LC0408FC08C-T75-2 [PROTEC]
Trans Voltage Suppressor Diode, 200W, 8V V(RWM), Bidirectional, 8 Element, Silicon, FLIP CHIP-8;![LC0408FC08C-T75-2](http://pdffile.icpdf.com/pdf2/p00237/img/icpdf/LC0408FC15C-_1387639_icpdf.jpg)
型号: | LC0408FC08C-T75-2 |
厂家: | ![]() |
描述: | Trans Voltage Suppressor Diode, 200W, 8V V(RWM), Bidirectional, 8 Element, Silicon, FLIP CHIP-8 |
文件: | 总6页 (文件大小:79K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LC0408FC3.3C
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LC0408FC36C
LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ Personal Digital Assistant (PDA)
✔ Notebook Computers
✔ SMART Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
0402 CHIP SHOWN
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Voltages Ranging From 3.3V to 36V
✔ 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Low Clamping Voltage
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 4 to 7 Lines
✔ Low Capacitance
✔ Low Leakage Current
✔ RoHS Compliant
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0408
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Lead-Free Plating
✔ Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Consult Factory for Leaded Device Availability
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
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LC0408FC36C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
UNITS
Watts
°C
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
PPP
TA
200
-55 to 150
-55 to 150
Storage Temperature
TSTG
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
TYPICAL
CAPACITANCE
(See Fig. 2)
(See Fig. 2)
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
@VWM
ID
µA
@0V, 1 MHz
VWM
VOLTS
@8/20µs
VC @ IPP
C
pF
LC0408FC3.3C
LC0408FC05C
LC0408FC08C
LC0408FC12C
LC0408FC15C
LC0408FC24C
LC0408FC36C
3.3
5.9
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
80.0V @ 2.5A
75*
10**
1
1
1
70
35
32
30
25
20
18
11.0
13.2
19.8
25.4
37.2
70.0
1
1
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
FIGURE 1
FIGURE 2
PEAK PULSE POWER VS PULSE TIME
PULSE WAVE FORM
120
100
10,000
TEST
tf
WAVEFORM
PARAMETERS
tf = 8µs
Peak Value IPP
1,000
80
60
40
td = 20µs
e-t
200W, 8/20µs Waveform
100
td = t
IPP/2
20
10
0.01
0
0
1
10
100
1,000
10,000
5
10
15
20
25
30
td - Pulse Duration - µs
t - Time - µs
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LC0408FC36C
GRAPHS
FIGURE 3
POWER DERATING CURVE
100
80
Peak Pulse Power
8/20µs
60
40
20
0
Average Power
0
25
50
75
100
125 150
TA - Ambient Temperature - °C
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR LC0408FC05C
35
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0408FC05C
14
12
10
8
6
4
2
0
0
5
10
15
20
IPP - Peak Pulse Current - Amps
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LC0408FC36C
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
0.275mm
Round
Pad Definition
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
0.330mm Round
No Clean
Pad Protective Finish
OSP(Entek Cu Plus 106A)
50µm
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
20µm
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
60 Seconds
270°C
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
REQUIREMENTS
Non-Solder Mask Defined Pad
0.275mm DIA.
Temperature:
TP for Lead-Free (SnAgCu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
Ramp-up
Ramp-down
T
L
TSMAX
155°
TSMIN
140°
TS - Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
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LC0408FC36C
0408 PACKAGE OUTLINE & DIMENSIONS
PACKAGE DIMENSIONS
PACKAGE OUTLINE
MILLIMETERS
DIM
INCHES
A
B
C
E
F
0.56 NOM
0.86 NOM
0.99 0.0254
0.15 SQ
0.022 NOM
0.034 NOM
0.039 0.001
0.006 SQ
2.0 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
0.406 NOM
0.079 0.001
0.006 NOM
0.005 MAX
0.003 MIN
TOP
G
H
I
0.016 NOM
E
NOTES:
F
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx 0.05mm ( 0.002”).
H
END
I
MOUNTING PAD LAYOUT - Option 1
PAD DIMENSIONS
MILLIMETERS
DIM
INCHES
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.020
0.012
0.018
0.008
0.006 SQ
0.028
D
A
C
DIE
SOLDER
BUMP
0.99
0.51
0.039
0.020
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
I
SOLDER PADS
SOLDER PRINT 0.010” - 0.012” DIA.
SOLDER
MASK
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LC0408FC36C
0408 PACKAGE OUTLINE & DIMENSIONS
PACKAGE DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
MILLIMETERS
DIM
INCHES
A
F
G
H
I
0.51
0.15 SQ
0.71
0.020
0.006 SQ
0.028
COPPER CONTACT 0.009” [0.23] DIA.
A
0.99
0.039
DIE
SOLDER
BUMP
0.51
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline:
.xxx 0.05mm ( 0.002”).
3. Preferred: Using 0.1mm (0.004”) stencil.
I
TAPE & REEL ORIENTATION
SOLDER PRINT 0.014” [0.36] DIA.
SOLDER
MASK
Quad Die - 0408
NOTE:
1. Top view of tape. Solder bumps are facedown in tape
package.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. OrderingSuffix: -T75-1, i.e., LC0408FC05C-T75-1.
3. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2, i.e., LC0408FC05C-T75-2.
4. Suffix - LF = Lead-Free, i.e., LC0408FC05C-LF-T75-1.
Outline & Dimensions: Rev 4 - 2/04, 06021
ProTek Devices
COPYRIGHT © ProTek Devices 2007
2929 South Fair Lane, Tempe,AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s
and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
Web Site: www.protekdevices.com
05153.R7 2/07
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