301-BD  
PR5301-TM  
-40  
-40  
85  
85  
°C  
°C  
Storage Temperature Range  
PR5301-BD  
PR5301-TM  
-55  
-40  
125  
100  
°C  
°C  
TJ (Junction Temperature)  
PR5201-BD/OC  
PR5201-CB/TM  
-40  
-40  
85  
85  
°C  
°C  
Electrostatic Discharge (ESD) Protection @ all pins  
4
kV  
OPERATING CHARACTERISTICS  
VCC = 5 V, TJ = -40...85°C (unless otherwise noted)  
Symbol  
Parameter  
Supply voltage  
Conditions  
Min  
Typ  
Max  
Units  
V
Vcc  
ICC  
3
6
Supply current (no load)  
digital outputs LO  
digital outputs HI  
Tj=27°C  
0.4  
0.4  
1.5  
1.5  
mA  
Digital outputs A, B, Z, C4, RL, Alarm  
fOUT  
Output frequency  
Saturation voltage LO  
Short-circuit current LO  
Saturation voltage HI  
Short-circuit current HI  
A, B  
300  
0.3  
26  
kHz  
V
VSat(Lo)  
ISC(Lo)  
I = 1.3 mA  
V = VCC  
1.8  
Vcc-1.2  
-28  
mA  
V
VSat(Hi)  
ISC(Hi)  
I = 1.3 mA  
V = 0 V  
-2  
mA  
Photosensors  
λar  
Spectral application range  
Peak sensitivity  
Se(λar)=0.25*λpeak  
500  
950  
nm  
nm  
λpeak  
800  
Test pins are used for chip test only. Their use is not further described in this document.  
© PREMA Semiconductor GmbH 2016 I rev. 4416 -- PRELIMINARY DATASHEET --  
Page 2/4  
Encoder IC PR5301-XX  
Photodiodes – Resolution and Size  
PR5301-050 for 50 lpi resolution  
The width of a photodiode for 50 dpi is 254 μm with  
a pitch of 381 μm.  
PR5301-150 for 150 lpi resolution  
The width of a photodiode for 150 dpi is 84.7 μm  
with a pitch of 127 μm.  
For all versions:  
Die size: 2,225 µm x 910 µm (measured  
between centres of scribe lane)  
A/B photodiodes track width: 280 µm  
Pad window: 120 µm x 120 µm  
PR5301-300 for 300 lpi resolution  
The width of a photodiode for 150 dpi is 42.3 μm  
with a pitch of 63.5 μm.  
PIN DESCRIPTION  
Left: ODFN-4L 1.8x2.9 package (top view)  
Pin No Pin Name  
Pin Function Description  
negative supply voltage  
B channel digital output  
B channel digital output  
positive supply voltage  
1
Vee  
B
2
3
4
A
Vcc  
Test pins are for chip test only and not described in  
this document.  
Chip centre may be offset by up to 250 µm  
from package centre in any direction.  
© PREMA Semiconductor GmbH 2016 I rev. 4416 -- PRELIMINARY DATASHEET --  
Page 3/4  
Encoder IC PR5301-XX  
PR5301-XX-TM - Package Dimensions  
ODFN-4L-1.8x2.9 PACKAGE  
A lead-free solder profile with a peak tempera-  
ture of 260°C or less, according to J-STD-020  
should be followed.  
Samples shipped without moisture barrier bag  
must be dry-baked according to JEDEC guide-  
lines before soldering. Manual soldering may  
not be possible or must be done with utmost  
care.  
Direct infrared heating should be avoided; pure  
convection heating is recommended. There is  
no experience with gas phase soldering.  
PRELIMINARY DATASHEET - DATA MAY CHANGE WITHOUT NOTICE  
Disclaimer  
Information provided by PREMA is believed to be accurate and correct. However, no responsibility is assumed by  
PREMA for its use, nor for any infringements of patents or other rights of third parties which may result from its  
use. PREMA reserves the right at any time without notice to change circuitry and specifications.  
Life Support Policy  
PREMA Semiconductors products are not authorized for use as critical components in life support devices or  
systems without the express written approval of PREMA Semiconductor. As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,  
or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for  
use provided in the labeling, can be reasonably expected to result in a significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.  
PREMA Semiconductor GmbH  
Robert-Bosch-Str. 6  
55129 Mainz Germany  
Phone: +49-6131-5062-0  
Fax: +49-6131-5062-220  
Email: prema@prema.com Web site: www.prema.com  
© PREMA Semiconductor GmbH 2016 I rev. 4416 -- PRELIMINARY DATASHEET --  
Page 4/4  

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