LC0402FC15C-LF-T710-2 [PROTEC]
Trans Voltage Suppressor Diode, 200W, 15V V(RWM), Bidirectional, 1 Element, Silicon, ROHS COMPLIANT, FLIP CHIP-2;
| 型号： | LC0402FC15C-LF-T710-2 |
| 厂家： | 
PROTEK DEVICES |
| 描述： | Trans Voltage Suppressor Diode, 200W, 15V V(RWM), Bidirectional, 1 Element, Silicon, ROHS COMPLIANT, FLIP CHIP-2 局域网 二极管 |
| 文件： | 总5页 (文件大小：74K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LC0402FC3.3C
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LC0402FC36C
LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ Personal Digital Assistant (PDA)
✔ Notebook Computers
✔ SMART Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
0402
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Voltages Ranging From 3.3V to 36V
✔ 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Low Clamping Voltage
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 Line
✔ Low Capacitance
✔ Low Leakage Current
✔ RoHS Compliant
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0402
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Lead-Free Plating
✔ Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Consult Factory for Leaded Device Availability
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
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LC0402FC36C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
UNITS
Watts
°C
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
PPP
TA
200
-55 to 150
-55 to 150
Storage Temperature
TSTG
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
TYPICAL
CAPACITANCE
(See Fig. 2)
(See Fig. 2)
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
@VWM
ID
µA
@0V, 1 MHz
VWM
VOLTS
@8/20µs
VC @ IPP
C
pF
LC0402FC3.3C
LC0402FC05C
LC0402FC08C
LC0402FC12C
LC0402FC15C
LC0402FC24C
LC0402FC36C
3.3
5.9
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
80.0V @ 2.5A
75*
10**
1
1
1
70
35
32
30
25
20
18
11.0
13.2
19.8
25.4
37.2
70.0
1
1
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
FIGURE 1
FIGURE 2
PEAK PULSE POWER VS PULSE TIME
PULSE WAVE FORM
120
100
10,000
TEST
tf
WAVEFORM
PARAMETERS
tf = 8µs
Peak Value IPP
1,000
80
60
40
td = 20µs
e-t
200W, 8/20µs Waveform
100
td = t
IPP/2
20
10
0.01
0
0
1
10
100
1,000
10,000
5
10
15
20
25
30
td - Pulse Duration - µs
t - Time - µs
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LC0402FC36C
GRAPHS
FIGURE 3
POWER DERATING CURVE
100
80
Peak Pulse Power
8/20µs
60
40
20
0
Average Power
0
25
50
75
100
125 150
TA - Ambient Temperature - °C
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR LC0402FC05C
35
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0402FC05C
14
12
10
8
6
4
2
0
0
5
10
15
20
IPP - Peak Pulse Current - Amps
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LC0402FC36C
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
0.275mm
Round
Pad Definition
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
0.330mm Round
No Clean
Pad Protective Finish
OSP(Entek Cu Plus 106A)
50µm
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
20µm
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
60 Seconds
270°C
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
REQUIREMENTS
Non-Solder Mask Defined Pad
0.275mm DIA.
Temperature:
TP for Lead-Free (SnAgCu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
Ramp-up
Ramp-down
T
L
TSMAX
155°
TSMIN
140°
TS - Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
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LC0402FC36C
0402 PACKAGE OUTLINE & DIMENSIONS
PACKAGE DIMENSIONS
PACKAGE OUTLINE
MILLIMETERS
DIM
INCHES
A
B
C
D
E
F
0.46 NOM
0.86 NOM
0.99 0.0254
0.10 NOM
0.35 NOM
0.483 0.0254
0.20 NOM
0.127 MAX
0.076 MIN
0.406 NOM
0.018 NOM
0.034 NOM
0.039 0.001
0.004 NOM
0.014 NOM
0.019 0.001
0.008 NOM
0.005 MAX
TOP
B
C
A
G
H
0.003 MIN
0.016 NOM
D
I
E
F
NOTES:
H
I
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002”).
3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”).
END
MOUNTING PAD
PAD DIMENSIONS
DIM
INCHES
MILLIMETERS
C
A
B
A
B
C
D
E
F
G
H
I
0.23
0.48
0.69
0.46
0.99
0.20
0.20
0.66
0.13
0.009
0.019
0.027
0.018
0.039
0.008
0.008
0.026
0.005
D
SOLDER
BUMP
F
DIE
E
H
NOTE:
1. Top view of tape. Metal contacts are face down in tape package.
TAPE & REELORIENTATION
SOLDER PRINT
DIAMETER 0.010 - 0.012
G
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., LC0402FC05C-T75-1).
3. 8mm Paper Tape: 7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., LC0402FC05C-T710-2).
4. Suffix - LF = Lead-Free, i.e., LC0402FC05C-LF-T75-1.
Single Die - 0402
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev 3 - 11/02, 06001
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia.
Tape Width
8mm
A0
B0
K0
D
E
F
W
P0
P2
P
tmax
0.25
1.75 0.10
178mm (7”)/330mm(13”)
0.80 0.10 1.20 0.10 0.70 0.10 1.50 0.10
3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 2.00 0.10
P0
10 Pitches Cumulative
Tolerance on Tape. ± 0.2
P2
D
t
E
F
Top cover tape
A0
W
K0
B0
P
User Direction of Feed
ProTek Devices
COPYRIGHT © ProTek Devices 2007
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
2929 South Fair Lane, Tempe,AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s
and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
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